Patents by Inventor Hong Rae Joh

Hong Rae Joh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ti-included oxide dispersion strengthened copper alloy and method for manufacturing dispersed copper
    Patent number: 9972410
    Abstract: The present invention relates to a Ti-included oxide dispersion strengthened copper alloy and a method for preparing oxide dispersion copper by an internal oxidation Ti-included copper alloy, which thus allows spheronization and refinement of the oxides, and reduction of distance between the oxides. According to the present invention, there is provided oxide dispersion copper having excellent hardness and tensile strength as well as electrical conductivity by performing spheronization and refinement for Ti-included oxide and thus further reducing the distance between oxides.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: May 15, 2018
    Assignees: KOREA INSTITUTE OF MACHINERY & MATERIALS, GLOBAL FRONTIER HYBRID INTERFACE MATERIALS
    Inventors: Seung Zeon Han, Hong Rae Joh, Jee Hyuk Ahn, Kwang Ho Kim
  • Ti-INCLUDED OXIDE DISPERSION STRENGTHENED COPPER ALLOY AND METHOD FOR MANUFACTURING DISPERSED COPPER
    Publication number: 20160189820
    Abstract: The present invention relates to a Ti-included oxide dispersion strengthened copper alloy and a method for preparing oxide dispersion copper by an internal oxidation Ti-included copper alloy, which thus allows spheronization and refinement of the oxides, and reduction of distance between the oxides. According to the present invention, there is provided oxide dispersion copper having excellent hardness and tensile strength as well as electrical conductivity by performing spheronization and refinement for Ti-included oxide and thus further reducing the distance between oxides.
    Type: Application
    Filed: April 23, 2015
    Publication date: June 30, 2016
    Inventors: Seung Zeon Han, Hong Rae Joh, Jee Hyuk Ahn, Kwang Ho Kim