Patents by Inventor Hoon-Eui Jeong

Hoon-Eui Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120034390
    Abstract: Disclosed is a method of forming a hierarchical microstructure using partial curing, which is simple in the manufacturing process and capable of forming a hierarchical structure without heterogeneous interfaces. To this end, there is provided a method of forming a hierarchical microstructure using partial curing, including forming a first polymer pattern having partial curing layers and forming a second polymer pattern on the first polymer pattern by using the partial curing layers. According to the present invention, a microstructure having various hierarchical structures can be formed by using a simple process. Accordingly, efficiency in various processes in which a microstructure having various hierarchical structures needs to be formed and economic efficiency can be improved. Furthermore, new functional materials, having not only super hydrophobicity, but also a high adhesive property even in a rough surface, can be developed.
    Type: Application
    Filed: April 20, 2009
    Publication date: February 9, 2012
    Inventors: Kahp Yang Suh, Hoon Eui Jeong, No Kyun Kwak
  • Patent number: 7632417
    Abstract: Provided is a method of forming a nanostructure having a nano-sized diameter and a high aspect ratio through a simple and economical process. To form the nanostructure, a polymer thin film is formed on a substrate and a mold is brought to contact the polymer thin film. Then, a polymer patterning is formed to contact the background surface of an engraved part of the mold, and then the polymer pattern is extended out by removing the mold out of the polymer thin film. The nanostructure forming method of the present research can reproduce diverse cilia optimized in the natural world. Also, it can be used to develop new materials with an ultra-hydrophobic property or a high adhesiveness. Further, it can be applied to a nanopattern forming process for miniaturizing electronic devices and to various ultra-precise industrial technologies together with carbon nanotube, which stands in the highlight recently.
    Type: Grant
    Filed: November 7, 2005
    Date of Patent: December 15, 2009
    Assignee: Seoul National University Industry Foundation
    Inventors: Kahp-Yang Suh, Hoon-Eui Jeong
  • Publication number: 20080000871
    Abstract: Provided is a method of forming a nanostructure having a nano-sized diameter and a high aspect ratio through a simple and economical process. To form the nanostructure, a polymer thin film is formed on a substrate and a mold is brought to contact the polymer thin film. Then, a polymer patterning is formed to contact the background surface of an engraved part of the mold, and then the polymer pattern is extended out by removing the mold out of the polymer thin film. The nanostructure forming method of the present research can reproduce diverse cilia optimized in the natural world. Also, it can be used to develop new materials with an ultra-hydrophobic property or a high adhesiveness. Further, it can be applied to a nanopattern forming process for miniaturizing electronic devices and to various ultra-precise industrial technologies together with carbon nanotube, which stands in the highlight recently.
    Type: Application
    Filed: November 7, 2005
    Publication date: January 3, 2008
    Inventors: Kahp-Yang Suh, Hoon-Eui Jeong