Patents by Inventor Hor Lee

Hor Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED SPOTLIGHT
    Publication number: 20110134642
    Abstract: The LED spotlight relates to cold light source, and more particularly to a light-emitting device with a plurality of LEDs. The LED spotlight of the present Utility Model includes a plurality of LEDs and a circuit board, and the LEDs are installed on the circuit board, the LEDs are arranged in concentric circles with the shape of optical slits of Fresnel zone plate; the LEDs include spherical tops.
    Type: Application
    Filed: April 27, 2009
    Publication date: June 9, 2011
    Inventor: Hor Lee
  • System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices
    Patent number: 7598119
    Abstract: System and method for preventing resin-based adhesive from contacting a substrate to minimize resin bleed-out and contamination. A preferred embodiment comprises a semiconductor device having a die mounted on a substrate, first and second gold surfaces formed on the substrate, a trench formed between the first and second gold surfaces, resin-based adhesive applied to the first gold surface, and a heat sink bonded to the resin-based adhesive.
    Type: Grant
    Filed: March 12, 2007
    Date of Patent: October 6, 2009
    Assignee: Texas Instruments Incorporated
    Inventors: Sergio V. Martinez, Boon Hor Lee, Karen Lynne Robinson
  • System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices
    Publication number: 20080225491
    Abstract: System and method for preventing resin-based adhesive from contacting a substrate to minimize resin bleed-out and contamination. A preferred embodiment comprises a semiconductor device having a die mounted on a substrate, first and second gold surfaces formed on the substrate, a trench formed between the first and second gold surfaces, resin-based adhesive applied to the first gold surface, and a heat sink bonded to the resin-based adhesive.
    Type: Application
    Filed: March 12, 2007
    Publication date: September 18, 2008
    Inventors: Sergio V. Martinez, Boon Hor Lee, Karen Lynne Robinson
  • Automatic teller machine
    Patent number: D437468
    Type: Grant
    Filed: April 26, 2000
    Date of Patent: February 6, 2001
    Assignee: Fujitsu Limited
    Inventors: Katsuyuki Fukutake, Taku Ando, Takayuki Kakizaki, Hiroyuki Moto, Henry Young Chin, Chin Hor Lee