Patents by Inventor Homayoun REZAI

Homayoun REZAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED TEST CELL USING ACTIVE THERMAL INTERPOSER (ATI) WITH PARALLEL SOCKET ACTUATION
    Publication number: 20240133943
    Abstract: A testing apparatus comprises a test interface board comprising a plurality of socket interface boards, wherein each socket interface board comprises: a) an open socket to hold a DUT; b) a discrete active thermal interposer comprising thermal properties and operable to make thermal contact with the DUT; c) a superstructure operable to contain the discrete active thermal interposer; and d) an actuation mechanism operable to provide a contact force to bring the discrete active thermal interposer in contact with the DUT.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 25, 2024
    Inventors: Karthik RANGANATHAN, Gregory CRUZAN, Samer KABBANI, Gilberto OSEGUERA, Rohan GUPTE, Homayoun REZAI, Kenneth SANTIAGO, Marc GHAZVINI
  • Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
    Patent number: 11841392
    Abstract: A testing apparatus comprises a test interface board comprising a plurality of socket interface boards, wherein each socket interface board comprises: a) an open socket to hold a DUT; b) a discrete active thermal interposer comprising thermal properties and operable to make thermal contact with the DUT; c) a superstructure operable to contain the discrete active thermal interposer; and d) an actuation mechanism operable to provide a contact force to bring the discrete active thermal interposer in contact with the DUT.
    Type: Grant
    Filed: June 3, 2022
    Date of Patent: December 12, 2023
    Assignee: Advantest Test Solutiions, Inc.
    Inventors: Karthik Ranganathan, Gregory Cruzan, Samer Kabbani, Gilberto Oseguera, Rohan Gupte, Homayoun Rezai, Kenneth Santiago, Marc Ghazvini
  • Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
    Patent number: 11493551
    Abstract: A testing apparatus comprises a test interface board comprising a plurality of socket interface boards, wherein each socket interface board comprises: a) an open socket to hold a DUT; b) a discrete active thermal interposer comprising thermal properties and operable to make thermal contact with the DUT; c) a superstructure operable to contain the discrete active thermal interposer; and d) an actuation mechanism operable to provide a contact force to bring the discrete active thermal interposer in contact with the DUT.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: November 8, 2022
    Assignee: ADVANTEST TEST SOLUTIONS, INC.
    Inventors: Karthik Ranganathan, Gregory Cruzan, Samer Kabbani, Gilberto Oseguera, Rohan Gupte, Homayoun Rezai, Kenneth Santiago, Marc Ghazvini
  • INTEGRATED TEST CELL USING ACTIVE THERMAL INTERPOSER (ATI) WITH PARALLEL SOCKET ACTUATION
    Publication number: 20220299563
    Abstract: A testing apparatus comprises a test interface board comprising a plurality of socket interface boards, wherein each socket interface board comprises: a) an open socket to hold a DUT; b) a discrete active thermal interposer comprising thermal properties and operable to make thermal contact with the DUT; c) a superstructure operable to contain the discrete active thermal interposer; and d) an actuation mechanism operable to provide a contact force to bring the discrete active thermal interposer in contact with the DUT.
    Type: Application
    Filed: June 3, 2022
    Publication date: September 22, 2022
    Inventors: Karthik RANGANATHAN, Gregory CRUZAN, Samer KABBANI, Gilberto OSEGUERA, Rohan GUPTE, Homayoun REZAI, Kenneth SANTIAGO, Marc GHAZVINI
  • INTEGRATED TEST CELL USING ACTIVE THERMAL INTERPOSER (ATI) WITH PARALLEL SOCKET ACTUATION
    Publication number: 20210396801
    Abstract: A testing apparatus comprises a test interface board comprising a plurality of socket interface boards, wherein each socket interface board comprises: a) an open socket to hold a DUT; b) a discrete active thermal interposer comprising thermal properties and operable to make thermal contact with the DUT; c) a superstructure operable to contain the discrete active thermal interposer; and d) an actuation mechanism operable to provide a contact force to bring the discrete active thermal interposer in contact with the DUT.
    Type: Application
    Filed: August 5, 2020
    Publication date: December 23, 2021
    Inventors: Karthik RANGANATHAN, Gregory CRUZAN, Samer KABBANI, Gilberto OSEGUERA, Rohan GUPTE, Homayoun REZAI, Kenneth SANTIAGO, Marc GHAZVINI