Patents by Inventor Howard E. Jackson

Howard E. Jackson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6925213
    Abstract: A novel fiber optic sensor configuration whose diameter is the same as that of the optical fiber on which it is directly fabricated is introduced. A simple MEMS-compatible fabrication process to accomplish micromachining on the fiber end face has been developed and is detailed. This sensor configuration significantly reduces the size of the sensor and makes the packaging simple and adhesive free. The micromachining process of the present invention also provides for the fabrication of arrays of sensors that would provide two dimensional maps with high spatial resolution of at least one of acoustical vibration, mechanical vibration, pressure, temperature, acceleration, electrostatic fields, magnetic fields or combinations thereof.
    Type: Grant
    Filed: March 11, 2002
    Date of Patent: August 2, 2005
    Assignee: University of Cincinnati
    Inventors: Joseph T. Boyd, Don C. Abeysinghe, Samhita Dasgupta, Howard E. Jackson
  • Patent number: 6525808
    Abstract: A method and system for determining a spatially local index of refraction in optical materials is provided. Light, including a near-field intensity, is collected above a surface of the material. A probe is oscillated at a plurality of frequencies and in a substantially perpendicular manner relative to the surface of the material to detect the near-field intensity of the light. A distance of the probe from the surface of the material is modulated. Based on a ratio of the near-field intensity of the light detected at the plurality of frequencies, the local index of refraction is determined.
    Type: Grant
    Filed: December 3, 1999
    Date of Patent: February 25, 2003
    Assignee: University of Cincinnati
    Inventors: Howard E. Jackson, Din Ping Tsai
  • Publication number: 20020159671
    Abstract: A novel fiber optic sensor configuration whose diameter is the same as that of the optical fiber on which it is directly fabricated is introduced. A simple MEMS-compatible fabrication process to accomplish micromachining on the fiber end face has been developed and is detailed. This sensor configuration significantly reduces the size of the sensor and makes the packaging simple and adhesive free. The micromachining process of the present invention also provides for the fabrication of arrays of sensors that would provide two dimensional maps with high spatial resolution of at least one of acoustical vibration, mechanical vibration, pressure, temperature, acceleration, electrostatic fields, magnetic fields or combinations thereof.
    Type: Application
    Filed: March 11, 2002
    Publication date: October 31, 2002
    Inventors: Joseph T. Boyd, Don C. Abeysinghe, Samhita Dasgupta, Howard E. Jackson
  • Patent number: 5274246
    Abstract: A multiple quantum well arrangement which achieves significantly improved third order optical nonlinearity in a semiconductor device by way of spatially periodic electrodes applied to the semiconductor device. The spatial period of the applied electrodes and the resulting exciton confinement dimension is improved over that of previous multiple quantum well structures and to the Bohr radius range of dimensions for the semicondcutor material by way of avRIGHTS OF THE GOVERNMENTThe invention described herein may be manufactured and used by or for the Government of the United States for all governmental purposes without the payment of any royalty.
    Type: Grant
    Filed: May 4, 1992
    Date of Patent: December 28, 1993
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Frank K. Hopkins, Joseph T. Boyd, Howard E. Jackson