Patents by Inventor Hong-Ming Wu

Hong-Ming Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240151972
    Abstract: An augmented reality (AR) display is provided. The display comprises a light field generator and a birdbath eyepiece. The light field generator generates a light field as an output. The birdbath eyepiece connects to the light field generator for receiving and projecting the light field to human eye. The birdbath eyepiece comprises a beam splitter and a combiner. The combiner has a curved surface. Each beam of the light field is split into two beams by the beam splitter with one of the split beams reflected by the combiner. Three states-of-use of the birdbath eyepiece are provided for the near-eye light field AR display to transmit the light field to the human eye. A low f-number (or focal ratio) and a large eyebox are obtained to effectively expand the field of view and increase the volume of space within which the human eye can receive the light field.
    Type: Application
    Filed: July 27, 2023
    Publication date: May 9, 2024
    Inventors: Chao-Chien Wu, Jiun-Woei Huang, Hong-Ming Chen
  • Patent number: 11942541
    Abstract: A semiconductor device including a substrate, a source region, a drain region, a first gate structure and a second gate structure is provided. The source region and a drain region are formed in the substrate. The first gate structure is formed on the substrate and adjacent to the source region. The second gate structure is formed on the substrate and adjacent to the drain region. The second gate structure is electrically coupled to the drain region.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Hong-Shyang Wu, Kuo-Ming Wu
  • Publication number: 20240096975
    Abstract: A semiconductor structure is disclosed. The semiconductor structure includes: a substrate; a gate structure formed on the substrate; a source region and a drain region formed in the substrate on either side of the gate structure, the source region and the drain region both having a first type of conductivity; and a dielectric layer having a first portion and a second portion, wherein the first portion of the dielectric layer is formed on a portion of the gate structure, and the second portion of the dielectric layer is formed on the substrate and extending to a portion of the drain region, wherein the dielectric layer includes at least one recess on the second portion. An associated fabricating method is also disclosed.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Hong-Shyang WU, Kuo-Ming WU
  • Publication number: 20230290842
    Abstract: A method according to the present disclosure includes receiving a workpiece including a gate structure, a first source/drain (S/D) feature, a second S/D feature, a first dielectric layer over the gate structure, the first S/D feature, the second S/D feature, a first S/D contact over the first S/D feature, a second S/D contact over the second S/D feature, a first etch stop layer (ESL) over the first dielectric layer, and a second dielectric layer over the first ESL, forming a S/D contact via through the second dielectric layer and the first ESL to couple to the first S/D contact, forming a gate contact opening through the second dielectric layer, the first ESL, and the first dielectric layer to expose the gate structure, and forming a common rail opening adjoining the gate contact opening to expose the second S/D contact, and forming a common rail contact in the common rail opening.
    Type: Application
    Filed: May 15, 2023
    Publication date: September 14, 2023
    Inventors: Cheng-Wei Chang, Hong-Ming Wu, Chen-Yuan Kao, Li-Hsiang Chao, Yi-Ying Liu
  • Patent number: 11652149
    Abstract: A method according to the present disclosure includes receiving a workpiece including a gate structure, a first source/drain (S/D) feature, a second S/D feature, a first dielectric layer over the gate structure, the first S/D feature, the second S/D feature, a first S/D contact over the first S/D feature, a second S/D contact over the second S/D feature, a first etch stop layer (ESL) over the first dielectric layer, and a second dielectric layer over the first ESL, forming a S/D contact via through the second dielectric layer and the first ESL to couple to the first S/D contact, forming a gate contact opening through the second dielectric layer, the first ESL, and the first dielectric layer to expose the gate structure, and forming a common rail opening adjoining the gate contact opening to expose the second S/D contact, and forming a common rail contact in the common rail opening.
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: May 16, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Cheng-Wei Chang, Hong-Ming Wu, Chen-Yuan Kao, Li-Hsiang Chao, Yi-Ying Liu
  • Publication number: 20230029508
    Abstract: Some implementations described herein provide a gas curtain system. The gas curtain system includes various components to prevent a gas flowing within a chamber of an interface tool from flowing through an opening into a transport carrier adjacent to the interface tool. The gas curtain system may include a gas distribution component along an edge of the opening that generates a flow of another gas across the opening towards an opposite edge of the opening. In this way, the gas from the chamber is prevented from entering the transport carrier. By preventing the gas from the chamber from entering the transport carrier, a relative humidity within an environment of the transport carrier is maintained such that condensation of moisture on one or more semiconductor wafers within the transport carrier is mitigated.
    Type: Application
    Filed: May 5, 2022
    Publication date: February 2, 2023
    Inventors: Yu-Syuan TSAI, Chen-Yuan KAO, Chia-Han LAI, Hong-Ming WU, Yu-Chan TSAI, Chun-Hsien HUANG, Ken-Yu CHANG
  • Publication number: 20220052168
    Abstract: A method according to the present disclosure includes receiving a workpiece including a gate structure, a first source/drain (S/D) feature, a second S/D feature, a first dielectric layer over the gate structure, the first S/D feature, the second S/D feature, a first S/D contact over the first S/D feature, a second S/D contact over the second S/D feature, a first etch stop layer (ESL) over the first dielectric layer, and a second dielectric layer over the first ESL, forming a S/D contact via through the second dielectric layer and the first ESL to couple to the first S/D contact, forming a gate contact opening through the second dielectric layer, the first ESL, and the first dielectric layer to expose the gate structure, and forming a common rail opening adjoining the gate contact opening to expose the second S/D contact, and forming a common rail contact in the common rail opening.
    Type: Application
    Filed: December 4, 2020
    Publication date: February 17, 2022
    Inventors: Cheng-Wei Chang, Hong-Ming Wu, Chen-Yuan Kao, Li-Hsiang Chao, Yi-Ying Liu
  • Publication number: 20200343087
    Abstract: The present disclosure describes a method that includes forming a dielectric layer over a contact region on a substrate; etching the dielectric layer to form a contact opening to expose the contact region; and pre-cleaning the exposed contact region to remove a residual material formed by the etching. During the pre-cleaning, the contact region is exposed to an inductively coupled radio frequency (RF) plasma. Also, during the pre-cleaning, a direct current power supply unit (DC PSU) provides a bias voltage to the substrate and a magnetic field is applied to the inductively coupled RF plasma to collimate ions.
    Type: Application
    Filed: July 13, 2020
    Publication date: October 29, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Ting Lin, Chen-Yuan Kao, Rueijer Lin, Yu-Sheng Wang, I-Li Chen, Hong-Ming Wu
  • Patent number: 10714329
    Abstract: The present disclosure describes a method that includes forming a dielectric layer over a contact region on a substrate; etching the dielectric layer to form a contact opening to expose the contact region; and pre-cleaning the exposed contact region to remove a residual material formed by the etching. During the pre-cleaning, the first contact region is exposed to an inductively coupled radio frequency (RF) plasma. Also, during the pre-cleaning, a direct current power supply unit (DC PSU) provides a bias voltage to the substrate and a magnetic field is applied to the inductively coupled RF plasma to collimate ions.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: July 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Ting Lin, Chen-Yuan Kao, Rueijer Lin, Yu-Sheng Wang, I-Li Chen, Hong-Ming Wu
  • Publication number: 20200105519
    Abstract: The present disclosure describes a method that includes forming a dielectric layer over a contact region on a substrate; etching the dielectric layer to form a contact opening to expose the contact region; and pre-cleaning the exposed contact region to remove a residual material formed by the etching. During the pre-cleaning, the first contact region is exposed to an inductively coupled radio frequency (RF) plasma. Also, during the pre-cleaning, a direct current power supply unit (DC PSU) provides a bias voltage to the substrate and a magnetic field is applied to the inductively coupled RF plasma to collimate ions.
    Type: Application
    Filed: September 28, 2018
    Publication date: April 2, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Ting LIN, Chen-Yuan KAO, Rueijer LIN, Yu-Sheng WANG, I-Li CHEN, Hong-Ming WU
  • Patent number: 8942773
    Abstract: A protection case for a portable electronic device includes a case having a front part and a rear part, and the portable electronic device is accommodated between the front and rear parts. A rear cover is connected to the rear part and a front cover is connected to the front part. The front cover has a front decoration plate, a connection member and a locking member. The front decoration plate is removably connected to the front part. The connection member is flexible and has a first end connected to the front decoration plate and a second end of the connection member is clamped between the front and rear parts. The locking member has a hook hooked with the groove. The protection case can be easily replaced and changed.
    Type: Grant
    Filed: July 11, 2011
    Date of Patent: January 27, 2015
    Assignee: Jenn Yaw J. Y. Enterprises Co., Ltd.
    Inventor: Hong-Ming Wu
  • Publication number: 20130015081
    Abstract: A protection case for a portable electronic device includes a case having a front part and a rear part, and the portable electronic device is accommodated between the front and rear parts. A rear cover is connected to the rear part and a front cover is connected to the front part. The front cover has a front decoration plate, a connection member and a locking member. The front decoration plate is removably connected to the front part. The connection member is flexible and has a first end connected to the front decoration plate and a second end of the connection member is clamped between the front and rear parts. The locking member has a hook hooked with the groove. The protection case can be easily replaced and changed.
    Type: Application
    Filed: July 11, 2011
    Publication date: January 17, 2013
    Inventor: Hong-Ming Wu
  • Publication number: 20120231224
    Abstract: A waterproof composite material includes a substrate and a thermoplastic film. The substrate has an inner surface and an outer surface. The thermoplastic film has a waterproof property and has an inner surface and an outer surface. The inner surface of the thermoplastic film and the outer surface of the substrate form thermal fusion. When the thermoplastic film and the substrate are thermally fused together, a pressure is applied to the outer surface of the thermoplastic film. According to the above-mentioned structure, the firm combination, the smooth surface, the simple and quick manufacturing processes and the reduction of environment contamination can be obtained.
    Type: Application
    Filed: March 11, 2011
    Publication date: September 13, 2012
    Inventor: Hong-Ming Wu
  • Publication number: 20110173365
    Abstract: A rotary display stage includes a display ground, an integrated circuit device, and a data transmission port. The display ground includes a base, and a rotary table arranged on the base. The base has a sound-effect switch structure and a track switch structure. The integrated circuit device is disposed inside the base, and includes an amplifier structure and a storage media. The data transmission port is arranged on the display ground and communicated with an exterior device optionally. The sound-effect switch structure, the track switch structure and the data transmission port electrically connect the integrated circuit device. Therefore, various audio data, except the tracks saved in the storage media previously, could optionally be played on via the data transmission port.
    Type: Application
    Filed: December 27, 2010
    Publication date: July 14, 2011
    Applicant: JENN YAW J.Y. ENTERPRISES CO., LTD.
    Inventor: Hong-Ming Wu
  • Patent number: 7454819
    Abstract: A zipper tab assembly has a connecting member, a clamping member and a decorative tab. The connecting member has a through hole, an engaging channel and two engaging holes. The clamping member is detachably attached to the connecting member and has a resilient loop and two engaging ears. The resilient loop has a clamping space and an opening communicating with the clamping space. The engaging ears are formed on the resilient loop at two sides of the opening and are detachably mounted in the engaging channel in the connecting member. Each engaging ear has a protrusion extending into and engaging with one of the engaging holes in the connecting member. The decorative tab is mounted in and clamped inside the clamping space of the resilient loop.
    Type: Grant
    Filed: November 3, 2006
    Date of Patent: November 25, 2008
    Assignee: Jenn Yaw J. Y. Enterprises Co., Ltd.
    Inventor: Hong-Ming Wu
  • Publication number: 20080104806
    Abstract: A zipper tab assembly has a connecting member, a clamping member and a decorative tab. The connecting member has a through hole, an engaging channel and two engaging holes. The clamping member is detachably attached to the connecting member and has a resilient loop and two engaging ears. The resilient loop has a clamping space and an opening communicating with the clamping space. The engaging ears are formed on the resilient loop at two sides of the opening and are detachably mounted in the engaging channel in the connecting member. Each engaging ear has a protrusion extending into and engaging with one of the engaging holes in the connecting member. The decorative tab is mounted in and clamped inside the clamping space of the resilient loop.
    Type: Application
    Filed: November 3, 2006
    Publication date: May 8, 2008
    Applicant: JENN YAW J. Y. ENTERPRISES CO., LTD.
    Inventor: Hong-Ming WU