Patents by Inventor How-Shin Wang

How-Shin Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer-dicing process
    Patent number: 6319754
    Abstract: A wafer-dicing process includes the steps of attaching the wafer to a wafer mounting sheet which includes a bonding adhesive layer, a releasable film layer, a resilient substrate layer, and a light-curable adhesive layer, laying assembly of the wafer and the wafer mounting sheet on a wafer carrier sheet, exposing assembly of the wafer, the wafer mounting sheet and the wafer carrier sheet to cure the light-curable adhesive layer, cutting the wafer to form bare dice, sucking one of the dice and pushing upwardly the carrier sheet, and moving and mounting the die to a die mounting substrate.
    Type: Grant
    Filed: July 10, 2000
    Date of Patent: November 20, 2001
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: How-Shin Wang, Chun-Hung Lin