Patents by Inventor Hooi Teng

Hooi Teng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE WARPAGE CONTROL
    Publication number: 20070155059
    Abstract: A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate.
    Type: Application
    Filed: March 16, 2007
    Publication date: July 5, 2007
    Applicant: Intel Corporation
    Inventors: Michael Lee, Mun Loke, Soon Ong, Hooi Teng, Lisa Lee, Altaf Hasan
  • Package warpage control
    Publication number: 20050266607
    Abstract: A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate.
    Type: Application
    Filed: May 27, 2004
    Publication date: December 1, 2005
    Applicant: Intel Corporation
    Inventors: Michael Lee, Mun Loke, Soon Ong, Hooi Teng, Lisa Hui Lee, Altaf Hasan