Patents by Inventor Hong Jong JUNG

Hong Jong JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240177972
    Abstract: Provided is a method for etching an atomic layer. The method for etching the atomic layer includes providing a substrate to a process chamber, wherein the process chamber comprises a first chamber part and a second chamber part, and the substrate is provided in the second chamber part, generating adsorption gas plasma in the first chamber part, adsorbing radicals of the adsorption gas plasma to the substrate so as to form a treatment layer, generating etching gas plasma in the first chamber part, and allowing electrons and ions of the etching gas plasma to be alternately incident into the treatment layer so as to perform desorption of the treatment layer.
    Type: Application
    Filed: November 1, 2023
    Publication date: May 30, 2024
    Applicants: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY, IUCF-HYU (Industry-University Cooperation Foundation Hanyang University)
    Inventors: Geun Young YEOM, Chin Wook CHUNG, Yun Jong JANG, Doo San KIM, Ye Eun KIM, Hong Seong GIL, Hae In KWON, Jun Young PARK, Ji Won JUNG
  • Patent number: 11961720
    Abstract: Disclosed herein is a multi-channel device for detecting plasma at an ultra-fast speed, including: a first antenna module connected to a first output terminal in contact with a substrate on a chuck of a process chamber and extending to ground, and receiving a first leakage current leaking through the substrate to increase reception sensitivity of the leakage current; a first current detection module detecting the first leakage current; a current measurement module receiving the first leakage current output from the first current detection module, and extracting the received first leakage current for each predetermined period to generate a first leakage current measurement information; and a control module comparing the first leakage current measurement information with a reference value to generate first arcing occurrence information.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: April 16, 2024
    Assignee: T.O.S Co., Ltd.
    Inventors: Yong Kyu Kim, Bum Ho Choi, Yong Sik Kim, Kwang Ki Kang, Hong Jong Jung, Seok Ho Lee, Seung Soo Lee
  • Publication number: 20220223389
    Abstract: Disclosed herein is a multi-channel device for detecting plasma at an ultra-fast speed, including: a first antenna module connected to a first output terminal in contact with a substrate on a chuck of a process chamber and extending to ground, and receiving a first leakage current leaking through the substrate to increase reception sensitivity of the leakage current; a first current detection module detecting the first leakage current; a current measurement module receiving the first leakage current output from the first current detection module, and extracting the received first leakage current for each predetermined period to generate a first leakage current measurement information; and a control module comparing the first leakage current measurement information with a reference value to generate first arcing occurrence information.
    Type: Application
    Filed: October 12, 2021
    Publication date: July 14, 2022
    Inventors: Yong Kyu KIM, Bum Ho CHOI, Yong Sik KIM, Kwang ki KANG, Hong Jong JUNG, Seok Ho LEE, Seung Soo LEE