Abstract: The present invention discloses a resistor supported on a metal plate composed of a low temperature coefficient of resistance (TCR) metallic material. The resistor includes at least two electrode columns composed of the low TCR metallic material disposed on the metal plate. The resistor further includes at least an electrode layer disposed on each of the electrode columns to form an electrode for each of the electrode columns. In a preferred embodiment, the low TCR metallic material composed of the metal plate further comprises a nickel-copper alloy. In another preferred embodiment, the electrode layer disposed on each of the electrode columns further comprises a copper layer and a tin-lead alloy layer on each of the electrode columns. In another preferred embodiment, the electrode columns disposed on the metal plate having a precisely defined position for providing precisely defined resistance for the resistor ranging between one milli-ohm to one ohm.

Abstract: A new current sensor, its production substrate, and its production process, wherein the surface layer of the substrate is made of the thin film of low temperature coefficient of resistivity such as nickel-copper alloy, manganese-copper alloy or nickel-chromium alloy, it is tightly adhered onto the thin plates of ceramic, aluminum oxide, aluminum nitride or Beryllium dioxide (BeO) to form a new substrate by a hot-press laminating; next, by optical mask etching, the pattern of current sensor are formed on the surface of the substrate; and the flip-chip is formed on the lateral electrodes in the bottom of the current sensor unit, and the front electrodes are plated to increase the thickness; then, the pattern are modified with laser to obtain the pattern of sensor with precise and constant resistivity; after that, and the pattern of a sensor are coated with a protection layer; and the substrate is segmented, and is plated on the end face electrode 60 by sputtering; finally, a single and small chip-scaled current

Abstract: A leadframe resistance structure comprises: at least a resistance foil; a plurality of leads, each of the plurality of leads respectively having a first lead surface and an opposite second lead surface, wherein the resistance foil is disposed on the first lead surface of the leads and connected to the leads; and an encapsulating material that encapsulates the resistance foil, and a portion of the first surface of the leads.

Abstract: A leadframe resistance structure comprises: at least a resistance foil; a plurality of leads, each of the plurality of leads respectively having a first lead surface and an opposite second lead surface, wherein the resistance foil is disposed on the first lead surface of the leads and connected to the leads; and an encapsulating material that encapsulates the resistance foil, and a portion of the first surface of the leads.

Abstract: The present invention discloses a resistor supported on a metal plate composed of a low temperature coefficient of resistance (TCR) metallic material. The resistor includes at least two electrode columns composed of the low TCR metallic material disposed on the metal plate. The resistor further includes at least an electrode layer disposed on each of the electrode columns to form an electrode for each of the electrode columns. In a preferred embodiment, the low TCR metallic material composed of the metal plate further comprises a nickel-copper alloy. In another preferred embodiment, the electrode layer disposed on each of the electrode columns further comprises a copper layer and a tin-lead alloy layer on each of the electrode columns. In another preferred embodiment, the electrode columns disposed on the metal plate having a precisely defined position for providing precisely defined resistance for the resistor ranging between one milli-ohm to one ohm.