Abstract: By diverting a small amount of current from a string of LED(s) powered by a LED driver at low current levels in a process of dimming the LED string, performance of the LED string light emission is improved.

Abstract: A photography lighting fixture includes a lighting device and a shade device. The lighting device includes a housing, a lighting element disposed in the housing, and a first attaching unit connected to the housing. The shade device includes a base mount, a plurality of shade components mounted pivotally to the base mount, and a second attaching unit mounted to the base mount and detachably and rotatably attaching the first attaching unit.

Abstract: By diverting a small amount of current from a string of LED(s) powered by a LED driver at low current levels in a process of dimming the LED string, performance of the LED string light emission is improved.

Abstract: A photography lighting fixture includes a lighting device and a shade device. The lighting device includes a housing, a lighting element disposed in the housing, and a first attaching unit connected to the housing. The shade device includes a base mount, a plurality of shade components mounted pivotally to the base mount, and a second attaching unit mounted to the base mount and detachably and rotatably attaching the first attaching unit.

Abstract: A broad-spectrum, multiple wavelength illuminator comprises a luminescent body, and a plurality of semiconductor chips spaced apart from the luminescent body emitting light within one or more wavelength ranges towards the luminescent body, causing the luminescent body to emit light of one or more wavelength ranges. An optical element adjacent to the luminescent body collects light emitted by the luminescent body. An optical device collects light collected by the optical element. An aperture located between the optical element and the optical device passes the light emitted by the luminescent body along an optical axis, wherein light collected by the optical element and the optical device and passed by the aperture forms a beam of light illuminating a target. Alternatively, instead of being spaced apart from the chips, the luminescent body may be a layer adjacent to the chips.

Abstract: An LED array includes three or more strings of bare LEDs mounted in close proximity to each other on a substrate. The strings of LEDs emit light of one or more wavelengths of blue, indigo and/or violet light, with peak wavelengths that are less than 490 nm. Luminescent materials deposited on each of the LED chips in the array emit light of different wavelength ranges that are of longer wavelengths than and in response to light emissions from the LED chips. A control circuit applies currents to the strings of LEDs, causing the LEDs in the strings to emit light, which causes the luminescent materials to emit light. A user interface enables users to control the currents applied by the control circuit to the strings of LEDs to achieve a Correlated Color Temperature (CCT) value and hue that are desired by users, with CIE chromaticity coordinates that lie on, or near to the black body radiation curve.

Abstract: This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described, for the packaging of high power LEDs. The LED submount provides high thermal conductivity while preserving electrical insulation. In particular, a process is described for anodizing a high thermal conductivity aluminum alloy sheet to form a porous aluminum oxide layer and a non-porous aluminum oxide layer. This anodized aluminum alloy sheet acts as a superior electrical insulator, and also provides surface morphology and mechanical properties that are useful for the fabrication of high-density and high-power multilevel electrical circuits.

Abstract: A compact high-brightness LED aquarium light fixture is described for use in illuminating aquarium tanks artificial light. (18) The LED aquarium light uses a densely-packed array of high-brightness light emitting diodes (LEDs) that are not individually packaged, where the array behaves similarly to a point source of light. The LED chips are distributed laterally over an area, where the LED chips have light emitting surfaces for emitting light in directions transverse to said area, wherein the dimensions of the area do not exceed 25 mm. Adjacent chips of the array are preferably separated by less than about 0.2 mm. The extended point source LED array, with its lens and associated reflector, result in a concentrated light source that attractively illuminates the contents of the aquarium, and creates a desirable shimmering effect within the aquarium. A clamp-on, flexible gooseneck mounting arrangement allows for use with aquarium tanks of various sizes.

Abstract: The LED grow light fixture uses a densely-packed array of high-brightness LEDs that are not individually packaged where the array behaves similarly to a point source of light. The extended point source LED array, with its lens and associated reflector, result in a concentrated, partially-collimated light source, such that the intensity of the light does not diminish rapidly as distance from the light source increases. The LED array contains a plurality of LED strings that may be separately controlled, thereby allowing the spectral content of the LED grow light to be varied, to facilitate desired plant growth at various stages of plant life. The light emitted at each of the multiple different wavelengths from the array is evenly distributed, when the objects being illuminated by the array are at a distance of less than about 6 feet or even less than 1 foot from the array.

Abstract: In one embodiment, a device for transferring heat comprises a base member and a first array of pin fins supported by the base member, the pin fins having an aspect ratio of not less than about 10, and the pin fins being not more than about 0.3 mm in equivalent diameter and not more than about 3 mm in length, either one or both of the base member and pin fins comprising a metallic or semiconductor material. To form this device, a substrate is provided. A pattern is formed on the substrate, the pattern having holes therein or in the form of dots with cross-sectional dimensions of not more than about 0.3 mm. Pin fins supported by the substrate are formed, where the pin fins have an aspect ratio of not less than about 10, and not more than about 0.3 mm in equivalent diameter and not more than about 3 mm in length. Either one or both of the base member and pin fins comprise a metallic or semiconductor material. The pattern is then removed.

Abstract: A compact high-brightness LED aquarium light fixture is described for use in illuminating aquarium tanks artificial light. The LED aquarium light uses a densely-packed array of high-brightness light emitting diodes (LEDs) that are not individually packaged, where the array behaves similarly to a point source of light. The LED chips are distributed laterally over an area, where the LED chips have light emitting surfaces for emitting light in directions transverse to said area, wherein the dimensions of the area do not exceed 25 mm. Adjacent chips of the array are preferably separated by less than about 0.2 mm. The extended point source LED array, with its lens and associated reflector, result in a concentrated light source that attractively illuminates the contents of the aquarium, and creates a desirable shimmering effect within the aquarium.

Abstract: A compact high-brightness LED grow light fixture is described for use in growing plants under artificial light, or as a supplement to natural sunlight. The LED grow light uses a densely-packed array of high-brightness light emitting diodes (LEDs) that are not individually packaged where the array behaves similarly to a point source of light. The LED chips are distributed laterally over an area, where the LED chips have light emitting surfaces for emitting light in directions transverse to said area, wherein the dimensions of the area do not exceed 25 mm. Adjacent chips of the array are preferably separated by less than about 0.2 mm. The extended point source LED array, with its lens and associated reflector, result in a concentrated, partially-collimated light source, such that the intensity of the light does not diminish rapidly as distance from the light source increases. Thus, foliage that is lower down on the plant will receive almost as much light energy as does foliage on the top of the plant.

Abstract: This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described, for the packaging of high power LEDs. The LED submount provides high thermal conductivity while preserving electrical insulation. In particular, a process is described for anodizing a high thermal conductivity aluminum alloy sheet to form a porous aluminum oxide layer and a non-porous aluminum oxide layer. This anodized aluminum alloy sheet acts as a superior electrical insulator, and also provides surface morphology and mechanical properties that are useful for the fabrication of high-density and high-power multilevel electrical circuits.

Abstract: This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described, for the packaging of high power LEDs. The LED submount provides high thermal conductivity while preserving electrical insulation. In particular, a process is described for anodizing a high thermal conductivity aluminum alloy sheet to form a porous aluminum oxide layer and a non-porous aluminum oxide layer. This anodized aluminum alloy sheet acts as a superior electrical insulator, and also provides surface morphology and mechanical properties that are useful for the fabrication of high-density and high-power multilevel electrical circuits.

Abstract: At least one diffraction element is used to diffract light of multiple wavelengths into different wavelength components. Instead of moving the diffraction element as in certain prior filters, light from the at least one element is reflected back towards the at least one element so that light is diffracted at least twice by the at least one element. The reflection is such that at least one selected wavelength component of said wavelength components will pass from an input port to an output port or to another device.

Abstract: The difficulties encountered in conventional LED multiple chip modules where wire bonding is used to connect the chips to electrodes can be overcome by using an interconnect to connect the chip to electrodes in a module where the interconnect is supported at points along its length other than at endpoints thereof, by a carrier either directly or indirectly. This improves reliability of the interconnect over conventional designs. Preferably, the contacts of the chips, and the electrodes are all within, or do not extend beyond, two parallel planes that are 400 microns apart for a compact design.

Abstract: This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described, for the packaging of high power LEDs. The LED submount provides high thermal conductivity while preserving electrical insulation. In particular, a process is described for anodizing a high thermal conductivity aluminum alloy sheet to form a porous aluminum oxide layer and a non-porous aluminum oxide layer. This anodized aluminum alloy sheet acts as a superior electrical insulator, and also provides surface morphology and mechanical properties that are useful for the fabrication of high-density and high-power multilevel electrical circuits.

Abstract: At least one diffraction element is used to diffract light of multiple wavelengths into different wavelength components. Instead of moving the diffraction element as in certain prior filters, light from the at least one element is reflected back towards the at least one element so that light is diffracted at least twice by the at least one element. The reflection is such that at least one selected wavelength component of said wavelength components will pass from an input port to an output port or to another device.

Abstract: The difficulties encountered in conventional LED multiple chip modules where wire bonding is used to connect the chips to electrodes can be overcome by using an interconnect to connect the chip to electrodes in a module where the interconnect is supported at points along its length other than at endpoints thereof, by a carrier either directly or indirectly. This improves reliability of the interconnect over conventional designs. Preferably, the contacts of the chips, and the electrodes are all within, or do not extend beyond, two parallel planes that are 400 microns apart for a compact design.