Patents by Inventor Hnin Nway San Nang

Hnin Nway San Nang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package substrate unit and method for manufacturing package substrate unit
    Patent number: 8800142
    Abstract: A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts.
    Type: Grant
    Filed: February 8, 2011
    Date of Patent: August 12, 2014
    Assignee: Fujitsu Limited
    Inventors: Hnin Nway San Nang, Kazuya Arai, Kei Fukui, Shinpei Ikegami, Yasuhito Takahashi, Hideaki Yoshimura, Hitoshi Suzuki
  • Package substrate unit and method for manufacturing package substrate unit
    Publication number: 20120067635
    Abstract: A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts.
    Type: Application
    Filed: February 8, 2011
    Publication date: March 22, 2012
    Applicant: Fujitsu Limited
    Inventors: Hnin Nway San Nang, Kazuya Arai, Kei Fukui, Shinpei Ikegami, Yasuhito Takahashi, Hideaki Yoshimura, Hitoshi Suzuki