Abstract: A photocurable composition contains: a component (A): (meth)acrylic acid ester having 2 to 6 (meth)acryloyl groups in one molecule, a component (B): a thiol compound having 2 to 4 thiol groups in one molecule, and a component (C): a photobase generator, in which a mass ratio of the component (A) to the component (B) is 66:34 to 33:67, inclusive, a functional group equivalent of the component (A) is 96 g/eq to 180 g/eq, inclusive, a functional group equivalent of the component (B) is 95 g/eq to 190 g/eq, inclusive, and a content of the component (C) is 0.5 parts by mass to 2 parts by mass with respect to 100 parts by mass of a total of the component (A), the component (B), and the component (C).

Abstract: A photocurable composition contains: a component (A): (meth)acrylic acid ester having 2 to 6 (meth)acryloyl groups in one molecule, a component (B): a thiol compound having 2 to 4 thiol groups in one molecule, and a component (C): a photobase generator, in which a mass ratio of the component (A) to the component (B) is 66:34 to 33:67, inclusive, a functional group equivalent of the component (A) is 96 g/eq to 180 g/eq, inclusive, a functional group equivalent of the component (B) is 95 g/eq to 190 g/eq, inclusive, and a content of the component (C) is 0.5 parts by mass to 2 parts by mass with respect to 100 parts by mass of a total of the component (A), the component (B), and the component (C).

Abstract: Provided is a heat-dissipating resin composition including: a rubber material having an average emissivity of 80% or higher in a wavelength range from 5 ?m to 20 ?m; and a filler having a grain diameter of 15 ?m or smaller and an aspect ratio of 3 to 10, wherein the heat-dissipating resin composition has an emissivity of 90% or higher in the wavelength range from 5 ?m to 20 ?m.

Abstract: Provided herein is a resin structure having high heat dissipation, and desirable adhesion at the interface with a heat generating device. The resin structure is provided on a substrate to dissipates heat of the substrate to outside, and includes: a water-based coating material layer provided on the substrate and including a water-based coating material, and fillers having an average particle size of 30 ?m to 150 ?m; and a resin layer provided on the water-based coating material layer and containing a thermosetting resin. The fillers have a far-infrared emissivity of 0.8 or more, and an average aspect ratio of 1 to 12 as measured as a ratio of lengths along the long axis and the short axis through the center of gravity of the fillers. At least 80% of the total number of fillers has a length that is at least 1.

Abstract: Provided herein is a structure having desirable heat dissipation, particularly a structure having high far-infrared emissivity. An electronic component including such a structure, and an electronic device including the electronic component are also provided. The structure includes a water-based coating material containing inorganic fillers that include a first filler and a second filler. The first filler is an oxide containing at least two elements selected from the group consisting of aluminum, magnesium, and silicon, and has a specific surface area of 7 m2/g to 50 m2/g, and a hydrophobic group on a filler surface. The second filler has a head conductivity of 30 W/m·K or more.

Abstract: Provided herein is a resin structure having high heat dissipation, and desirable adhesion at the interface with a heat generating device. The resin structure is provided on a substrate to dissipates heat of the substrate to outside, and includes: a water-based coating material layer provided on the substrate and including a water-based coating material, and fillers having an average particle size of 30 ?m to 150 ?m; and a resin layer provided on the water-based coating material layer and containing a thermosetting resin. The fillers have a far-infrared emissivity of 0.8 or more, and an average aspect ratio of 1 to 12 as measured as a ratio of lengths along the long axis and the short axis through the center of gravity of the fillers. At least 80% of the total number of fillers has a length that is at least 1.

Abstract: An object of the present invention is to provide an anisotropic heat conductive composition comprising: resin; and graphite fillers dispersed into the resin, wherein the graphite fillers each have a maximum diameter A in parallel with a basal plane of each of the graphite fillers and a maximum length C perpendicular to the basal plane, an average of the maximum diameters A ranges from 1 ?m to 300 ?m, an average ratio of the maximum diameter A to the maximum length C represented by A/C is at least 30, a content of the graphite fillers is 20 mass % to 40 mass %, and an average of a smaller angle made by the basal plane and a sheet surface of the sheet anisotropic heat conductive composition is less than 15°.

Abstract: A cooling structure can efficiently reduce heat, thereby suppressing temperature elevation in heat-producing electronic apparatuses, without using a heat sink or water-cooling jacket, and which can achieve their downsizing or weight reduction. The cooling structure includes: a heat conduction layer which is formed by coating a first paste on a surface of a heat-producing object; and a heat radiation layer which is formed by coating a second paste on a surface of the heat conduction layer. The heat conduction layer includes a first resin and a first filler, and a heat conductivity ? of the heat conduction layer is 1.0 W/(m·K) or more. The heat radiation layer includes a second resin and a second filler, and an infrared emissivity ? of the heat radiation layer is 0.7 or more.

Abstract: Provided is a heat-dissipating resin composition including: a rubber material having an average emissivity of 80% or higher in a wavelength range from 5 ?m to 20 ?m; and a filler having a grain diameter of 15 ?m or smaller and an aspect ratio of 3 to 10, wherein the heat-dissipating resin composition has an emissivity of 90% or higher in the wavelength range from 5 ?m to 20 ?m.

Abstract: A cooling structure can efficiently reduce heat, thereby suppressing temperature elevation in heat-producing electronic apparatuses, without using a heat sink or water-cooling jacket, and which can achieve their downsizing or weight reduction. The cooling structure includes: a heat conduction layer which is formed by coating a first paste on a surface of a heat-producing object; and a heat radiation layer which is formed by coating a second paste on a surface of the heat conduction layer. The heat conduction layer includes a first resin and a first filler, and a heat conductivity A of the heat conduction layer is 1.0 W/(m·K) or more. The heat radiation layer includes a second resin and a second filler, and an infrared emissivity ? of the heat radiation layer is 0.7 or more.

Abstract: An object of the present invention is to provide an anisotropic heat conductive composition comprising: resin; and graphite fillers dispersed into the resin, wherein the graphite fillers each have a maximum diameter A in parallel with a basal plane of each of the graphite fillers and a maximum length C perpendicular to the basal plane, an average of the maximum diameters A ranges from 1 ?m to 300 ?m, an average ratio of the maximum diameter A to the maximum length C represented by A/C is at least 30, a content of the graphite fillers is 20 mass % to 40 mass %, and an average of a smaller angle made by the basal plane and a sheet surface of the sheet anisotropic heat conductive composition is less than 15°.