Abstract: An electric car charging apparatus using a pad-mounted transformer according to one embodiment of the present invention may include a first port configured to supply power to an electric car, a second port electrically connected to the first port and configured to receive power from a pad-mounted transformer, and a breaking unit configured to switch between connection and disconnection of the first port and the second port.

Abstract: Disclosed herein is a camera module including: a lens part including a lens; a housing having the lens part coupled thereto; a bracket coupled to the housing; and a shaft mounted in the bracket and driving the lens part and the housing.

Abstract: Disclosed herein is a camera module including: a lens part including a lens; a housing having the lens part coupled thereto; a bracket coupled to the housing; and a shaft mounted in the bracket and driving the lens part and the housing.

Abstract: A camera module package is disclosed. The camera module package is capable of preventing defects caused by foreign bodies and enhancing product reliability by reducing the time consumed in a packaging process for manufacturing a camera module, and of reducing the size of a package and manufacturing costs by excluding the use of gold wires.

Abstract: The present invention relates to a method of manufacturing an image sensor module including attaching an image sensor on one side of a double-sided flexible printing circuit board (FPCB) provided with a window such that the image sensor module covers the window; and mounting at least one electric part on the other side of the double-sided FPCB on which the image sensor is attached.

Abstract: A image sensor module having a double-sided flexible printing circuit board (FPCB) having a window formed; an image sensor attached on one side of the double-sided FPCB so as to cover the window; and at least one electric part attached on the other side of the double-sided FPCB having the image sensor attached thereto.

Abstract: A camera module package is disclosed. The camera module package is capable of preventing defects caused by foreign bodies and enhancing product reliability by reducing the time consumed in a packaging process for manufacturing a camera module, and of reducing the size of a package and manufacturing costs by excluding the use of gold wires.

Abstract: A camera module having a housing; a lens section mounted in the housing; an IR cut filter mounted in the housing so as to cut infrared rays from the incident light passing through the lens section; and an image sensor module composed of a double-sided flexible printing circuit board (FPCB) in which a window for transmitting the incident light passing through the IR cut filter is formed, an image sensor which is attached on one side of the double-sided FPCB so as to cover the window; and at least one electric part which is attached on the other side of the double-sided FPCB having the image sensor attached thereto, the image sensor module being coupled to the housing.

Abstract: Disclosed herein is a device and method for automatically controlling continuous auto focus. The device includes a lens unit installed in a camera module, and configured to receive images of an external subject; a lens actuation unit for moving the lens unit along an optical axis so as to focus on a subject; an image sensor for receiving the external images, converting the external images into image signals, and outputting the image signals; a computation unit for detecting focus values and feature parameters; a mode determination unit for automatically performing switching between general mode, specific mode and tracking mode, setting the mode, and automatically setting a fixed or variable window according to the set mode using the detected feature parameters; and a lens control unit for generating a control signal for controlling the lens actuation unit so as to perform continuous auto focus according to the detected focus values.

Abstract: An apparatus for correcting motion caused by hand shake performs hand shake correction in due consideration of both linear motion and rotation by detecting linear motion of a capturing device by comparing preceding and subsequent image frames and detecting rotation of the capturing device using a gyro sensor. The apparatus for correcting motion caused by hand shake may include a rotation detection unit detecting the amount of rotation of a capturing device by using a gyro sensor, a linear-motion detection unit comparing preceding and subsequent image frames generated by an image sensor unit to detect the amount of linear motion of the capturing device, and an output image determination unit correcting the detected amount of rotation and the detected amount of linear motion in an image frame input from the image sensor to generate a corrected output image frame.

Abstract: Provided is an optical sensor module including a printed circuit board (PCB) having a pad with a perforated portion formed in the central portion thereof; a lens disposed on the top surface of the pad so as to cover the perforated portion; one or more light sources disposed around the lens; an image sensor closely attached to the bottom surface of the pad; and a housing mounted to surround the outer periphery of the image sensor, the housing having the same height as that of the image sensor and the same size as that of the pad.

Abstract: Disclosed herein is a camera module for mobile communication terminals. The module comprises an image capture device unit for focusing an image of a subject, a LED (light emitting diode) unit for emitting light to the subject, a FPC (flexible printed circuit) electrically connected between the image capture device unit and the LED unit, and a connector unit for applying an electric signal to the image capture device unit.

Abstract: Provided is an optical sensor module including a printed circuit board (PCB) having a pad with a perforated portion formed in the central portion thereof; a lens disposed on the top surface of the pad so as to cover the perforated portion; one or more light sources disposed around the lens; an image sensor closely attached to the bottom surface of the pad; and a housing mounted to surround the outer periphery of the image sensor, the housing having the same height as that of the image sensor and the same size as that of the pad.

Abstract: Disclosed is a method for packaging a pickup device, which is used for a digital optical instrument, and particularly a method for fabricating an image sensor module connected to a flexible PCB. The method according to the invention includes the steps of forming a printed circuit of a predetermined pattern on an upper surface of a transparent medium, forming a first bump and a second bump on the upper surface of the transparent medium, first bonding the first bump with a pattern of an image chip so as to be electrically connected to each other, secondly bonding the second bump with a circuit of a flexible PCB so as to be electrically connected to each other, and molding a rear surface of the flexible PCB, on which an image chip is mounted, by means of epoxy resin. The method according to the invention provides an effect of reducing weight, thickness, length and size of the module in comparison with the module fabricated under the conventional wire bonding method.

Abstract: Disclosed is a camera module and method of fabricating the same. The camera module in which an image sensor and an image signal processor are mounted on any one side of a substrate, comprises the substrate on which a copper layer is formed, and a bonding pad part formed on the copper layer and including a gold-plated layer with a same thickness. A print solder resister layer is formed around the bonding pad part and removed by an area corresponding to the bonding pad part on which the image signal processor is mounted. The image sensor and the image signal processor are bonded to the bonding pad part.

Abstract: Disclosed herein is a camera module for mobile communication terminals. The module comprises an image capture device unit for focusing an image of a subject, a LED (light emitting diode) unit for emitting light to the subject, a FPC (flexible printed circuit) electrically connected between the image capture device unit and the LED unit, and a connector unit for applying an electric signal to the image capture device unit.

Abstract: Disclosed is a method for packaging a pickup device, which is used for a digital optical instrument, and particularly a method for fabricating an image sensor module connected to a flexible PCB. The method according to the invention includes the steps of forming a printed circuit of a predetermined pattern on an upper surface of a transparent medium, forming a first bump and a second bump on the upper surface of the transparent medium, first bonding the first bump with a pattern of an image chip so as to be electrically connected to each other, secondly bonding the second bump with a circuit of a flexible PCB so as to be electrically connected to each other, and molding a rear surface of the flexible PCB, on which an image chip is mounted, by means of epoxy resin. The method according to the invention provides an effect of reducing weight, thickness, length and size of the module in comparison with the module fabricated under the conventional wire bonding method.