Abstract: In one preferred embodiment, an aircraft marshaling wand controller displays aircraft marshaling instructions to a pilot on a video display monitor on-board an aircraft, such as an aircraft on an aircraft carrier. When an aircraft marshal uses arm motion gestures to form aircraft marshaling instructions for the pilot on the aircraft, the wand controller of the present invention senses or detects those gesture motions, and generates digitized command signals representative of those gesture motions made by the aircraft marshal. A wireless transceiver then transmits those digitized command signals to the aircraft for display on the video monitor for viewing by the pilot.

Abstract: A system includes a controller, a Hall-effect sensor and transceiver connected to the controller; and a flux-producing element having a plurality of magnetic flux lines emanating therefrom. The system may be secured to or contained within a wearable glove. The flux-producing element may be coupled to an object separate from the wearable glove. The Hall-effect sensor transmits a Hall-effect sensor signal to the controller when the Hall-effect sensor is perpendicular to at least some of the plurality of magnetic flux lines. The Hall-effect sensor signal may include data received from the flux-producing element. The controller transmits a controller signal to the transceiver after receiving the Hall-effect sensor signal. The controller signal may include input from a motion sensor and/or an orientation sensor connected to the controller. The transceiver may transmit the signal to a remote processor. The signal may be used for gesture recognition, information coding, and/or information processing.

Abstract: A system includes a controller and an RFID sensor, an RFID sensor reader having a detection region, and a transceiver connected to the controller. The system may be secured to or contained within a wearable glove. The RFID sensor is configured to transmit an RFID sensor signal to the RFID sensor reader when the RFID sensor is within the detection region. The RFID sensor reader is configured to transmit an RFID sensor reader signal to the controller after receiving the RFID sensor signal. The controller is configured to transmit a signal to the transceiver after receiving the RFID sensor reader signal. The signal may include input from a motion sensor and/or an orientation sensor connected to the controller. The transceiver may transmit the signal to a remote processor via an antenna. The signal may be used for gesture recognition, information coding, and/or information processing.

Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

Abstract: One embodiment of the present invention provides a system that accommodates multiple optical segments in an Ethernet passive optical network (EPON), wherein the EPON includes a central node and a number of remote nodes, and wherein the remote nodes reside in a number of optical segments. During operation, the system transmits downstream data from the central node to the remote nodes by broadcasting the data to the optical segments. In addition, the system selectively allows an optical segment to communicate with the central node during an upstream transmission period assigned to a remote node residing in that optical segment, thereby accommodating multiple optical segments and hence an increased number of remote nodes within the EPON.

Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

Abstract: An innovative chip testing system and method includes controlling temperature and condensation during testing. Coarse temperature is controlled by providing a desired fluid flow rate and fluid temperature to a cold plate. Fine temperature control is provided by a feedback loop which controls the power dissipation of cartridge heaters installed within the cold plate. Condensation control is provided by insulating various components of the system, manipulation of dry compressed air in enclosures to reduce surface dew point temperatures, usage of cartridge heaters in a card backside stiffener plate, and by providing a heatsink assembly which prevents condensation on the insulation.

Abstract: An innovative chip testing system and method includes controlling temperature and condensation during testing. Coarse temperature is controlled by providing a desired fluid flow rate and fluid temperature to a cold plate. Fine temperature control is provided by a feedback loop which controls the power dissipation of cartridge heaters installed within the cold plate. Condensation control is provided by insulating various components of the system, manipulation of dry compressed air in enclosures to reduce surface dew point temperatures, usage of cartridge heaters in a card backside stiffener plate, and by providing a heatsink assembly which prevents condensation on the insulation.