Abstract: A resistive overlay-type touch sensor for a touch screen panel and a method for fabricating the same are provided, in which a plurality of first substrates are extended in parallel along a first direction, a plurality of second substrates are extended in parallel along a second direction perpendicular to the first direction, and a plurality of transparent electrodes are formed on the first and second substrates. The second substrates intersect with the first substrates, each second substrate facing alternately one and the other surfaces of the first substrates along the second direction, and each of the transparent electrodes on the first substrates faces one of the transparent electrodes on the second substrates.

Abstract: A transparent display apparatus is provided that is constructed to transmit or block a light of images selectively according to a supply of electric power to a conventional transparent organic light emitting diode. The transparent display apparatus includes a transparent organic light emitting diode having a glass substrate, a transparent anode, a hole transport layer, an emitting layer, an electron transport layer and a transparent cathode. The transparent display apparatus includes an insulating layer stacked on the transparent cathode, and first and second transparent ITOs stacked on the insulating layer to deliver electromotive force onto an entire surface and to transmit or block the light of images according to the on/off state of a power source. The transparent display apparatus also includes an electro chromic layer provided between the first and the second transparent ITOs and including transparent and colorless chemicals.

Abstract: An apparatus and method for allowing a user to dynamically enjoy a video. A difference between image data is computed at every preset unit of time and a vibration corresponding to the computed difference is generated so that the user can sense a motion change of an object within the video. Upon video reproduction, scenes are displayed by applying the lighting effect of a strobe light or the like between the scenes to be reproduced. Upon video reproduction, more enjoyment and various haptic effects can be provided to the user.

Abstract: A printed circuit board includes a core layer, an insulation layer formed on the core layer and having a cavity formed on a part of the insulation layer, and a circuit pattern formed on the insulation layer, wherein the circuit pattern comprises one or more external terminals positioned above the cavity.

Abstract: Provided is a System-In-Package (SIP) having embedded circuit boards in which boards are electrically connected and a plurality of chips are embedded in a board in a stacked manner. The SIP includes a first board on a surface of which a first circuit is formed, a second board which is provided on a top surface of the first board in a stacked manner and includes a plurality of chips embedded therein in a stacked manner, and a third board which is provided on a top surface of the second board in a stacked manner and on a surface of which a second circuit is formed.

Abstract: An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the cavities, a second copper clad laminate provided in the cavities to allow the first copper clad laminate to level with the chips; and a resin coated copper foil provided on upper surfaces of the first and second copper clad laminates.

Abstract: Disclosed are a semiconductor package and semiconductor system in package using the same. The semiconductor package includes: a printed circuit board (PCB); a semiconductor die disposed on the PCB and having conductive posts formed on an upper surface of the semiconductor die; and a molding formed on the PCB to cover the semiconductor die, wherein the conductive posts have a surface exposed out of an upper surface of the molding. The semiconductor system in package includes: a first semiconductor package having a semiconductor die on which conductive posts are formed, and a molding formed so that upper surfaces of the conductive posts are exposed; and a second semiconductor package disposed on the first semiconductor package and electrically connected to the conductive posts.

Abstract: Disclosed is a multi-layered printed circuit board including a plurality of insulation layers; a plurality of conductive patterns stacked on the multi-layered printed circuit board while alternating with the insulation layers; an integrated circuit positioned inside a core insulation layer of the insulation layers so as to be embedded in the multi-layered printed circuit board, a plurality of external connection terminal being positioned on a surface of the integrated circuit for external electric connection; and a film attached to a surface of the integrated circuit, the film having a plurality of inner conductive pads in one-to-one electric connection with the external connection terminals, the film being electrically connected to an adjacent conductive pattern layer.

Abstract: A watch phone and a method for handling an incoming call using the watch phone are provided. In the watch phone, a display device includes a touch screen panel and a display, turns off the touch screen panel in a watch mode, turns on the touch screen panel in an idle mode or upon receipt of an incoming call, and displays at least two areas for call connection and call rejection, upon receipt of the incoming call. A single mode selection key selects one of the watch mode and the idle mode. A controller performs control operations so that the touch screen panel is turned off in the watch mode and is turned on in the idle mode or upon receipt of the incoming call, and connects or rejects the incoming call, when the at least two areas for call connection or call rejection, which are displayed upon receipt of the incoming call, are pointed to or dragged to.

Abstract: An apparatus and method for allowing a user to dynamically enjoy a video. A difference between image data is computed at every preset unit of time and a vibration corresponding to the computed difference is generated so that the user can sense a motion change of an object within the video. Upon video reproduction, scenes are displayed by applying the lighting effect of a strobe light or the like between the scenes to be reproduced. Upon video reproduction, more enjoyment and various haptic effects can be provided to the user.

Abstract: A transparent display apparatus is provided that is constructed to transmit or block a light of images selectively according to a supply of electric power to a conventional transparent organic light emitting diode. The transparent display apparatus includes a transparent organic light emitting diode having a glass substrate, a transparent anode, a hole transport layer, an emitting layer, an electron transport layer and a transparent cathode. The transparent display apparatus includes an insulating layer stacked on the transparent cathode, and first and second transparent ITOs stacked on the insulating layer to deliver electromotive force onto an entire surface and to transmit or block the light of images according to the on/off state of a power source. The transparent display apparatus also includes an electro chromic layer provided between the first and the second transparent ITOs and including transparent and colorless chemicals.

Abstract: A printed circuit board includes a core layer, an insulation layer formed on the core layer and having a cavity formed on a part of the insulation layer, and a circuit pattern formed on the insulation layer, wherein the circuit pattern comprises one or more external terminals positioned above the cavity.

Abstract: Disclosed is a semiconductor package adapted to be light, slim, compact, and suitable for high-density mounting and a method for manufacturing the same. The semiconductor package includes a semiconductor chip; a plurality of active/passive devices; a first PCB acting as a main board, the semiconductor chip and devices selected from the plurality of active/passive devices being mounted on the first PCB, the devices including a highest device; and at least one sub-PCB, remaining devices of the plurality of active/passive devices being mounted on the sub-PCB, the sub-PCB having a through-hole, at least the highest device on the first PCB extending through the through-hole, so that the sub-PCB is connected to the first PCB and positioned in a space above the first PCB while overlapping the first PCB.

Abstract: A multi-layer PCB includes a plurality of insulating layers and a plurality of conductive pattern layers alternatively and repeatedly stacked; contact-hole formed in the insulating layers so as to allow electrical connection through the contact-holes; a first integrated circuit arranged in a first insulating layer as one of the insulating layers so as to be embedded in the multi-layer PCB, the first integrated circuit having a plurality of connection bumps for electric connection on an upper surface of the first integrated circuit; and a second integrated circuit stacked on a lower surface of the first integrated circuit, the second integrated circuit having a plurality of connection bumps for electric connection on an upper surface of the second integrated circuit.

Abstract: Disclosed are an integrated circuit chip package and a method of connecting an integrated circuit chip and an attachment subject to each other while interposing an adhesive therebetween. The connection between integrated circuit chip and the attachment subject stress often leads to component failure and the addition of an interface layer with a similar thermal expansion coefficient improves reliability. The method may include applying the adhesive on the attachment subject, forming an interface layer between the integrated circuit chip and the adhesive wherein the interface layer has a thermal expansion coefficient similar to a thermal expansion coefficient of the integrated circuit chip. By connecting an integrated circuit chip and the attachment subject to each other by an adhesive via the interface layer, the generation of delamination is minimized and reliability is improved.

Abstract: Disclosed are a multi-layer PCB and a fabricating method thereof. The multi-layer PCB includes: a core; a plurality of insulation layers and a plurality of conductive pattern layers alternatively stacked on both sides of the core; and a plurality of via holes formed through the core and the insulation layers. The fabricating method may includes the steps of: forming a conductive pattern layer on each of both sides of a core, and forming via holes through the core; attaching a double-stick tape with weak adhesive strength to a portion of each of a upper surface and a lower surface of the core; and forming an insulation layer on each of a upper surface and a lower surface of the core to cover the double-stick tapes, and forming a conductive pattern layer on each of the insulation layers.

Abstract: A semiconductor die module, a semiconductor package, and a fabrication method of the semiconductor package. A method for manufacturing a semiconductor package includes the steps of: preparing a printed circuit board in which a hole is formed to extend through a core, and an insulation layer and a circuit pattern are formed on a surface of the core, the printed circuit board having an open surface; forming conductive bumpers on some of the electric pads of each semiconductor die; forming a semiconductor die module in which the electric pads of each semiconductor die are connected to one another; inserting the semiconductor die module into the hole of the core so as to safely seat the semiconductor die module on the insulation layer and the circuit pattern; and forming the insulation layer and the circuit patterns on an open upper surface of the core.

Abstract: Disclosed are a semiconductor package and semiconductor system in package using the same. The semiconductor package includes: a printed circuit board (PCB); a semiconductor die disposed on the PCB and having conductive posts formed on an upper surface of the semiconductor die; and a molding formed on the PCB to cover the semiconductor die, wherein the conductive posts have a surface exposed out of an upper surface of the molding. The semiconductor system in package includes: a first semiconductor package having a semiconductor die on which conductive posts are formed, and a molding formed so that upper surfaces of the conductive posts are exposed; and a second semiconductor package disposed on the first semiconductor package and electrically connected to the conductive posts.

Abstract: Disclosed is a multi-layered printed circuit board including a plurality of insulation layers; a plurality of conductive patterns stacked on the multi-layered printed circuit board while alternating with the insulation layers; an integrated circuit positioned inside a core insulation layer of the insulation layers so as to be embedded in the multi-layered printed circuit board, a plurality of external connection terminal being positioned on a surface of the integrated circuit for external electric connection; and a film attached to a surface of the integrated circuit, the film having a plurality of inner conductive pads in one-to-one electric connection with the external connection terminals, the film being electrically connected to an adjacent conductive pattern layer.

Abstract: An electronic circuit package and fabricating method thereof. The method includes: integrating a radio frequency circuit device and a semiconductor die on a printed circuit board; forming a bumper pad of metal on the printed circuit board around the radio frequency circuit device; forming a molding on the printed circuit board to include the radio frequency circuit device and the semiconductor die therein; and forming one or more grooves on a portion of the molding and inserting a can into the grooves. The electronic circuit package includes: a printed circuit board; a radio frequency circuit device and a semiconductor die integrated on the printed circuit board; a molding formed on the printed circuit board to include the radio frequency circuit device and the semiconductor die therein; one or more grooves formed in the molding to enclose the radio frequency circuit device; and a can inserted into the grooves.