Abstract: A connecting apparatus for electrically connecting memory modules (RAM or ROM) to a printed circuit board (PCB) of a digital electronic computer is disclosed. The apparatus may be used for edge-wise connection of a number of single in-line memory modules (SIMM, a trademark of the present assignee) to the PCB. The apparatus includes the ability to mount multiple memory modules on a single connecting apparatus, and means for electrically selecting a data transfer with one memory module or another on the apparatus. Guide posts of different cross-sectional areas on each side of the apparatus, and longer than various contact pins protruding through the base of the apparatus are provided, so that the mounting of the apparatus on the PCB is polarized. The guide posts also allow for both through-hole and surface mounting of the apparatus. Additionally, securing pegs on the apparatus are inserted into correspondingly sized holes on the memory modules to prevent vertical movement of the memory modules when connected.