Patents by Inventor Hon Pong Lem

Hon Pong Lem has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to Produce Adhesiveless Metallized Polyimide Film
    Publication number: 20080286585
    Abstract: The present invention is directed to a method for the adhesiveless deposition of metal, and especially copper, to the surface of polyimides and derivatives of polyimide. More specifically, the invention is directed to the method for surface modification of polyimides and derivatives of polyimides by plasma graft co-polymerization with the vapor deposition of an appropriate functional monomer followed by subsequent deposition of metal of interest through a process of electroless and electrolytic plating. The so deposited metal-polyimide interface exhibit a T-peel adhesive strength in excess of 10 N/cm with polyimide films with a thickness of 75 .mu.m.
    Type: Application
    Filed: November 10, 2006
    Publication date: November 20, 2008
    Inventor: Hon Pong Lem