Patents by Inventor Hock Lye John Pang

Hock Lye John Pang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF FABRICATING AN INTERFACIAL STRUCTURE AND A FABRICATED INTERFACIAL STRUCTURE
    Publication number: 20220184699
    Abstract: A method of fabricating an interfacial structure, the interfacial structure comprising a substrate and a projection on the substrate, the method comprising the steps of: a) providing the substrate; b) creating a number of steps on a surface of the substrate; and c) fabricating the projection on the substrate by additive manufacturing onto the number of steps, thereby creating a stepped interfacial joint between the substrate and the projection. A fabricated interfacial structure comprising: a substrate having a number of steps created on a surface of the substrate; a projection fabricated by additive manufacturing onto the number of steps; and a stepped interfacial joint between the substrate and the projection.
    Type: Application
    Filed: February 11, 2020
    Publication date: June 16, 2022
    Inventors: Hock Lye John PANG, Zhi'En Eddie TAN, Jacek KAMINSKI
  • Interconnect structure and a method of fabricating the same
    Patent number: 8462516
    Abstract: An interconnect structure, an interconnect structure for interconnecting first and second components, an interconnect structure for interconnecting a multiple component stack and a substrate, and a method of fabricating an interconnect structure. The interconnect structure comprising a base portion formed on a mounting surface of a first component; a pillar portion extending from the base portion and substantially perpendicularly to the mounting surface; and a head portion formed on the pillar portion and having larger lateral dimensions than the pillar portion; wherein the base portion and the pillar portion are integrally formed of a homogeneous material.
    Type: Grant
    Filed: October 21, 2008
    Date of Patent: June 11, 2013
    Assignees: Agency for Science Technology and Research, Nanyang Technological University
    Inventors: Chee Khuen Stephen Wong, Hock Lye John Pang, Wei Fan, Haijing Lu, Boon Keng Lok
  • Interconnect Structure And A Method Of Fabricating The Same
    Publication number: 20100246150
    Abstract: An interconnect structure, an interconnect structure for interconnecting first and second components, an interconnect structure for interconnecting a multiple component stack and a substrate, and a method of fabricating an interconnect structure. The interconnect structure comprising a base portion formed on a mounting surface of a first component; a pillar portion extending from the base portion and substantially perpendicularly to the mounting surface; and a head portion formed on the pillar portion and having larger lateral dimensions than the pillar portion; wherein the base portion and the pillar portion are integrally formed of a homogeneous material.
    Type: Application
    Filed: October 21, 2008
    Publication date: September 30, 2010
    Applicants: Agency for Science Tecnology and Research, Nanyang Tecnological University
    Inventors: Chee Khuen Stephen Wong, Hock Lye John Pang, Wei Fan, Haijing Lu, Boon Keng Lock