Patents by Inventor Hitoshi Nosaka

Hitoshi Nosaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing semiconductor device and method of treating electrical connection section
    Patent number: 7608479
    Abstract: A method of manufacturing a semiconductor device includes: applying a paste containing acid to an electrical connection section which is electrically connected with a semiconductor substrate; removing the paste from the electrical connection section by washing the electrical connection section; and providing a conductive material to the electrical connection section.
    Type: Grant
    Filed: January 17, 2006
    Date of Patent: October 27, 2009
    Assignee: Seiko Epson Corporation
    Inventors: Hirohisa Nakayama, Shiro Sato, Masanobu Shoji, Hitoshi Nosaka
  • Method of manufacturing semiconductor device and method of treating electrical connection section
    Publication number: 20060160347
    Abstract: A method of manufacturing a semiconductor device includes: applying a paste containing acid to an electrical connection section which is electrically connected with a semiconductor substrate; removing the paste from the electrical connection section by washing the electrical connection section; and providing a conductive material to the electrical connection section.
    Type: Application
    Filed: January 17, 2006
    Publication date: July 20, 2006
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Hirohisa Nakayama, Shiro Sato, Masanobu Shoji, Hitoshi Nosaka
  • Wire bonding method and wire bonding apparatus
    Patent number: 7017794
    Abstract: A highly reliable bonding process is provided. The wire bonding method includes: (a) bonding a tip portion of a wire to a first electrode by pressing an open end section of a first hole of a first tool against the tip portion of the wire that is passed through the first hole and protrudes outside the first hole, and (b) bonding a part of a section of the wire that is lead out from the first electrode to a second electrode. The first tool is passed through a second hole of a second tool. The width of an open end section of the second hole is formed greater than the width of the open end section of the first hole. The step (b) is conducted by pressing the open end section of the second hole against the part of the wire.
    Type: Grant
    Filed: January 13, 2004
    Date of Patent: March 28, 2006
    Assignee: Seiko Epson Corporation
    Inventor: Hitoshi Nosaka
  • Wire bonding method and wire bonding apparatus
    Publication number: 20040188499
    Abstract: A highly reliable bonding process is provided. The wire bonding method includes: (a) bonding a tip portion of a wire to a first electrode by pressing an open end section of a first hole of a first tool against the tip portion of the wire that is passed through the first hole and protrudes outside the first hole, and (b) bonding a part of a section of the wire that is lead out from the first electrode to a second electrode. The first tool is passed through a second hole of a second tool. The width of an open end section of the second hole is formed greater than the width of the open end section of the first hole. The step (b) is conducted by pressing the open end section of the second hole against the part of the wire.
    Type: Application
    Filed: January 13, 2004
    Publication date: September 30, 2004
    Inventor: Hitoshi Nosaka