Patents by Inventor Hongwen Yang

Hongwen Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150342090
    Abstract: A connector assembly is provided and includes a circuit board, an elastic connector, a cage, and a heat exchanger. The circuit board includes a heat exchanger opening passing there through. The elastic connector is positioned about the heat exchanger opening. The cage includes a bottom cage with a cage opening facing a first surface of the circuit board. The heat exchanger is positioned on the bottom cage, such that one side of the heat exchanger passes through the cage opening to protrude inside the cage and an opposite side of the heat exchanger passes through the heat exchanger opening to protrude from a second surface of the circuit board opposite to the first surface.
    Type: Application
    Filed: May 21, 2015
    Publication date: November 26, 2015
    Applicant: TYCO ELECTRONICS (SHANGHAI) CO. LTD.
    Inventors: Hongwen Yang, Jian Zhou
  • Publication number: 20150340797
    Abstract: An insulating housing for receiving an electronic apparatus has an upper housing, a lower housing connected to the upper housing, and a device receiving space positioned between the upper housing and the lower housing. Two upper sidewalls are positioned on opposite edges of the upper housing. Two lower sidewalls are positioned on opposite edges of the lower housing, each of the lower sidewalls being connected with one of the upper sidewalls. Each lower sidewall has a first lower sidewall, and a second lower sidewall independent from the first lower sidewall that is positioned proximate to a device receiving end of the insulating housing.
    Type: Application
    Filed: May 20, 2015
    Publication date: November 26, 2015
    Applicant: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Jian Zhou, Hongwen Yang, Xinbo Liu
  • Patent number: 8568171
    Abstract: A stacked electrical connector having an insulation body, a plurality of contacts, an external case, and an internal case. The insulation body includes a pair of plugs and a separation member disposed between the pair of plugs for separating the pair of plugs. The plurality of contacts are disposed on the pair of plugs. The external case encloses the insulation body, while the internal case encloses the separation member. The internal case has at least two support legs extending out of the external case from two sides of the internal case respectively, to secure the electrical connector on a circuit board. By providing the support legs on the internal case, the material cost of the connector can be reduced and the workability of the support legs can be improved.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: October 29, 2013
    Assignee: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Hongwen Yang, Huibin Li, Wei Yao
  • Publication number: 20120135636
    Abstract: A stacked electrical connector having an insulation body, a plurality of contacts, an external case, and an internal case. The insulation body includes a pair of plugs and a separation member disposed between the pair of plugs for separating the pair of plugs. The plurality of contacts are disposed on the pair of plugs. The external case encloses the insulation body, while the internal case encloses the separation member. The internal case has at least two support legs extending out of the external case from two sides of the internal case respectively, to secure the electrical connector on a circuit board. By providing the support legs on the internal case, the material cost of the connector can be reduced and the workability of the support legs can be improved.
    Type: Application
    Filed: November 29, 2011
    Publication date: May 31, 2012
    Inventors: Hongwen Yang, Huibin Li, Wei Yao
  • Patent number: 7900126
    Abstract: Systems and methods for generating check node updates in the decoding of low-density parity-check (LDPC) codes use new approximations in order to reduce the complexity of implementing a LDPC decoder, while maintaining accuracy. The new approximations approximate the standard float-point sum-product algorithm (SPA), and can reduce the approximation error of min-sum algorithm (MSA) and have almost the same performance under 5 bits fix-point realization as the float-point sum-product algorithm (SPA).
    Type: Grant
    Filed: September 27, 2007
    Date of Patent: March 1, 2011
    Assignee: Via Telecom, Inc.
    Inventors: Guohui Sun, Hongwen Yang
  • Patent number: 7895500
    Abstract: Systems and methods for generating check node updates in the decoding of low-density parity-check (LDPC) codes use new approximations in order to reduce the complexity of implementing a LDPC decoder, while maintaining accuracy. The new approximations approximate the standard sum-product algorithm (SPA), and can reduce the approximation error of min-sum algorithm (MSA) and have almost the same performance as sum-product algorithm (SPA) under both floating precision operation and fixed-point operation.
    Type: Grant
    Filed: March 21, 2007
    Date of Patent: February 22, 2011
    Assignee: Via Telecom Co., Ltd.
    Inventors: Guohui Sun, Jing Jin, Wenbin Yao, Hongwen Yang
  • Publication number: 20090224894
    Abstract: A method for configuring a device includes: receiving and demodulating, by an RF processing module, an RF signal comprising configuration data, and storing the configuration data demodulated; reading, by the device to be configured, the configuration data stored in the RF processing module and processing according to the configuration data. An apparatus and system for configuring a device is further disclosed. When configuring devices according to the present invention, it is not necessary to power on the device and not necessary to establish a physical connection between a computer and a device by the user, that is, it is not necessary to contact the device, which makes it possible to configure a packed device without unpacking, and thus the efficiency of configuring the device can be improved.
    Type: Application
    Filed: February 27, 2009
    Publication date: September 10, 2009
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventor: Hongwen YANG
  • Publication number: 20090172495
    Abstract: Methods and apparatuses for parallel decoding and data processing of Turbo codes are provided. The method includes: a codeword dividing step for dividing a whole codeword into Q sub-blocks to form a plurality of boundaries between adjacent sub-blocks of the Q sub-blocks so as to decode the Q sub-blocks, wherein the decoding process comprises P times of decoding iterations, and wherein Q is a positive integer and Q>1 and P is a positive integer and P>1; and a boundary moving step for moving at least one position of the boundaries formed in a pth decoding iteration by an offset ? before performing a (p+n)th decoding iteration, wherein p is a positive integer and 1?p<P, n is a positive integer and 1?n<P?p, and the offset ? is set as a fixed step size.
    Type: Application
    Filed: December 26, 2008
    Publication date: July 2, 2009
    Applicant: VIA TELECOM, INC.
    Inventors: Le Wang, Hongwen Yang, Hong Kui Yang
  • Publication number: 20080082902
    Abstract: Systems and methods for generating check node updates in the decoding of low-density parity-check (LDPC) codes use new approximations in order to reduce the complexity of implementing a LDPC decoder, while maintaining accuracy. The new approximations approximate the standard float-point sum-product algorithm (SPA), and can reduce the approximation error of min-sum algorithm (MSA) and have almost the same performance under 5 bits fix-point realization as the float-point sum-product algorithm (SPA).
    Type: Application
    Filed: September 27, 2007
    Publication date: April 3, 2008
    Applicant: VIA TELECOM, INC.
    Inventors: Guohui Sun, Hongwen Yang
  • Publication number: 20080052558
    Abstract: Systems and methods for generating check node updates in the decoding of low-density parity-check (LDPC) codes use new approximations in order to reduce the complexity of implementing a LDPC decoder, while maintaining accuracy. The new approximations approximate the standard sum-product algorithm (SPA), and can reduce the approximation error of min-sum algorithm (MSA) and have almost the same performance as sum-product algorithm (SPA) under both floating precision operation and fixed-point operation.
    Type: Application
    Filed: March 21, 2007
    Publication date: February 28, 2008
    Applicant: VIA TELECOM CO., LTD.
    Inventors: Guohui Sun, Jing Jin, Wenbin Yao, Hongwen Yang