Abstract: The present invention relates to an integrated connector and a heat exchanger including the same, in which a connector main body is formed by pressing one pipe, a cap is press-fitted into the connector main body, such that the integrated connector is formed so that an interior of the connector main body is blocked by the cap. Therefore, the number of components used to manufacture a connector, which connects and securely couples a header tank and a gas-liquid separator, may be reduced, the integrated connector may be easily manufactured, and a brazing defect may be reduced at portions where the integrated connector is joined to the header tank and the gas-liquid separator of the heat exchanger.

Abstract: One aspect of the present disclosure is a pharmaceutical composition which includes (R)—N-[1-(3,5-difluoro-4-methansulfonylamino-phenyl)-ethyl]-3-(2-propyl-6-trifluoromethyl-pyridin-3-yl)-acrylamide as a first component and a cellulosic polymer as a second component, wherein the composition of one aspect of the present disclosure has a formulation characteristic in which crystal formation is delayed for a long time.

Abstract: A multilayer ceramic electronic component includes a ceramic body comprising dielectric layers and first and second internal electrodes laminatedly disposed in a third direction with respective dielectric layers interposed therebetween, and first electrode and second external electrodes disposed on both surfaces of the ceramic body in the first direction and electrically connected to the first and second internal electrodes. When an absolute value of a horizontal angle in the second direction of the first internal electrode with respect to the first surface of the ceramic body is referred to a first angle of the internal electrode, a total sum of the first angles is less than 10°.

Abstract: A method of preparing a positive electrode active material having a high ratio of charge and discharge capacity at a charge end voltage of 4.1 V to 4.175 V to charge and discharge capacity at a charge end voltage of 4.2 V to 4.275 V and having an excellent initial charge and discharge capacity is provided.

Abstract: A method and a system thereof for producing a digital holographic screen based on multi-hogel printing are proposed. The system includes a light source unit including lasers, a dichroic mirror for RGB three color matching, mirrors, a beam splitter, and an optical shutter, an object beam unit including a spatial filter, a lens, and a mirror, a reference beam unit including a spatial filter, a lens, and a mirror, a diffuser fixing unit including a diffuser holder and a diffuser positioned between the object beam unit and a recording material and configured to scatter and diffuse the object beam, a photomask movement unit including a photomask holder, an XY-translation stage, and a photomask positioned between the reference beam unit and the recording medium and on which a grid-shaped on/off binary pattern is printed, and a controller configured to control the optical shutter and the XY-translation stage.

Abstract: A multilayer capacitor includes a capacitor body having an active region, upper and lower cover regions, and width margins on opposing sides of the active region. The width margin includes a first region on an internal side thereof adjacent the first and second internal electrodes and a second region on an external side between the first region and a respective external surface of the capacitor body, and he upper and lower cover regions each include a third region on an internal side thereof adjacent the internal electrodes and a fourth region on an external side between the third region and a respective external surface of the capacitor body. The active region, the second region, and the fourth region have a same dielectric constant A, and the first and third regions have a same dielectric constant B, and A and B are different from each other and satisfy 0.5?B/A.

Abstract: The present disclosure relates to a secondary battery manufacturing system having a multi-packaging unit, in which multiple packaging units of a secondary battery manufacturing facility are provided and a transfer box on which an electrode assembly is accommodated is transferred to each packaging unit by a transfer unit, wherein the secondary battery manufacturing system includes: an electrode supply unit equipped with a plurality of stacking devices for supplying an electrode assembly in which a plurality of battery cells are stacked; a tab-welding unit; at least one packaging unit; at least one temporary buffer; and a transfer unit.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes having different sizes to each other, and having first and second surfaces of the first and second internal electrodes, opposing each other in a stacking direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces and connected to the third and fourth surfaces, and opposing each other; and first and second external electrodes.

Abstract: A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region, in which electrode layers are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between an electrode layer and a conductive resin layer of an external electrode, and thus, may improve bending strength and humidity resistance reliability.

Abstract: An object of the present invention is to provide a heat exchanger that is structurally coupled to an endplate without a process of welding a connection member. To achieve the above-mentioned object, a heat exchanger according to the present invention may include a plurality of main plates each including a through-hole through which a heat exchange medium flows, and an outer wall formed at a periphery thereof, the plurality of main plates being stacked to constitute a heat exchanger core having a flow path formed therein, an endplate being in surface contact with the main plate disposed at an outermost side of the heat exchanger core, the endplate having one or more connection holes, and a connection member configured to be connected to an external component and at least partially inserted into the connection hole.

Abstract: The present disclosure relates to a secondary battery manufacturing system in which a packaging unit of a secondary battery manufacturing facility are configured to have multiple packaging units, and having a multipackaging unit such that a transfer box in which an electrode assembly is seated is transferred to each of the packaging units by a transfer unit, and including an electrode supply unit having a plurality of stacking devices supplying an electrode assembly in which a plurality of battery cells are stacked, a tab welding unit, at least one packaging unit, at least one temporary buffer, and a transfer unit.

Abstract: A semiconductor device, and method of manufacturing a semiconductor device, includes second conductive patterns separated from each other above a first stack structure which is penetrated by first channel structures and enclosing second channel structures coupled to the first channel structures, respectively. Each of the second conductive patterns includes electrode portions stacked in a first direction and at least one connecting portion extending in the first direction to be coupled to the electrode portions.

Abstract: The present invention relates to a connector provided between a condenser and a receiver driver and configured to fixedly couple the condenser and the receiver driver, and a vehicle heat exchanger including the same, and more particularly, to a connector capable of improving weldability between the receiver dryer side and the connector by means of a pipe-shaped clad plate or a ring-shaped clad seating member, and a vehicle heat exchanger including the same.

Abstract: The present invention relates to a plate-type heat exchanger having a bracket- reinforcing structure. An object of the present invention is to provide a plate-type heat exchanger having a bracket-reinforcing structure that has a reinforcing plate attached to prevent exposure of the plate-type heat exchanger in a region in which a bracket plate of an assembly of the plate-type heat exchanger and the bracket plate is connected to an external device, thereby suppressing the corrosion of the plate-type heat exchanger and improving the durability of the plate-type heat exchanger.

Abstract: A heat exchanger according to the present invention includes plates each having, at one side thereof, an inlet port into which a fluid is introduced, and a first junction port having a periphery protruding upward, and having, at the other side thereof, an outlet port from which the fluid is discharged, and a second junction port having a periphery protruding upward, and a heat dissipation fin seated on an upper surface of the plate and having at least one non-heat dissipation fin portion formed by cutting a predetermined region of the heat dissipation fin in a direction parallel to a direction from one side to the other of the plate, in which the heat dissipation fin may be inserted between the pair of stacked plates.

Abstract: In one example, a semiconductor device can comprise a unit substrate comprising a unit conductive structure and a unit dielectric structure, and an electronic component coupled to the unit conductive structure. The unit substrate can comprise a portion of a singulated subpanel substrate of a panel substrate. Other examples and related methods are also disclosed herein.

Abstract: The present invention relates to a heat exchanger. The purpose of the present invention is to provide a heat exchanger formed to enable two different types of fluids and one other type of fluid to undergo heat exchange with each other, that is, formed to resultingly enable three types of fluids to undergo heat exchange with each other. More specifically, provided is a heat exchanger formed so that two types of coolants having different temperature ranges, such as a coolant for cooling a battery and a coolant for cooling a motor, and one type of refrigerant in an electric vehicle may undergo heat exchange by means of one heat exchanger.

Abstract: In one example, a semiconductor device includes a substrate comprising a conductive structure including internal terminals over a substrate first side and external terminals over a substrate second side coupled to the internal terminals. An electronic component includes an electronic component first side, an electronic component second side opposite to the electronic component first side, and an electronic component lateral side connecting the electronic component first side to the electronic component second side. The electronic component second side is coupled to one or more of the internal terminals. A guide structure is over the substrate first side and can include an inner portion that is laterally inward from the electronic component lateral side and an outer portion that is laterally outward from the electronic component lateral side. An underfill is interposed between the electronic component second side and the substrate first side and is over the guide structure.

Abstract: In one example, a semiconductor device can comprise a unit substrate comprising a unit conductive structure and a unit dielectric structure, and an electronic component coupled to the unit conductive structure. The unit substrate can comprise a portion of a singulated subpanel substrate of a panel substrate. Other examples and related methods are also disclosed herein.

Abstract: A liquid display device includes a cover bottom including a first cover portion of a first direction and a second cover portion of a second direction; a backlight over the cover bottom and including a light source, a diffusion plate, and an optical sheet; a support member maintaining a distance between the light source and the diffusion plate and including a first support portion and a second support portion; and a liquid crystal panel over the backlight and the support member, wherein the support member and the cover bottom are fastened to each other by a plurality of screws, and wherein the first cover portion includes a plurality of protrusions protruding outward from an outer surface of the second cover portion and corresponding to the plurality of screws, respectively.