Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a first isolation structure over a first end of a fin. A gate structure is over the fin and is spaced apart from the first isolation structure along the direction. A second isolation structure is over a second end of the fin, the second end opposite the first end. The second isolation structure is spaced apart from the gate structure. The first isolation structure and the second isolation structure both comprise a first dielectric material laterally surrounding a recessed second dielectric material distinct from the first dielectric material. The recessed second dielectric material laterally surrounds at least a portion of a third dielectric material different from the first and second dielectric materials.

Abstract: Provided is a photocurable conductive black composition including: (a) at least one (meth)acrylate-functionalized urethane oligomer; (b) at least one photopolymerizable compound; (c) a photoinitiator; (d) a visible-light blocking system; (e) conductive fillers; and optionally (f) a thermal initiator. Also provided are a method for forming a cured product composed of the photocurable conductive black compositions, and an article comprising the cured product.

Abstract: An optical element including an optically transparent lens which defines a curved surface having a steepness given by an R/# of from about 0.5 to about 1.0. A film is positioned on the curved surface. The film includes an index layer. A composite layer is positioned on the curved surface having a refractive index greater than the index layer. The composite layer includes HfO2 and Al2O3. The composite layer has a mole fraction X of HfO2, wherein X is from about 0.05 to about 0.95 and a mole fraction of Al2O3 in the composite layer is 1?X.

Abstract: Embodiments of the present disclosure generally relate to methods for enhancing carbon hardmask to have improved etching selectivity and profile control. In some embodiments, a method of treating a carbon hardmask layer is provided and includes positioning a workpiece within a process region of a processing chamber, where the workpiece has a carbon hardmask layer disposed on or over an underlying layer, and treating the carbon hardmask layer by exposing the workpiece to a sequential infiltration synthesis (SIS) process to produce an aluminum oxide carbon hybrid hardmask which is denser than the carbon hardmask layer. The SIS process includes exposing and infiltrating the carbon hardmask layer with an aluminum precursor, purging to remove gaseous remnants, exposing and infiltrating the carbon hardmask layer to an oxidizing agent to produce an aluminum oxide coating disposed on inner surfaces of the carbon hardmask layer, and purging the process region to remove gaseous remnants.

Abstract: Embodiments of the present disclosure generally relate to methods for enhancing carbon hardmask to have improved etching selectivity and profile control. In some embodiments, a method of treating a carbon hardmask layer is provided and includes positioning a workpiece within a process region of a processing chamber, where the workpiece has a carbon hardmask layer disposed on or over an underlying layer, and treating the carbon hardmask layer by exposing the workpiece to a sequential infiltration synthesis (SIS) process to produce an aluminum oxide carbon hybrid hardmask which is denser than the carbon hardmask layer. The SIS process includes exposing and infiltrating the carbon hardmask layer with an aluminum precursor, purging to remove gaseous remnants, exposing and infiltrating the carbon hardmask layer to an oxidizing agent to produce an aluminum oxide coating disposed on inner surfaces of the carbon hardmask layer, and purging the process region to remove gaseous remnants.

Abstract: Embodiments of the present disclosure generally relate to methods for enhancing carbon hardmask to have improved etching selectivity and profile control. In some embodiments, a method of treating a carbon hardmask layer is provided and includes positioning a workpiece within a process region of a processing chamber, where the workpiece has a carbon hardmask layer disposed on or over an underlying layer, and treating the carbon hardmask layer by exposing the workpiece to a sequential infiltration synthesis (SIS) process to produce an aluminum oxide carbon hybrid hardmask which is denser than the carbon hardmask layer. The SIS process includes exposing and infiltrating the carbon hardmask layer with an aluminum precursor, purging to remove gaseous remnants, exposing and infiltrating the carbon hardmask layer to an oxidizing agent to produce an aluminum oxide coating disposed on inner surfaces of the carbon hardmask layer, and purging the process region to remove gaseous remnants.

Abstract: A semiconductor package includes a first die having a first surface, a first conductive bump over the first surface and having first height and a first width, a second conductive bump over the first surface and having a second height and a second width. The first width is greater than the second width and the first height is substantially identical to the second height. A method for manufacturing the semiconductor package is also provided.

Abstract: A collecting system is provided that can include a probe configured to collect pathogens from a surrounding fluid, an elution chamber containing a liquid solvent and configured to receive the probe to elute the pathogens collected on the probe using the liquid solvent, and a heater configured to lyse the pathogens to release the genetic material of the pathogens into the liquid solvent.

Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a first isolation structure over a first end of a fin. A gate structure is over the fin and is spaced apart from the first isolation structure along the direction. A second isolation structure is over a second end of the fin, the second end opposite the first end. The second isolation structure is spaced apart from the gate structure. The first isolation structure and the second isolation structure both comprise a first dielectric material laterally surrounding a recessed second dielectric material distinct from the first dielectric material. The recessed second dielectric material laterally surrounds at least a portion of a third dielectric material different from the first and second dielectric materials.

Abstract: Aspects described herein relate to receiving, from a network node, an indication of information related to a configuration, including at least one of a modulation and coding scheme (MCS), a physical downlink shared channel (PDSCH) duration, a scrambling sequence, or a reference signal location, used for transmitting downlink signals to one or more co-scheduled UEs, receiving, from the network node, a downlink signal intended for the UE, wherein the signal is interfered by one or more interference signals transmitted to the one or more co-scheduled UEs, and removing, based on the indication, the one or more interference signals from the downlink signal. Other aspects relate to transmitting the information and downlink signals.

Abstract: The present invention relates to a composition comprising an amino acid-modified polymer, a carboxypolysaccharide, and may further include a metal ion for anti-adhesion and vector application. More specifically, the invention relates to a thermosensitive composition having enhanced mechanical and improved water-erosion resistant properties for efficiently preventing tissue adhesions and can serve as a vector with bio-compatible, bio-degradable/absorbable, and in-vivo sustainable properties.

Abstract: A voltage tracking circuit is provided. The voltage tracking circuit includes first and second P-type transistors and a control circuit. The drain of the first P-type transistor is coupled to a first voltage terminal. The gate and the drain of the second P-type transistor are respectively coupled to the first voltage terminal and a second voltage terminal. The control circuit is coupled to the first and second voltage terminals and generates a control voltage according to the first voltage and the second voltage. The sources of the first and second P-type transistors are coupled to an output terminal of the voltage tracking circuit, and the output voltage is generated at the output terminal. In response to the second voltage being higher than the first voltage, the control circuit generates the control signal to turn off the first P-type transistor.

Abstract: Synthetic amino acid-modified polymers and methods of making the same and using the same are disclosed. The synthetic amino acid-modified polymers possess distinct thermosensitive, improved water-erosion resistant, and enhanced mechanical properties, and are suitable of reducing or preventing formation of postoperative tissue adhesions. Additionally, the amino acid-modified polymers can also be used as a vector to deliver pharmaceutically active agents.

Abstract: The disclosure provides a control method of a display driver. The control method includes receiving address information and defining an IC address according to the address information. The IC address includes n bits representing k zones, and n and k are positive integers. The control method further includes receiving the IC address, a black frame data signal and a pulse-width modulation (PWM) signal, and turning on or off the plurality of LEDs in the corresponding zone according to toggle of bit in the black frame data signal. Each bit in the black frame data signal indicates that a plurality of LEDs in a zone among the k zones are turned on or off.

Abstract: A compound of Formula (I), or a pharmaceutically acceptable salt thereof, is provided that has been shown to be useful for treating a PRC2-mediated disease or disorder: wherein R1, R2, R3, R4, R5, and n are as defined herein.

Abstract: Exemplary methods of semiconductor processing may include forming a layer of silicon-containing material on a semiconductor substrate. The methods may include performing a post-formation treatment on the layer of silicon-containing material to yield a treated layer of silicon-containing material. The methods may include contacting the treated layer of silicon-containing material with an adhesion agent. The methods may include forming a layer of a resist material on the treated layer of silicon-containing material.

Abstract: A system includes one or more data processors configured to run a basic input/output system (BIOS) service and a bootloader configuration manager for tuning kernel parameters. The system further includes a non-transitory computer-readable storage medium containing instructions which, when executed on the one or more data processors, cause the one or more data processors to perform operations. The operations include receiving administrative inputs and checking the administrative inputs against a checklist to determine whether any errors are introduced by the administrative inputs. The operations further include writing the administrative inputs to a temporal configuration file in response to no errors being introduced by the administrative inputs. The operations further include exporting the temporal configuration file to a designated output path. The exported temporal configuration file includes kernel parameter settings for configuring a bootloader of a computing device.

Abstract: An inductor device includes a hollow magnetic core and at least one winding assembly. The winding assembly includes a plurality of conductive structures and U-shaped conductors, and the conductive structures are below the hollow magnetic core. The conductive structures are arranged along a segment of the hollow magnetic core, and the U-shaped conductors are across the hollow magnetic core and arranged along the segment of the hollow magnetic core. Two ends of at least one of the U-shaped conductor are respectively in contact with two of the conductive structures such that the U-shaped conductors and the conductive structures are electrically connected to each other and collectively continuously surround the segment of the hollow magnetic core.

Abstract: An unmanned aerial vehicle and a landing method for unmanned aerial vehicle are provided. The unmanned aerial vehicle includes a positioning device and a processor. When the processor detects a fight status of the unmanned aerial vehicle, the processor obtains a current coordinate from the positioning device. According to the current coordinate, a predetermined route, and a plurality of emergency landing coordinates, the processor calculates a plurality of distances for the unmanned aerial vehicle moving from the current coordinate to each of the emergency landing coordinates along the predetermined route. According to a shortest distance among the plurality of distances, the processor obtains a target emergency landing coordinate. The processor controls the unmanned aerial vehicle to move to the target emergency landing coordinate along the predetermined route.

Abstract: The present disclosure provides a driving circuit, configured to couple to a light emitting diode (LED) and a power supply circuit. The driving circuit includes a comparator, a serial input interface, and an integrating unit. The comparator is configured to couple to the LED and determine whether a cathode voltage of the LED is lower than a threshold value and generate a monitoring data. The serial input interface is configured to receive a serial input data from a previous driving circuit. The integrating unit is coupled to the comparator and the serial input interface and configured to integrate the monitoring data and the serial input data to generate an output data. The output data is transmitted to a following driving circuit or feedbacked to the power supply circuit in order to modulate a power voltage that the power circuit provides to the LED.