Abstract: A composite chair adapted for permitting a user to sit thereon. The composite chair includes a base unit and a seat unit. The seat unit includes a seat body that is mounted on the base unit and that is adapted for supporting the user's buttocks, and a pushing member that is fixedly mounted on a rear end of the seat body. The seat body is pivotable relative to the base unit for inclining the pushing member to push the user' s waist forward.

Abstract: The "Temperature compensation method for semiconductor wafers in rapid thermal processor using properly designed heat conducting pads as susceptors" is a new temperature compensation concept suitable for rapid thermal processor without uniform temperature distributions. By proper design of heat conducting pads, one can make the semiconductor wafers have uniform temperature distribution in a non-uniform heated rapid thermal processor. This is a very simple and cheap method for solving the temperature non-uniformity problem in the rapid thermal processor.