Abstract: A chemical mechanical polishing pad includes a surface portion of a first material. The surface portion includes a plurality of grooves. A first portion of the grooves are exposed grooves located at a surface of the chemical mechanical polishing pad. A second portion of the grooves are buried grooves embedded below the surface of the chemical mechanical polishing pad, such that, during use of the chemical mechanical polishing pad, one or more of the buried grooves are exposed at the surface.

Abstract: A chemical-mechanical polishing pad comprising a removable platen adhesive comprising a textured surface. A method of using the polishing pad to eliminate or reduce the occurrence of spot balding on the surface of the polishing pad.

Abstract: A chemical mechanical polishing pad includes a surface portion of a first material. The surface portion includes a plurality of grooves. A first portion of the grooves are exposed grooves located at a surface of the chemical mechanical polishing pad. A second portion of the grooves are buried grooves embedded below the surface of the chemical mechanical polishing pad, such that, during use of the chemical mechanical polishing pad, one or more of the buried grooves are exposed at the surface.

Abstract: Heat assisted magnetic recording uses a laser diode (LD) to provide energy during the writing process. The LD is bonded on a submount chip which is referred to as the Chip-On-Submount-Assembly (COSA). COSA devices undergo burn-in and testing in COSA burn-in fixtures, which include a first non-conductive layer having through holes and a second conductive layer having first openings. The second conductive layer is disposed over the first non-conductive layer with each of the first openings overlaying one of the through holes. COSA burn-in fixtures also include a third non-conductive layer having second openings that are larger than the first openings. The third non-conductive layer is disposed over the second conductive layer with each of the second openings overlaying one of the first openings, which forms pockets with a seat on the conductive layer for disposing the LD with one electrode in contact with the conductive layer.

Abstract: Heat assisted magnetic recording uses a laser diode (LD) to provide energy during the writing process. The LD is bonded on a submount chip which is referred to as the Chip-On-Submount-Assembly (COSA). COSA devices undergo burn-in and testing in COSA burn-in fixtures, which include a first non-conductive layer having through holes and a second conductive layer having first openings. The second conductive layer is disposed over the first non-conductive layer with each of the first openings overlaying one of the through holes. COSA burn-in fixtures also include a third non-conductive layer having second openings that are larger than the first openings. The third non-conductive layer is disposed over the second conductive layer with each of the second openings overlaying one of the first openings, which forms pockets with a seat on the conductive layer for disposing the LD with one electrode in contact with the conductive layer.

Abstract: A method for manufacturing a substrate for a magnetic disk comprises the acts of mounting a workpiece on a spindle; rotating the workpiece and scribing the workpiece to form first and second scribe lines on the top surface of the workpiece and first and second scribe lines on the bottom surface of the workpiece; and breaking the workpiece along the first and second scribe lines. The first scribe line on the top and bottom surface of the work piece defines the outer diameter of the substrate. The second scribe line on the top and bottom surface of the workpiece define the inner diameter of the substrate. Because scribe lines are formed on the top and bottom surfaces of the workpiece, the edge of the substrate is less jagged than substrates that are merely scribed on one side of the workpiece and then broken. Because the scribe lines are formed by mounting the workpiece on a spindle and rotating the substrate, the scribing can be done more precisely and quickly than scribe lines formed using an x-y platform.

Abstract: A method for manufacturing a magnetic disk comprises the step of applying a continuous laser beam to both sides of a glass workpiece and etching both sides of the workpiece with an aqueous acidic fluoride-containing etching solution. The portion of the workpiece receiving the laser beam etches at a much faster rate than the portions of the workpiece that were not exposed to the laser beam. The workpiece is then broken along a line or curve formed by the above-mentioned steps. The resulting structure is a substrate used to form a magnetic disk. The disk is completed by depositing an underlayer, a magnetic layer and a protective overcoat on the substrate.