Patents by Inventor Ho-Sik Jun

Ho-Sik Jun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same
    Patent number: 7351915
    Abstract: A printed circuit board (PCB) having at least one embedded capacitor and a method of fabricating the same is provided. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.
    Type: Grant
    Filed: November 29, 2004
    Date of Patent: April 1, 2008
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin-Yong Ahn, Chang-Sup Ryu, Suk-Hyeon Cho, Seok-Kyu Lee, Jong-Kuk Hong, Ho-Sik Jun
  • PRINTED CIRCUIT BOARD INCLUDING EMBEDDED CAPACITOR HAVING HIGH DIELECTRIC CONSTANT AND METHOD OF FABRICATING SAME
    Publication number: 20070146980
    Abstract: Disclosed is a PCB including embedded capacitors and a method of fabricating the same. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.
    Type: Application
    Filed: March 2, 2007
    Publication date: June 28, 2007
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin-Yong Ahn, Chang-Sup Ryu, Suk-Hyeon Cho, Seok-Kyu Lee, Jong-Kuk Hong, Ho-Sik Jun
  • Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same
    Publication number: 20060044734
    Abstract: Disclosed is a PCB including embedded capacitors and a method of fabricating the same. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.
    Type: Application
    Filed: November 29, 2004
    Publication date: March 2, 2006
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin-Yong Ahn, Chang-Sup Ryu, Suk-Hyeon Cho, Seok-Kyu Lee, Jong-Kuk Hong, Ho-Sik Jun
  • Method of fabricating PCB including embedded passive chip
    Publication number: 20060014327
    Abstract: Disclosed is a method of fabricating a PCB including an embedded passive chip, in which the passive chip is mounted on the PCB and an insulator is then laminated on the PCB, or in which a blind hole for receiving the passive chip is formed in the PCB and the passive chip is mounted in the blind hole.
    Type: Application
    Filed: October 29, 2004
    Publication date: January 19, 2006
    Inventors: Suk-Hyeon Cho, Seok-Kyu Lee, Jong-Kuk Hong, Ho-Sik Jun, Jin-Soo Jeong, Chang-Sup Ryu, Jin-Yong Ahn