Abstract: A method, comprising: obtaining one or more accelerometer signals derived from an accelerometer; and determining one or more parameters of wind at the accelerometer based on the one or more accelerometer signals.

Abstract: A method, comprising: obtaining one or more accelerometer signals derived from an accelerometer; and determining one or more parameters of wind at the accelerometer based on the one or more accelerometer signals.

Abstract: A method, comprising: obtaining one or more accelerometer signals derived from an accelerometer; and determining one or more parameters of wind at the accelerometer based on the one or more accelerometer signals.

Abstract: A primary device arranged to communicate with one or more secondary devices across a communications network. The primary device comprises at least one processor and memory comprising computer executable instructions, which when executed by the at least one processor, are configured to: receive an audio signal comprising a voice command associated with a user; determine a secondary device associated with the user from the one or more secondary devices; and transmit a response to the voice command to the determined secondary device.

Abstract: An audio processing apparatus, comprising: a first receiver configured to receive one or more audio signals derived from one or more microphones, the one or more audio signals comprising a speech component received from a user and a first noise component transmitted by a first device; a second receiver configured to receive over a network and from the first device, first audio data corresponding to the first noise component; one or more processors configured to: remove the first noise component from the one or more audio signals using the first audio data to generate a first processed audio signal; and perform speech recognition on the first processed audio signal to generate a first speech result.

Abstract: A method, comprising: obtain one or more accelerometer signals derived from an accelerometer; and determining one or more parameters of wind at the accelerometer based on the one or more accelerometer signals.

Abstract: A method, comprising: obtain one or more accelerometer signals derived from an accelerometer; and determining one or more parameters of wind at the accelerometer based on the one or more accelerometer signals.

Abstract: A method, comprising: obtain one or more accelerometer signals derived from an accelerometer; and determining one or more parameters of wind at the accelerometer based on the one or more accelerometer signals.

Abstract: A semiconductor structure for manufacturing a semiconductor package device is provided. The semiconductor structure includes a carrier and a dielectric layer. The carrier has a first surface and a second surface opposite to the first surface. The carrier includes an inner core layer and an exterior clad layer, and the inner core layer is covered by the exterior clad layer. The dielectric layer is formed on the first surface of the carrier. The carrier supports the dielectric layer.

Abstract: An audio processing apparatus, comprising: a first receiver configured to receive one or more audio signals derived from one or more microphones, the one or more audio signals comprising a speech component received from a user and a first noise component transmitted by a first device; a second receiver configured to receive over a network and from the first device, first audio data corresponding to the first noise component; one or more processors configured to: remove the first noise component from the one or more audio signals using the first audio data to generate a first processed audio signal; and perform speech recognition on the first processed audio signal to generate a first speech result.

Abstract: A primary device arranged to communicate with one or more secondary devices across a communications network. The primary device comprises at least one processor and memory comprising computer executable instructions, which when executed by the at least one processor, are configured to: receive an audio signal comprising a voice command associated with a user; determine a secondary device associated with the user from the one or more secondary devices; and transmit a response to the voice command to the determined secondary device.

Abstract: A trocar sleeve for minimally invasive surgery, having a first sleeve part, which has essentially the shape of a straight tubular piece with a longitudinal axis, and having a second sleeve part, which at least partly surrounds the first sleeve part in close contiguity and is movable during use with respect to the first sleeve part. The mobility of the second sleeve part in relation to the first sleeve part consists essentially only in rotatability of the second sleeve part around the first sleeve part, and in addition the first sleeve part and the second sleeve part each comprise on their distal axial ends a flange part that extends radially outward at an angle of less than 180 degrees from the respective sleeve part.

Abstract: A caisson is modified to include side tabs thin can be gripped by side-mounted clamps on a vibratory hammer so that the caisson may be lifted into position from a horizontal position, oriented vertically, and driven into the ground without readjustment of the clamping of the vibratory hammer. An end cap installed permanently at the top of the caisson may provide an additional flange for receiving a lower clamp of the vibratory hammer to complete installation of the caisson, driving the caisson further into the earth until the tabs are buried in the ground. The flange may be sized to fit within a tower portion attached to the caisson eliminating the need for a replaceable flange system.

Abstract: A semiconductor structure for manufacturing a semiconductor package device is provided. The semiconductor structure includes a carrier and a dielectric layer. The carrier has a first surface and a second surface opposite to the first surface. The carrier includes an inner core layer and an exterior clad layer, and the inner core layer is covered by the exterior clad layer. The dielectric layer is formed on the first surface of the carrier. The carrier supports the dielectric layer.

Abstract: A semiconductor structure and a manufacturing method of the same are provided. The semiconductor structure includes a carrier. The carrier has a first surface and a second surface opposite to the first surface. The carrier includes an inner core layer and an exterior clad layer, and the inner core layer is covered by the exterior clad layer.

Abstract: A semiconductor substrate includes a device carrier, a plurality of stiffener structures and a plurality of spaced areas. The device carrier includes a plurality of trace layout units and a periphery around the trace layout units. The stiffener structures are disposed on the device carrier along the periphery of the trace layout units. The spaced areas are disposed between the stiffener structures.

Abstract: A caisson is modified to include side tabs thin can be gripped by side-mounted clamps on a vibratory hammer so that the caisson may be lifted into position from a horizontal position, oriented vertically, and driven into the ground without readjustment of the clamping of the vibratory hammer. An end cap installed permanently at the top of the caisson may provide an additional flange for receiving a lower clamp of the vibratory hammer to complete installation of the caisson, driving the caisson further into the earth until the tabs arc buried in the ground. The flange may be sized to fit within a tower portion attached to the caisson eliminating the need for a replaceable flange system.

Abstract: A method of vehicle navigation guidance includes: receiving at least three satellite positioning data; receiving road marking data from a driver assistance device; calculating a first position of a vehicle according to the at least three satellite positioning data and according to the road marking data; determining a turning action of the vehicle according to the road marking data; determining an acceleration force of the vehicle according to the road marking data; and calculating a second position of the vehicle according to the first position, according to the turning action, and according to the acceleration force.

Abstract: A semiconductor package and a manufacturing method thereof are disclosed. The semiconductor package includes a device carrier and a stiffener structure. The device carrier includes at least one insulating layer and at least conductive layer defining at least one trace layout unit. The stiffener structure is disposed on the device carrier, surrounding the periphery of the at least one trace layout unit. The stiffener structure is disposed away from the periphery of the at least one trace layout unit, forming a cavity with the device carrier. The shape and disposition of the stiffener structure enhance the strength of the semiconductor package, impeding flexure to the semiconductor package.

Abstract: A semiconductor package includes a dielectric layer, a plurality of traces, a plurality of electrical pads, a plurality of studs and at least a semiconductor device. The dielectric layer has a first dielectric surface and a second dielectric surface opposite the first dielectric surface. The traces are disposed in the dielectric layer and are exposed on the second dielectric surface. The electrical pads are disposed on the first dielectric surface. The studs are disposed in the dielectric layer and are exposed on the first dielectric surface. The studs are electrically connected to the traces and the electrical pads. The semiconductor device is disposed on the second dielectric surface and electrically connected to the traces.