Patents by Inventor Holger Doering
Holger Doering has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10682498Abstract: Pressure sensors and associated structures that may have reduced light sensitivity. An example may provide structures reducing light at a component on a membrane of a pressure sensor.Type: GrantFiled: October 16, 2017Date of Patent: June 16, 2020Assignee: SILICON MICROSTRUCTURES, INC.Inventors: Holger Doering, Stephen C. Terry, Justin Gaynor, Omar Abed, Fernando Alfaro
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Patent number: 10655989Abstract: Pressure sensors that may be used in flowrate monitoring or measuring systems, where the pressure sensors may enable simple, low-cost designs that are readily implemented. One example may provide a pressure sensor having a built-in flow path with a dimensional variation. Pressures of a fluid on each side of the dimensional variation may be compared to each other. The measured differential pressure may then be converted to a flowrate through the flow path.Type: GrantFiled: September 12, 2018Date of Patent: May 19, 2020Assignee: SILICON MICROSTRUCTURES, INC.Inventors: Holger Doering, Omar Abed
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Patent number: 10641672Abstract: Pressure sensors and associated structures that may facilitate the use of automated connection processes and tools. An example may provide structures for aligning interconnect wires to pressure sensor bondpads in order to facilitate the use of automated processes and tools.Type: GrantFiled: October 17, 2016Date of Patent: May 5, 2020Assignee: Silicon Microstructures, Inc.Inventors: Holger Doering, Stephen C. Terry, Justin Gaynor, Omar Abed, Fernando Alfaro
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Publication number: 20190078914Abstract: Pressure sensors that may be used in flowrate monitoring or measuring systems, where the pressure sensors may enable simple, low-cost designs that are readily implemented. One example may provide a pressure sensor having a built-in flow path with a dimensional variation. Pressures of a fluid on each side of the dimensional variation may be compared to each other. The measured differential pressure may then be converted to a flowrate through the flow path.Type: ApplicationFiled: September 12, 2018Publication date: March 14, 2019Applicant: Silicon Microstructures, Inc.Inventors: Holger Doering, Omar Abed
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Patent number: 10041851Abstract: Pressure sensors and their methods of manufacturing, where the pressure sensors have a small, thin form factor and may include features designed to improve manufacturability and where the method of manufacturing may improve yield and reduce overall costs.Type: GrantFiled: August 3, 2016Date of Patent: August 7, 2018Assignee: SILICON MICROSTRUCTURES, INC.Inventors: Holger Doering, Stephen C. Terry, Justin Gaynor, Omar Abed, Fernando Alfaro
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Publication number: 20180099120Abstract: Pressure sensors and associated structures that may have reduced light sensitivity. An example may provide structures reducing light at a component on a membrane of a pressure sensor.Type: ApplicationFiled: October 16, 2017Publication date: April 12, 2018Applicant: Silicon Microstructures, Inc.Inventors: Holger Doering, Stephen C. Terry, Justin Gaynor, Omar Abed, Fernando Alfaro
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Patent number: 9733139Abstract: Pressure sensors having vertical diaphragms or membranes. A vertical diaphragm may be located in a first silicon wafer between a first and second cavity, where the first and second cavities are covered by a second silicon wafer. One or more active or passive devices or components may be located on a top of the vertical diaphragm.Type: GrantFiled: May 2, 2014Date of Patent: August 15, 2017Assignee: Silicon Microstructures, Inc.Inventor: Holger Doering
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Publication number: 20170131167Abstract: Pressure sensors and associated structures that may facilitate the use of automated connection processes and tools. An example may provide structures for aligning interconnect wires to pressure sensor bondpads in order to facilitate the use of automated processes and tools.Type: ApplicationFiled: October 17, 2016Publication date: May 11, 2017Applicant: Silicon Microstructures, Inc.Inventors: Holger Doering, Stephen C. Terry, Justin Gaynor, Omar Abed, Fernando Alfaro
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Publication number: 20170089788Abstract: Pressure sensors and their methods of manufacturing, where the pressure sensors have a small, thin form factor and may include features designed to improve manufacturability and where the method of manufacturing may improve yield and reduce overall costs.Type: ApplicationFiled: August 3, 2016Publication date: March 30, 2017Applicant: Silicon Microstructures, Inc.Inventors: Holger Doering, Stephen C. Terry, Justin Gaynor, Omar Abed, Fernando Alfaro
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Publication number: 20150316436Abstract: Pressure sensors having vertical diaphragms or membranes. A vertical diaphragm may be located in a first silicon wafer between a first and second cavity, where the first and second cavities are covered by a second silicon wafer. One or more active or passive devices or components may be located on a top of the vertical diaphragm.Type: ApplicationFiled: May 2, 2014Publication date: November 5, 2015Applicant: Silicon Microstructures, Inc.Inventor: Holger Doering
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Publication number: 20150143926Abstract: Circuits, methods, and apparatus that provide pressure sensing devices having a pressure sensor including a diaphragm supported by a frame. The pressure sensor may be mounted on an application-specific integrated circuit. A passage may extend through the application-specific integrated circuit from its underside to its topside where it may terminate in a cavity formed under the diaphragm. Circuit components may be formed in the second wafer portion and located in areas that are not under the first wafer portion. Circuit components may be formed in the second wafer in areas under the first wafer portion, such as under the frame or under the diaphragm. Circuit components may be formed in the second wafer such that they are partially under the first wafer portion, or partially under the frame or partially under the diaphragm.Type: ApplicationFiled: November 23, 2013Publication date: May 28, 2015Applicant: Silicon Microstructures, Inc.Inventor: Holger Doering
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Publication number: 20140260650Abstract: Circuits, methods, and apparatus that provide pressure sensor devices where pressure sensors may be reliably attached to surfaces in device packages, and where the coefficients of expansion of the pressure sensor and the surface are at least approximately equal. Examples may provide pressure sensor devices where pressure sensors may be reliably attached to surfaces in device packages by providing interposers formed to prevent adhesives used to attach the pressure sensors to surfaces from blocking or encroaching into pressure sensor openings or cavities. These same features may be used to accurately locate a pressure sensor relative to the interposer. Embodiments of the present invention may provide pressure sensor devices where the coefficients of expansion of the pressure sensor and the surface are at least approximately equal by proving interposers that are formed of the same or similar material as the pressure sensors, such as silicon.Type: ApplicationFiled: September 10, 2013Publication date: September 18, 2014Applicant: Silicon Microstructures, Inc.Inventors: Holger Doering, Richard J. August, Severino Legaspi
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Patent number: 8381596Abstract: Pressure sensors having a topside boss and a cavity formed using deep reactive-ion etching (DRIE) or plasma etching. Since the boss is formed on the topside, the boss is aligned to other features on the topside of the pressure sensor, such as a Wheatstone bridge or other circuit elements. Also, since the boss is formed as part of the diaphragm, the boss has a reduced mass and is less susceptible to the effects of gravity and acceleration. These pressure sensors may also have a cavity formed using a DRIE or plasma etch. Use of these etches result in a cavity having edges that are substantially orthogonal to the diaphragm, such that pressure sensor die area is reduced. The use of these etches also permits the use of p-doped wafers, which are compatible with conventional CMOS technologies.Type: GrantFiled: December 17, 2010Date of Patent: February 26, 2013Assignee: Silicon Microstructures, Inc.Inventors: Holger Doering, Rainer Cholewa
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Publication number: 20110146411Abstract: Pressure sensors having a topside boss and a cavity formed using deep reactive-ion etching (DRIE) or plasma etching. Since the boss is formed on the topside, the boss is aligned to other features on the topside of the pressure sensor, such as a Wheatstone bridge or other circuit elements. Also, since the boss is formed as part of the diaphragm, the boss has a reduced mass and is less susceptible to the effects of gravity and acceleration. These pressure sensors may also have a cavity formed using a DRIE or plasma etch. Use of these etches result in a cavity having edges that are substantially orthogonal to the diaphragm, such that pressure sensor die area is reduced. The use of these etches also permits the use of p-doped wafers, which are compatible with conventional CMOS technologies.Type: ApplicationFiled: December 17, 2010Publication date: June 23, 2011Applicant: Silicon Microstructures, Inc.Inventors: Holger Doering, Rainer Cholewa