Abstract: A semiconductor circuit configuration is described, in particular for ignition applications, having a semiconductor power switching device which has a first main terminal, a second main terminal and a control terminal; a clamping diode device which is switched between the first main terminal and the control terminal for clamping an external voltage (VA) which is applied at the first main terminal; the clamping diode device having a first part with a first clamp voltage and a second part with a second clamp voltage (VKL?), the second part being connected in series with the first part; a controllable semiconductor switching device which is connected in parallel with the first part for controllable bridging of the first part, so that either the sum (VKL) of the first and the second clamp voltages, or the second clamp voltage (VKL?) is provided for clamping the external voltage (VA) applied at the first main terminal; and a control circuit for controlling the controllable semiconductor switching device as a funct

Abstract: A method is proposed for fastening at least one electrical component to a substrate using solder, in which elevations are produced in the solder substrate, the elevations being at least as high as the thickness of a solder layer to be produced. In another step, the solder is laid upon the elevations, and in a further step, the elevations are pressed down until they have reached approximately the height of the solder, so that a soldering procedure may follow. The method is used for producing exactly specified thicknesses of solder layers having tolerances less than 10 micrometers.

Abstract: A semiconductor circuit configuration is described, in particular for ignition applications, having a semiconductor power switching device (100) which has a first main terminal (102), a second main terminal (101) and a control terminal (103); a clamping diode device (205a, 205b) which is switched between the first main terminal (102) and the control terminal (103) for clamping an external voltage (VA) which is applied at the first main terminal (202); the clamping diode device (205a, 205b) having a first part (205a) with a first clamp voltage and a second part (205b) with a second clamp voltage (VKL′), the second part (205b) being connected in series with the first part (205a); a controllable semiconductor switching device (402, 650) which is connected in parallel with the first part (205a) for controllable bridging of the first part (205a), so that either the sum (VKL) of the first and the second clamp voltages, or the second clamp voltage (VKL′) is provided for clamping the external voltage (VA)

Abstract: An ignition device for an internal combustion engine having multiple cylinders and direct gasoline injection is described, so that the secondary current conduction time of the ignition coil can be prolonged controllably without increasing the primary current. At least one ignition coil is provided for each cylinder of the internal combustion engine. The primary side of the ignition coil is switched over an ignition switch which is triggered by a microprocessor. A spark plug is connected to the secondary side of the ignition coil. An external voltage can be applied to the ignition coil to prolong the secondary current conduction time, thus supplying the power required for the prolonged secondary current.

Abstract: An ignition system is for an internal combustion engine having an ignition device that requires a high voltage (ignition voltage) for igniting the ignition spark. Two ignition coils are provided, which have secondary windings that are each connected to electrodes of a spark plug, which have primary windings that may be connected in each case by a switching arrangement to a supply voltage source, and a drive circuit, via which the ignition coils are driven in a time-displaced manner.

Abstract: A method is proposed for fastening at least one electrical component to a substrate using solder, in which elevations are produced in the solder substrate, the elevations being at least as high as the thickness of a solder layer to be produced, in a further step the solder, especially a solder foil, is laid upon the elevations, and in a further step, the elevations are pressed down until they have reached approximately the height of the solder, so that a soldering procedure may follow. The method is used for producing exactly specified thicknesses of solder layers having tolerances less than 10 micrometer.

Abstract: The present invention relates to an ignition system for an internal combustion engine having an ignition device that requires a high voltage (ignition voltage) for igniting the ignition spark.

Abstract: An ignition device for an internal combustion engine having multiple cylinders and direct gasoline injection is described, so that the secondary current conduction time of the ignition coil can be prolonged controllably without increasing the primary current. At least one ignition coil is provided for each cylinder of the internal combustion engine. The primary side of the ignition coil is switched over an ignition switch which is triggered by a microprocessor. A spark plug is connected to the secondary side of the ignition coil. An external voltage can be applied to the ignition coil to prolong the secondary current conduction time, thus supplying the power required for the prolonged secondary current.

Abstract: A circuit arrangement of an ignition output stage, in particular for an ignition circuit of a motor vehicle, is described. The circuit arrangement includes a multiple Darlington transistor (Darlington) which drives a primary winding of an ignition coil, as well as a driving circuit for the Darlington. An n-p-n Darlington is provided, whose collector is connected to the positive terminal of a voltage source and whose emitter is connected to a first terminal of the primary winding of the ignition coil. The second terminal of the primary winding is connected to ground. The Darlington is driven via a decoupling element which isolates the driving circuit from a negative reverse voltage present at the base of the Darlington when the latter is turned off.

Abstract: An ignition output stage is described, in particular for an internal combustion engine, in which the output stage is constructed as a two- or three-stage Darlington and provided either with an internal single-stage or an external multiple- stage clamping via a Zener diode for protection from surges, while a short-circuit transistor is provided for protection from parasitic currents at the control terminal of the Darlington in parallel to the base-emitter junction of the ignition Darlington.

Abstract: A short-circuit-proof transistorized ignition output stage for motor vehicles, has a power transistor (10) connected in series to a primary winding (11) of an ignition coil (12), and a blocking arrangement including a first switching transistor for turning off the power transistor in the event of a very small voltage drop indicative of a short circuit in the coil (12). The voltage drop detector includes a second switching transistor (23') whose base-emitter path is connected across the primary winding (11) and whose collector-emitter path controls the base of a third switching transistor (25) of opposite conductivity type. The collector-emitter path of the third switching transistor (25) is connected in parallel to the base-emitter path of the first switching transistor (27) and the collector-emitter path of the first switching transistor is connected in parallel to the base-emitter path of the power transistor (10). Preferably, the entire output stage consists of a monolithic integrated circuit.

Abstract: The invention relates to a controllable, temperature-compensated voltage limiter with a p.sup.+ np.sup.+ (or n.sup.+ pn.sup.+) semiconductor structure in which the width and doping of the central zone is selected such that no avalanche or Zener effect appears when voltage is applied to the two outer layers (punch-through diode). In accordance with the invention, the voltage U.sub.B to be limited is applied between the blocking pn-juncture (B-C). In addition, an adjustable auxiliary voltage (U.sub.H) is applied between the other pn-junction (H-C). The punch-through can be set to a higher defined value via the auxiliary voltage U.sub.H, this value being independent of the temperature to a large extent.

Abstract: An ignition device for an internal combustion engine comprises a preselector stage and an output stage for controlling the flow of current through the primary winding of an ignition transformer. The ignition device is particularly suited for an externally ignited internal combustion engine. The output stage comprises a pnp-transistor having its collector terminal directly coupled to a ground connection of the ignition device to improve proper loss dissipation. A decoupling device is coupled between the preselector stage and the output stage, and is provided to protect the preselector stage by decoupling it from the output stage.

Abstract: In a known process for manufacturing a semiconductor element, a single crystal semiconductor body is subjected to at least one high temperature treatment such as diffusion or epitaxy in order to create a pn junction. A metallization is then applied to the upper surface of the semiconductor to constitute an electrode. Thereafter the element is subjected to an annealing process at intermediate temperatures. In accordance with the invention, a semiconductor body is irradiated following the manufacture of the pn junctions and prior to the metallization. The radiation causes lattice displacements which in turn decrease the lifetime of the minority carriers. The above-mentioned annealing process then also serves partially to heal the lattice displacements caused by the radiation.