Patents by Inventor Hongshi Zhen

Hongshi Zhen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photosensitive compositions, color filter and microlens derived therefrom
    Patent number: 10915019
    Abstract: Embodiments in accordance with the present invention encompass self-imagable polymer compositions containing a colorant which are useful for forming films that can be patterned to create structures for color filters and microlens having applications in a variety of microelectronic devices, optoelectronic devices and displays, such as for example image sensors. The compositions of this invention can be tailored to form positive tone images for forming an array of images, which can be thermally transformed into an array of microlens. The images thus formed can then be used in color filter applications.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: February 9, 2021
    Assignee: PROMERUS, LLC
    Inventors: Pramod F Kandanarachch, Hongshi Zhen, Larry F Rhodes
  • PHOTOSENSITIVE COMPOSITIONS, COLOR FILTER AND MICROLENS DERIVED THEREFROM
    Publication number: 20180284609
    Abstract: Embodiments in accordance with the present invention encompass self-imagable polymer compositions containing a colorant which are useful for forming films that can be patterned to create structures for color filters and microlens having applications in a variety of microelectronic devices, optoelectronic devices and displays, such as for example image sensors. The compositions of this invention can be tailored to form positive tone images for forming an array of images, which can be thermally transformed into an array of microlens. The images thus formed can then be used in color filter applications.
    Type: Application
    Filed: March 28, 2018
    Publication date: October 4, 2018
    Applicant: PROMERUS, LLC
    Inventors: PRAMOD F. KANDANARACHCH, HONGSHI ZHEN, LARRY F. RHODES
  • Thermally decomposable polymer compositions for forming microelectronic assemblies
    Patent number: 9757818
    Abstract: A thermally decomposable polymer composition comprising a polyester of a dicarboxylic acid and a tertiary cyclohexanediols of Formulae V and VI are disclosed, which are useful in the forming of microelectronic assemblies: a representative example of a dicarboxylic acid is an oxalic acid and representative example of thermally decomposable polyester is the polyester of the formula: wherein m is at least about 100.
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: September 12, 2017
    Assignee: PROMERUS, LLC
    Inventors: W. C. Peter Tsang, Andrew Bell, Hongshi Zhen, Keitaro Seto
  • THERMALLY DECOMPOSABLE POLYMER COMPOSITIONS FOR FORMING MICROELECTRONIC ASSEMBLIES
    Publication number: 20170036308
    Abstract: A thermally decomposable polymer composition comprising a polyester of a dicarboxylic acid and a difunctional tertiary alcohol are disclosed, which are useful in the forming of microelectronic assemblies. A representative example of a composition comprises a thermally decomposable polyester of the formula: wherein m is at least about 100.
    Type: Application
    Filed: October 20, 2016
    Publication date: February 9, 2017
    Applicant: PROMERUS, LLC
    Inventors: W. C. PETER TSANG, ANDREW BELL, HONGSHI ZHEN, KEITARO SETO
  • Thermally decomposable polymer compositions for forming microelectronic assemblies
    Patent number: 9505948
    Abstract: A thermally decomposable polymer composition comprising a polyester containing repeating units of an ester of diglycolic acid and difunctional tertiary alcohol are disclosed, which are useful in the forming of microelectronic assemblies. A representative example of a composition comprises a thermally decomposable polymer of the formula: wherein n is at least about 20, which provides both tackiness and solder fluxing, among other benefits.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: November 29, 2016
    Assignee: PROMERUS, LLC
    Inventors: W. C. Peter Tsang, Andrew Bell, Hongshi Zhen, Keitaro Seto
  • THERMALLY DECOMPOSABLE POLYMER COMPOSITIONS FOR FORMING MICROELECTRONIC ASSEMBLIES
    Publication number: 20150299509
    Abstract: Embodiments in accordance with the present invention relate generally to polymer compositions useful in the forming of microelectronic assemblies, and more specifically to such compositions that encompass a thermally decomposable polymer and that provide both tackiness and solder fluxing.
    Type: Application
    Filed: December 12, 2013
    Publication date: October 22, 2015
    Applicant: PROMERUS, LLC
    Inventors: W. C. PETER TSANG, ANDREW BELL, HONGSHI ZHEN, KEITARO SETO
  • Dielectric materials preparation
    Publication number: 20050089642
    Abstract: A method of preparing an organic polysilica partial condensate using basic and acidic catalysts is provided. Upon curing, such organic polysilica material has improved mechanical properties.
    Type: Application
    Filed: October 27, 2004
    Publication date: April 28, 2005
    Applicant: Rohm and Haas Electronic Materials, L.L.C.
    Inventors: Timothy Adams, Hongshi Zhen, Gregory Prokopowicz, Michael Gallagher