Patents by Inventor Hongqing V. Wang

Hongqing V. Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8568646
    Abstract: There is provided methods and apparatus for compensation of intensity profiles of imagers used in three-dimensional modelers. The intensity profile of the actinic radiation projected from the imager is determined by a variety of techniques, including but not limited to manually operated sensors, exposed and scanned actinic radiation-sensitive paper, and intensity profilers. Once the intensity profile of the imager is determined, each layer of the solidifiable liquid material is cured by projecting a plurality of patterns (as opposed to a single pattern) defining the two-dimensional cross-section of the part being cured. The patterns vary in duration, number, and/or shape to correlate to the intensity profile so that a single layer of selectively cured solidifiable liquid material is cured with a substantially equivalent (or otherwise controlled) amount of actinic radiation per unit of surface area to provide generally controlled and consistent part quality.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: October 29, 2013
    Assignee: 3D Systems, Inc.
    Inventors: Hongqing V. Wang, Soon-Chun Kuek, Charles W. Hull, Richard Ora Gregory, II, Thomas Alan Kerekes
  • Patent number: 8285411
    Abstract: Methods for generating supports (30) for parts (50) produced by solid freeform fabrication (“SFF”) are disclosed. The method includes defining a plurality of layers (L) that make up the part, and for each layer, determining those regions (R) that require support. The method also includes merging the regions for the different layers (L) into one or more common regions that require support, and providing at least one support for each of the one or more common regions. The result is that fewer supports are used as compared to conventional SFF fabrication methods.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: October 9, 2012
    Assignee: 3D Systems, Inc.
    Inventors: Charles W. Hull, Rajeev Kulkarni, Medhi Mojdeh, Hongqing V. Wang, John Corbin West
  • Publication number: 20120007288
    Abstract: There is provided methods and apparatus for compensation of intensity profiles of imagers used in three-dimensional modelers. The intensity profile of the actinic radiation projected from the imager is determined by a variety of techniques, including but not limited to manually operated sensors, exposed and scanned actinic radiation-sensitive paper, and intensity profilers. Once the intensity profile of the imager is determined, each layer of the solidifiable liquid material is cured by projecting a plurality of patterns (as opposed to a single pattern) defining the two-dimensional cross-section of the part being cured. The patterns vary in duration, number, and/or shape to correlate to the intensity profile so that a single layer of selectively cured solidifiable liquid material is cured with a substantially equivalent (or otherwise controlled) amount of actinic radiation per unit of surface area to provide generally controlled and consistent part quality.
    Type: Application
    Filed: September 21, 2011
    Publication date: January 12, 2012
    Inventors: Hongqing V. Wang, Soon-Chun Kuek, Charles W. Hull, Richard Ora Gregory, II, Thomas Alan Kerekes
  • Publication number: 20120010741
    Abstract: Methods for generating supports (30) for parts (50) produced by solid freeform fabrication (“SFF”) are disclosed. The method includes defining a plurality of layers (L) that make up the part, and for each layer, determining those regions (R) that require support. The method also includes merging the regions for the different layers (L) into one or more common regions that require support, and providing at least one support for each of the one or more common regions. The result is that fewer supports are used as compared to conventional SFF fabrication methods.
    Type: Application
    Filed: September 21, 2011
    Publication date: January 12, 2012
    Inventors: Charles W. Hull, Rajeev Kulkarni, Medhi Mojdeh, Hongqing V. Wang, John Corbin West
  • Patent number: 8048359
    Abstract: There is provided methods and apparatus for compensation of intensity profiles of imagers used in three-dimensional modelers. The intensity profile of the actinic radiation projected from the imager is determined by a variety of techniques, including but not limited to manually operated sensors, exposed and scanned actinic radiation-sensitive paper, and intensity profilers. Once the intensity profile of the imager is determined, each layer of the solidifiable liquid material is cured by projecting a plurality of patterns (as opposed to a single pattern) defining the two-dimensional cross-section of the part being cured. The patterns vary in duration, number, and/or shape to correlate to the intensity profile so that a single layer of selectively cured solidifiable liquid material is cured with a substantially equivalent (or otherwise controlled) amount of actinic radiation per unit of surface area to provide generally controlled and consistent part quality.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: November 1, 2011
    Assignee: 3D Systems, Inc.
    Inventors: Hongqing V. Wang, Soon-Chun Kuek, Charles W. Hull, Richard Ora Gregory, II, Thomas Alan Kerekes
  • Patent number: 8046097
    Abstract: Methods for generating supports (30) for parts (50) produced by solid freeform fabrication (“SFF”) are disclosed. The method includes defining a plurality of layers (L) that make up the part, and for each layer, determining those regions (R) that require support. The method also includes merging the regions for the different layers (L) into one or more common regions that require support, and providing at least one support for each of the one or more common regions. The result is that fewer supports are used as compared to conventional SFF fabrication methods.
    Type: Grant
    Filed: September 17, 2008
    Date of Patent: October 25, 2011
    Assignee: 3D Systems, Inc.
    Inventors: Charles W. Hull, Rajeev Kulkarni, Medhi Mojdeh, Hongqing V. Wang, John Corbin West
  • Publication number: 20100098835
    Abstract: There is provided methods and apparatus for compensation of intensity profiles of imagers used in three-dimensional modelers. The intensity profile of the actinic radiation projected from the imager is determined by a variety of techniques, including but not limited to manually operated sensors, exposed and scanned actinic radiation-sensitive paper, and intensity profilers. Once the intensity profile of the imager is determined, each layer of the solidifiable liquid material is cured by projecting a plurality of patterns (as opposed to a single pattern) defining the two-dimensional cross-section of the part being cured. The patterns vary in duration, number, and/or shape to correlate to the intensity profile so that a single layer of selectively cured solidifiable liquid material is cured with a substantially equivalent (or otherwise controlled) amount of actinic radiation per unit of surface area to provide generally controlled and consistent part quality.
    Type: Application
    Filed: October 20, 2008
    Publication date: April 22, 2010
    Inventors: Hongqing V. Wang, Soon-Chun Kuek, Charles W. Hull, Richard Ora Gregory, II, Thomas Alan Kerekes
  • Publication number: 20090072447
    Abstract: Methods for generating supports (30) for parts (50) produced by solid freeform fabrication (“SFF”) are disclosed. The method includes defining a plurality of layers (L) that make up the part, and for each layer, determining those regions (R) that require support. The method also includes merging the regions for the different layers (L) into one or more common regions that require support, and providing at least one support for each of the one or more common regions. The result is that fewer supports are used as compared to conventional SFF fabrication methods.
    Type: Application
    Filed: September 17, 2008
    Publication date: March 19, 2009
    Applicant: 3D Systems, Inc.
    Inventors: Charles W. Hull, Rajeev Kulkarni, Medhi Mojdeh, Hongqing V. Wang, John Corbin West