Abstract: A gripper for detaching a packaged chip from a PCB. The gripper comprises a plurality of hooks, elastic slices, and a heating device. These hooks are used for gripping and hooking the packaged chip. Each hook includes a chip-upholding part and a chip-gripping part, wherein the chip-gripping part is used for gripping the packaged chip, and the chip-upholding part is used for hooking the packaged chip in the gap. These elastic slices are used for providing the elasticity. Each elastic slice comprises a fastened end and a flexible end, wherein the flexible end connects the chip-gripping part and results the hook gripping the packaged chip. The heating device is used for heating the packaged chip to melt the solder balls. Wherein all the bonded fastened ends are exerted an upward force, and the gripper detaches the packaged chip from the PCB when the solder balls of the packaged chip are melted.

Abstract: This invention relates to a griper for detaching a packaged chip from a PCB. The griper comprises a plurality of hooks, elastic slices, and a heating device. These hooks are used for gripping and hooking the packaged chip. Each hook comprises a chip-upholding part and a chip-gripping part, wherein the chip-gripping part is used for gripping the packaged chip, and the chip-upholding part is used for hooking the packaged chip in the gap. These elastic slices are used for providing the elasticity. Each elastic slice comprises a fastened end and a flexible end, wherein the flexible end connects the chip-gripping part and results the hook griping the packaged chip. The heating device is used for heating the packaged chip to melt the solder balls. Wherein all the bonded fastened ends are exerted an upward force, and the griper detaches the packaged chip from the PCB when the solder balls of the packaged chip are melted.

Abstract: A bubble leveling device includes a bubble level having a gas bubble formed on a liquid surface, an illuminator projecting light through or towards the gas bubble for producing an optical image of the gas bubble, and a sensor having a coordinate screen for locating the image of the gas bubble on the screen for checking the coincidence or deviation of the image with or from the coordinate center of the screen for reliably checking the horizontality or inclination angle as measured by the bubble leveling device.

Abstract: A bubble leveling device includes a bubble level having a gas bubble formed on a liquid surface, an illuminator projecting light through or towards the gas bubble for producing an optical image of the gas bubble, and a sensor having a coordinate screen for locating the image of the gas bubble on the screen for checking the coincidence or deviation of the image with or from the coordinate center of the screen for reliably checking the horizontality or inclination angle as measured by the bubble leveling device.