Patents by Inventor Hongin Jiang

Hongin Jiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Controlled solder height packages and assembly processes
    Patent number: 9960105
    Abstract: An apparatus comprises a substrate including a surface and a plurality of bonding pads positioned on the surface. The apparatus also includes a material comprising a solder positioned on the bonding pads and extending a distance outward therefrom. A first of the bonding pads in a first location on the substrate surface includes the solder extending a first distance outward therefrom. A second of the bonding pads in a second location on the substrate surface includes the solder extending a second distance outward therefrom. The first distance is different than the second distance. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 29, 2012
    Date of Patent: May 1, 2018
    Assignee: INTEL CORPORATION
    Inventors: Hongin Jiang, Arun Kumar C. Nallani, Wei Tan