Patents by Inventor HONG JUAN CUI

HONG JUAN CUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140340913
    Abstract: The present invention discloses a LED light bulb, comprising: a LED printed circuit board, a sealed body and a base. The sealed body made of two thermoplastic parts form vapor transport channel inside the body that extends between two heat transfer locations spaced apart on an exterior surface of the body, a wick or a plurality of grooves in the vapor transport channel wall that extends between the two heat transfer locations, and a working fluid that partially fills the vapor transport channel. In a method of making this LED light bulb, the two thermoplastic parts are desirably formed together as a seamless monolithic structure, the LED printed circuit board is bent, mounted and fixed on the sealed body. With the apparatus and manufacturing method introduced by present invention, the LED light bulb would be ease for manufacturing, heat dissipation effective and cost effective. The sealed body transfers heat as a conventional heat pipe.
    Type: Application
    Filed: May 18, 2013
    Publication date: November 20, 2014
    Inventor: HONG JUAN CUI