Patents by Inventor Howard Bartlow

Howard Bartlow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package including wires contacting lead frame edge
    Patent number: 8384228
    Abstract: Embodiments of a microelectronic package are generally described herein. A microelectronic package may include a lead frame including a major surface, and a die having including a bond pad. A wire may electrically couple a location of the major surface of the lead frame with the bond pad of the die, the wire being situated such that the wire is substantially unbent from the location of the major surface to an edge of the lead frame.
    Type: Grant
    Filed: April 29, 2009
    Date of Patent: February 26, 2013
    Assignee: Triquint Semiconductor, Inc.
    Inventors: Howard Bartlow, William McCalpin, Binh Le
  • Package including proximately-positioned lead frame
    Patent number: 8288845
    Abstract: Embodiments of a microelectronic package are generally described herein. A microelectronic package may include a die having a first side and a second side, opposite the first side, a flange coupled to the first side of the die, and a lead frame proximately positioned relative to the die and coupled to the second side of the die. Other embodiments may be described and claimed.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: October 16, 2012
    Assignee: TriQuint Semiconductor, Inc.
    Inventors: Howard Bartlow, William McCalpin, Michael Lincoln
  • PACKAGE INCLUDING PROXIMATELY-POSITIONED LEAD FRAME
    Publication number: 20100123228
    Abstract: Embodiments of a microelectronic package are generally described herein. A microelectronic package may include a die having a first side and a second side, opposite the first side, a flange coupled to the first side of the die, and a lead frame proximately positioned relative to the die and coupled to the second side of the die. Other embodiments may be described and claimed.
    Type: Application
    Filed: November 14, 2008
    Publication date: May 20, 2010
    Applicant: TRIQUINT SEMICONDUCTOR, INC.
    Inventors: Howard Bartlow, William McCalpin, Michael Lincoln
  • CONTACT METHOD FOR THIN SILICON CARBIDE EPITAXIAL LAYER AND SEMICONDUCTOR DEVICES FORMED BY THOSE METHODS
    Publication number: 20070117366
    Abstract: Provided is a process for forming a contact for a compound semiconductor device without electrically shorting the device. In one embodiment, a highly doped compound semiconductor material is electrically connected to a compound semiconductor material of the, same conductivity type through an opening in a compound semiconductor material of the opposite conductivity type. Another embodiment discloses a transistor including multiple compound semiconductor layers where a highly doped compound semiconductor material is electrically connected to a compound semiconductor layer of the same conductivity type through an opening in a compound semiconductor layer of the opposite conductivity type. Embodiments further include metal contacts electrically connected to the highly doped compound semiconductor material. A substantially planar semiconductor device is disclosed. In embodiments, the compound semiconductor material may be silicon carbide.
    Type: Application
    Filed: November 6, 2006
    Publication date: May 24, 2007
    Inventors: Martin Kordesch, Howard Bartlow, Richard Woodin