Abstract: A chip package includes: a substrate having a first and a second surface; a device region and a pad disposed on the first surface; a hole extending from the second surface to the pad; an insulating layer located on a sidewall of the hole; a carrier substrate located on the second surface; a first redistribution layer located between the carrier substrate and the insulating layer and located in the hole to electrically contact with the pad, wherein an edge of the first redistribution layer is exposed on a sidewall formed by the carrier substrate and the insulating layer; a second redistribution layer located on the carrier substrate, extending towards the second surface, and contacting the exposed edge of the first redistribution layer; and a buffer layer located on or below the second surface of the substrate and located between the second redistribution layer and the substrate.

Abstract: A chip package includes: a substrate having a first and a second surface; a device region and a pad disposed on the first surface; a hole extending from the second surface to the pad; an insulating layer located on a sidewall of the hole; a carrier substrate located on the second surface; a first redistribution layer located between the carrier substrate and the insulating layer and located in the hole to electrically contact with the pad, wherein an edge of the first redistribution layer is exposed on a sidewall formed by the carrier substrate and the insulating layer; a second redistribution layer located on the carrier substrate, extending towards the second surface, and contacting the exposed edge of the first redistribution layer; and a buffer layer located on or below the second surface of the substrate and located between the second redistribution layer and the substrate.

Abstract: A chip package includes: a substrate having a first and a second surface; a device region and a pad disposed on the first surface; a hole extending from the second surface to the pad; an insulating layer located on a sidewall of the hole; a carrier substrate located on the second surface; a first redistribution layer located between the carrier substrate and the insulating layer and located in the hole to electrically contact with the pad, wherein an edge of the first redistribution layer is exposed on a sidewall formed by the carrier substrate and the insulating layer; a second redistribution layer located on the carrier substrate, extending towards the second surface, and contacting the exposed edge of the first redistribution layer; and a buffer layer located on or below the second surface of the substrate and located between the second redistribution layer and the substrate.

Abstract: The present invention relates to an anticancer drug, an energized fusion protein Anti-CD20(Fab)-LDM of lidamycin, a gene encoding the same; and further relates to a method for construction of the energized fusion protein in a genetic engineering manner and the use of the energized fusion protein. The applicant provides an anti-tumor drug with a good targeting ability by providing the energized fusion protein.

Abstract: The present invention relates to a method for preparing plastic particles coated with metal, which comprises the following steps. First, mix a plurality of plastic particles with a tin/palladium solution to form a first mixed liquid. Alternatively, first mix the plurality of plastic particles with a stannous chloride/hydrochloric acid solution. Then mix the plurality of plastic particles adsorbing the plurality of stannous ions with a palladium chloride/hydrochloric acid solution and form the first mixed liquid. Next, microwave the first mixed liquid so that the tin/palladium colloidal particles coat the plastic particles and thus forming first metal particles. Afterwards, mix the first metal particles with an electroless nickel solution and form a second mixed liquid. Metal nickel then coats the first metal particles and forming a plurality of second metal particles.

Abstract: Provided is an electrical connector including an insulative housing having a main body and a pair of tongue plates perpendicular extending from said main body along a mating direction. Said tongue plates are parallel to each other and each defines a plurality of terminal grooves thereon. A plurality of terminals are received in the terminal grooves. A metallic shell is retained on the main body of the insulative housing and encloses said pair of tongue plates thereby defining a mating opening therein. The mating opening defines a first and a second different interfaces in communication with each other. At least a partition portion protrudes toward the mating opening from said main body and defines a bottom surface to act as a top wall of the second interface.

Abstract: A receptacle connector comprises an insulative housing having a base portion; a plurality of terminals retained in the insulative housing; a shielding shell assembled on the base portion of the insulative housing and defined a mating cavity. A reinforced bracket includes a main portion attached to a bottom of the shielding shell and a pair of mounting portions extending from two ends of the main portion. Therefore, overall rigidity of the receptacle connector may be increased.

Abstract: A chip package includes: a substrate having a first and a second surface; a device region and a pad disposed on the first surface; a hole extending from the second surface to the pad; an insulating layer located on a sidewall of the hole; a carrier substrate located on the second surface; a first redistribution layer located between the carrier substrate and the insulating layer and located in the hole to electrically contact with the pad, wherein an edge of the first redistribution layer is exposed on a sidewall formed by the carrier substrate and the insulating layer; a second redistribution layer located on the carrier substrate, extending towards the second surface, and contacting the exposed edge of the first redistribution layer; and a buffer layer located on or below the second surface of the substrate and located between the second redistribution layer and the substrate.

Abstract: A low profile connector for mounting on a PCB comprising: an insulative housing, a plurality of terminals, a shielding shell and an auxiliary member. Each terminal is provided with a contacting section and a solder portion extending beyond insulative housing for connecting with the PCB. The shielding shell defines a mating opening surrounding the contact portion, and the auxiliary member defines a main portion attached to a bottom surface of the shielding shell and at least one horizontal portion located at one end thereof for mounting on an upper surface of the PCB. The shielding shell further includes a vertical portion perpendicular to the horizontal portion for inserting a hole of the PCB, and the horizontal portion of the auxiliary member has a concavity for receiving the vertical portion which decreasing space that the connector located on the PCB.

Abstract: An electrical connector includes an insulative housing (1) with a rear portion (11) and a front portion (12) along a first direction (A), a spacer (4) assembled on the rear portion (11) which has a plurality of first wedged positioning sections (42, 43) in an inner side thereof and arranged along a second direction (B) and a plurality of contacts (2) received in the insulative housing and comprising a soldering portion (203) extending out of the insulative housing. The spacer (4) includes a plurality of positioning grooves (45) in an external side thereof for receiving and positioning the soldering portions (203c) of one part contacts (23) located at an upper side of the front portion (12). The soldering portions (203a, 203b) of the other contacts (21a, 21b) are sandwiched between the spacer (4) and the rear portion (11) thereby forms a waved configuration.

Abstract: The present invention relates to an epoxy resin compound, a preparation method thereof, a prepreg made therefrom, and a copper cladded laminate made therefrom. The epoxy resin compound comprises: 30-80 parts by weight of epoxy resin; 20-50 parts by weight of polyphenylene ether resin of new structure with the number average molecular weight thereof being 1000-5000, which is prepared via the redistribution reaction of polyphenylene ether and phenolic resin with the existing of initiator agent; 0-50 parts by weight of filler; 1-20 parts by weight of ingredient. The epoxy resin compound of the present invention, has good heat resistance and dielectric property, and has a simple preparation process, which is good for batch production.

Abstract: A low profile connector for mounting on a PCB comprising: an insulative housing, a plurality of terminals, a shielding shell and an auxiliary member. Each terminal is provided with a contacting section and a solder portion extending beyond insulative housing for connecting with the PCB. The shielding shell defines a mating opening surrounding the contact portion, and the auxiliary member defines a main portion attached to a bottom surface of the shielding shell and at least one horizontal portion located at one end thereof for mounting on an upper surface of the PCB. The shielding shell further includes a vertical portion perpendicular to the horizontal portion for inserting a hole of the PCB, and the horizontal portion of the auxiliary member has a concavity for receiving the vertical portion which decreasing space that the connector located on the PCB.

Abstract: An electrical connector includes: an insulating housing defining a mounting face for being mounted on a PCB and a pair of engaging portions at two opposite ends of the insulating housing; a number of contacts retained in the insulating housing; a metal shell assembled on the insulating housing along an assembly direction slanting to the mounting face, the metal shell having a locking portion with a gap through which the engaging portion is inserted in the locking portion and a stopper portion. The stopper portion exceeds the mounting face when the metal shell assembled on the insulating housing along the assembly direction before the electrical connector is mounted on the PCB, while the stopper portion is pressed by the PCB to offset the assembly direction when the electrical connector is mounted on the PCB so as to prevent the engaging portion from deflecting from the locking portion through the gap.

Abstract: A receptacle connector comprising an insulative housing having a base portion; a plurality of terminals retained in the insulative housing; and a shielding shell assembled on the insulative housing. The shielding shell comprises a pair of sidewalls opposite to each other and forming a mating cavity therebetween. The insulative housing further including an alignment wall extending into the mating cavity from the base portion to partition the mating cavity into a number of mating openings, one of the mating opening having a shape different from another. Wherein at least one of the sidewalls has a bent portion bent from a front edge thereof, and the bent portion defines a hook at the tip thereof for adapting to retention at least one hole of the alignment wall of the insulative housing. Therefore, the strength of the receptacle connector may be improved.

Abstract: An electrical connector includes an insulative housing (1) with a rear portion (11) and a front portion (12) along a first direction (A), a spacer (4) assembled on the rear portion (11) which has a plurality of first wedged positioning sections (42, 43) in an inner side thereof and arranged along a second direction (B) and a plurality of contacts (2) received in the insulative housing and comprising a soldering portion (203) extending out of the insulative housing. The spacer (4) includes a plurality of positioning grooves (45) in an external side thereof for receiving and positioning the soldering portions (203c) of one part contacts (23) located at an upper side of the front portion (12). The soldering portions (203a, 203b) of the other contacts (21a, 21b) are sandwiched between the spacer (4) and the rear portion (11) thereby forms a waved configuration.

Abstract: An electrical connector includes an insulative housing (1) which comprise a pair of side walls (121) and a pair of end walls (122) linking with two ends of the side wall, a plurality of terminals (2) retained in the side wall and a pair of grounding bridges (3) received in the end wall. Each of the grounding bridge comprise a contacting part (31) engaging with a mating connector, a grounding part (32) and a conducting part (33) mechanically connecting with the contacting part and grounding part. And the conductive part (33) has a larger resistance compared with the contacting part and the grounding part. Therefore, the power current transmitting through the guiding bridge (3) can be lower.

Abstract: An electrical connector includes an insulative housing (3), a plurality of terminals (4) retained in the housing and a slider (5) moveably assembled to the housing. The terminal (4) has a first arm (42) and a second arm (43) both protruding into a mating room (34) defined by the insulative housing. The slider defines an urging portion (52) for driving a flexible printed circuit board engaging with the terminals when the slider moving to a closed position from an opened position. The urging portion has a first contacting surface (521) and a second contacting surface (522) at same side thereof. The first contacting surface is located closer to the first arm than the second contacting surface at a vertical direction. The second arm is located below the first contacting surface at said opened position and engaging with the second contacting surface at said closed position.

Abstract: An electrical connector includes an insulating housing (1a) including a pair of retaining spacers (1b) embedded therein and a number of terminals (2). The insulating housing has a base portion (11) with a concaving room (110) and an engaging portion (12). The terminal (2) defines a retaining portion (21) retained in the base portion, a contacting portion (22) projecting in the engaging portion and a leg portion (23). The retaining spacers are received in the concaving room and press against the retaining portions of the terminals.

Abstract: An electrical connector includes an insulating housing (1a) including a pair of retaining spacers (1b) embedded therein and a number of terminals (2). The insulating housing has a base portion (11) with a concaving room (110) and an engaging portion (12). The terminal (2) defines a retaining portion (21) retained in the base portion, a contacting portion (22) projecting in the engaging portion and a leg portion (23). The retaining spacers are received in the concaving room and press against the retaining portions of the terminals.

Abstract: An electrical connector includes: an insulating housing defining a mounting face for being mounted on a PCB and a pair of engaging portions at two opposite ends of the insulating housing; a number of contacts retained in the insulating housing; a metal shell assembled on the insulating housing along an assembly direction slanting to the mounting face, the metal shell having a locking portion with a gap through which the engaging portion is inserted in the locking portion and a stopper portion. The stopper portion exceeds the mounting face when the metal shell assembled on the insulating housing along the assembly direction before the electrical connector is mounted on the PCB, while the stopper portion is pressed by the PCB to offset the assembly direction when the electrical connector is mounted on the PCB so as to prevent the engaging portion from deflecting from the locking portion through the gap.