Abstract: An assist control device controls an electric motor assisting traveling of a mobile object. The assist control device includes an operating switch and a control part. The operating switch is configured to be turned on when operated by a user. The operating switch is configured to be turned off when released from being operated by the user. The control part controls the electric motor to output an assist force when the operating switch is turned on.

Abstract: Compositions comprising methionine, threonine, and a pharmacologically acceptable iron compound as active ingredients are effective for improving or preventing iron deficiency anemia and can be ingested easily and exhibit effects from an early stage.

Abstract: An adhesive sheet having a substrate and an adhesive layer laminated on one or both surfaces of the substrate, and which has an anti-static performance, is described. At least one of the adhesive layers contains an adhesive and a compound (1) represented by the following formula (1), and contains the compound (1) in an amount of from 0.1 to 100 parts by mass on the basis of 100 parts by mass of the adhesive. In the formula, R1 is a (meth)acryloyl group; R2 is a C1-4 alkylene group; and n is an integer of from 1 to 20, such as 4 to 16.

Abstract: An object of the present invention is to provide a treating method for brittle member capable of stably holding the brittle member when applying predetermined treatments such as transportation and grinding back surface of a brittle member such as a semi-conductor wafer and separating the brittle member without breakage after finishing required treatment to thereby attaining high thickness accuracy of the brittle member. A treating method for brittle member comprising: a step of removably fixing a brittle member on a flexible glass base plate, a step of treating said brittle member, a step of fixing said brittle member side by holding means, and a step of separating said flexible glass base plate from said brittle member by bending said flexible glass base plate.

Abstract: The apparatus forms an electric circuit on a construction member of a machine based on a set of three-dimensional data. The data defines a position and a profile of the construction member, a position of the electric circuit, and a shape of the electric circuit. The electric circuit is used for electrical connection between electric instruments mounted on the machine. The data is associated with a reference coordinate system provided in the machine, and the data includes coordinates of points for determining arrangement of the electric circuit, a distance between any two of the points adjacent to each other, and a cross-sectional area of the electric circuit associated extended between the two points.

Abstract: An object of the present invention is to provide a treating method for brittle member capable of stably holding the brittle member when applying predetermined treatments such as transportation and grinding back surface of a brittle member such as a semi-conductor wafer and separating the brittle member without breakage after finishing required treatment to thereby attaining high thickness accuracy of the brittle member. A treating method for brittle member comprising: a step of removably fixing a brittle member on a flexible glass base plate, a step of treating said brittle member, a step of fixing said brittle member side by holding means, and a step of separating said flexible glass base plate from said brittle member by bending said flexible glass base plate.

Abstract: It is an object of the present invention to provide a surface protective sheet and a method for grinding a semiconductor wafer, by the use of which any dimple is not formed, nor occurs breakage and fouling of a wafer even when a wafer having high bumps which are highly densely arranged is ground to an extremely small thickness, and besides, no adhesive is left at the roots of the bumps after the surface protective sheet is peeled. The surface protective sheet of the invention is used for grinding a back surface of a semiconductor wafer, and in the surface protective sheet, one surface of a base sheet is provided with an opening portion having a diameter smaller than an outer diameter of a semiconductor wafer to be stuck, on said opening portion no adhesive layer being formed, and a portion which is provided around the opening portion and on which an adhesive layer is formed.

Abstract: An adhesive sheet has a substrate and an adhesive layer laminated on one or both surfaces of the substrate, and has an anti-static performance. At least one of the adhesive layers contains an adhesive and a compound (1) represented by the following formula (1), and contains the compound (1) in an amount of from 0.1 to 100 parts by mass on the basis of 100 parts by mass of the adhesive. In the formula, R1 is a (meth)acryloyl group; R2 is a C1-4 alkylene group; and n is an integer of from 1 to 20.

Abstract: A semiconductor wafer protection structure including a semiconductor wafer and a protective sheet overlaid on a circuit surface of the semiconductor wafer, wherein the protective sheet has a larger diameter than the outer diameter of the semiconductor wafer. Semiconductor wafer protection structures and methods, and laminated protective sheet for use therein are provided and enable prevention of damage to a wafer during grinding and transportation when the wafer is ground to an ultrathin thickness and transported. Also provided is a process for processing a semiconductor wafer whereby damage to the wafer can be reduced during application and cutting of an adhesive sheet.

Abstract: A pressure sensitive adhesive sheet to be used in producing an extremely thin semiconductor chip which is free of breakage and discoloration by a predicing process and a method of use thereof are provided. The pressure sensitive adhesive sheet is used in a method for producing a semiconductor chip, in which the method involves the steps of: forming a groove having depth smaller than thickness of a wafer on a surface of the wafer on which a semiconductor circuit is formed; reducing the thickness of the wafer and finally dividing the wafer into individual chips by grinding a back face of the wafer.

Abstract: It is an object of the present invention to provide a surface protective sheet and a method for grinding a semiconductor wafer, by the use of which any dimple is not formed, nor occurs breakage and fouling of a wafer even when a wafer having high bumps which are highly densely arranged is ground to an extremely small thickness, and besides, no adhesive is left at the roots of the bumps after the surface protective sheet is peeled. The surface protective sheet of the invention is used for grinding a back surface of a semiconductor wafer, and in the surface protective sheet, one surface of a base sheet is provided with an opening portion having a diameter smaller than an outer diameter of a semiconductor wafer to be stuck, on said opening portion no adhesive layer being formed, and a portion which is provided around the opening portion and on which an adhesive layer is formed.

Abstract: A method for producing a circuitry includes steps of providing first coordinate data of at least one of positions, shapes and intervals of patterns of a first circuit, and jetting droplets of molten metal on a substrate so as to form the first circuit based on the coordinate data.

Abstract: A semiconductor wafer protection structure including a semiconductor wafer and a protective sheet overlaid on a circuit surface of the semiconductor wafer, wherein the protective sheet has a larger diameter than the outer diameter of the semiconductor wafer. Semiconductor wafer protection structures and methods, and laminated protective sheet for use therein are provided and enable prevention of damage to a wafer during grinding and transportation when the wafer is ground to an ultrathin thickness and transported. Also provided is a process for processing a semiconductor wafer whereby damage to the wafer can be reduced during application and cutting of an adhesive sheet.

Abstract: A pressure sensitive adhesive sheet to be used in producing an extremely thin semiconductor chip which is free of breakage and discoloration by a predicing process and a method of use thereof are provided. The pressure sensitive adhesive sheet is used in a method for producing a semiconductor chip, in which the method involves the steps of: forming a groove having depth smaller than thickness of a wafer on a surface of the wafer on which a semiconductor circuit is formed; reducing the thickness of the wafer and finally dividing the wafer into individual chips by grinding a back face of the wafer.

Abstract: The invention is to offer a fuse and a fuse production method excellent in reducing manufacturing cost. A fuse having an electrically conductive fuse element. The fuse element has a pair of terminal connection portions and a fusible member for electrically connecting the terminal connection portions to each other and for being fused and broken when an overload electric current flows. At least a part of the fusible portion is formed by spouting or dropping the melting metal drops.

Abstract: A method for connecting conductive members includes a step of providing a first conductive member, a step of providing a second conductive member, and a step of jetting droplets of molten metal so as to form a connecting portion which electrically connects the first conductive member to the second conductive member.

Abstract: A switch assembly for a vehicle includes a stalk and a rotary switch. The stalk is fixed at one end to a steering column. The rotary switch is connected at one end to the other end of the stalk. The rotary switch is rotatable about a pivot axis normal to the other end of the stalk for switching between different rotary switch positions each associated with a respective vehicle control function. A rotatable knob may be connected to the other end of the rotary switch. The rotatable knob is rotatable about a rotational axis normal to the pivot axis of the rotary switch for switching between different rotatable knob positions each associated with a respective vehicle control function. The rotary switch may include control buttons each associated with a respective vehicle control function.

Abstract: A switch assembly for a vehicle includes a stalk and a rotary switch. The stalk is fixed at one end to a steering column. The rotary switch is connected at one end to the other end of the stalk. The rotary switch is rotatable about a pivot axis normal to the other end of the stalk for switching between different rotary switch positions each associated with a respective vehicle control function. A rotatable knob may be connected to the other end of the rotary switch. The rotatable knob is rotatable about a rotational axis normal to the pivot axis of the rotary switch for switching between different rotatable knob positions each associated with a respective vehicle control function. The rotary switch may include control buttons each associated with a respective vehicle control function.

Abstract: The invention is to offer a fuse and a fuse production method excellent in cost down. A fuse having an electrically conductive fuse element. The fuse element has a pair of terminal connection portions and a fusible member for electrically connecting the terminal connection portions each other and for being fused and broken when an over electric current flows. At least a part of the fusible portion is formed by spouting or dropping the melting metal drops.