Patents by Inventor Hohn Jong Hsiung

Hohn Jong Hsiung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6068809
    Abstract: In a method of injection molding elements, a first step is to charge a molding compound into an injection nozzle via a side hole defined in the nozzle under the control of a mini-plunger which is selectively reciprocally movable within a bore of the injection nozzle. In a second step, the mini-plunger is reciprocally moved in the bore of the nozzle for injecting substantially the entire molding compound in the bore of the injection nozzle into at least one cavity of a mold via a separate gate passage defined in the mold. Each gate passage is a narrow capillary aperture that connects the bore of the injection nozzle with a different one of the at least one cavity of the mold. In a third step, the nozzle and the mold are separated after the molding compound in the gate passage is cured but before the molding compound in the at least one cavity of the mold is cured. In a fourth step the molded element is removed from the at least one cavity of the mold once the molding compound therein is cured.
    Type: Grant
    Filed: July 25, 1997
    Date of Patent: May 30, 2000
    Assignee: General Semiconductor, Inc.
    Inventors: Eugene Chen, Hohn Jong Hsiung, Kuang Hann Lin, Wing Lun Wong, Boon Meng Chan
  • Patent number: 5698242
    Abstract: An injection molding apparatus includes a nozzle which is directly connected to a mold for injecting a molding material into the mold. The mold defines at least one cavity in the shape of a element to be molded and at least one gate passage, each gate passage interconnecting a separate cavity with the nozzle. The shape of the gate passage permits a rapid curing of any residual molding material, and permits separation of the mold and the nozzle before the molding material in each cavity is cured. The nozzle is then used for a subsequent procedure or molding process while the molding material in the cavity cures. The nozzle defines a first bore and a second bore arranged longitudinally in sequence, and a side hole for introducing the molding material into the first bore. The nozzle includes a first plunger which is selectively reciprocally movable in the first bore, and a second plunger which is selectively reciprocally movable in the second bore and in a central bore defined in the first plunger.
    Type: Grant
    Filed: December 20, 1995
    Date of Patent: December 16, 1997
    Assignees: General Instrument Corporation of Delaware, Kras Asia Ltd
    Inventors: Eugene Chen, Hohn Jong Hsiung, Kuang Hann Lin, Wing Lun Wong, Boon Meng Chan