Abstract: An RF mixer includes a diode quad including first, second, third and fourth carbon nanotube diodes, each carbon nanotube diode including a p-n junction The mixer also includes a RF input coupled each of the diodes, and a local oscillator input coupled with each of the diodes.

Abstract: An RF mixer includes a diode quad including first, second, third and fourth carbon nanotube diodes, each carbon nanotube diode including a p-n junction The mixer also includes a RF input coupled each of the diodes, and a local oscillator input coupled with each of the diodes.

Abstract: A plurality of electronic circuits and associated signal lines are positioned at respective locations on a base wafer. A cover wafer, which fits over the base wafer, includes a corresponding like number of locations each including one or more cavities to accommodate the electronic circuit and associated signal lines. The cover wafer includes a plurality of vias for making electrical connection to the signal lines. A multi layer metallic arrangement hermetically seals the periphery of each location as well as sealing the bottom of each via. The joined base and cover wafers may then be diced to form individual die packages.

Abstract: A plurality of electronic circuits and associated signal lines are positioned at respective locations on a base wafer. A cover wafer, which fits over the base wafer, includes a corresponding like number of locations each including one or more cavities to accommodate the electronic circuit and associated signal lines. The cover wafer includes a plurality of vias for making electrical connection to the signal lines. A multi layer metallic arrangement hermetically seals the periphery of each location as well as sealing the bottom of each via. The joined base and cover wafers may then be diced to form individual die packages.

Abstract: A plurality of electronic circuits and associated signal lines are positioned at respective locations on a base wafer. A cover wafer, which fits over the base wafer, includes a corresponding like number of locations each including one or more cavities to accommodate the electronic circuit and associated signal lines. The cover wafer includes a plurality of vias for making electrical connection to the signal lines. A multi layer metallic arrangement hermetically seals the periphery of each location as well as sealing the bottom of each via. The joined base and cover wafers may then be diced to form individual die packages.

Abstract: A plurality of electronic circuits and associated signal lines are positioned at respective locations on a base wafer. A cover wafer, which fits over the base wafer, includes a corresponding like number of locations each including one or more cavities to accommodate the electronic circuit and associated signal lines. The cover wafer includes a plurality of vias for making electrical connection to the signal lines. A multi layer metallic arrangement hermetically seals the periphery of each location as well as sealing the bottom of each via. The joined base and cover wafers may then be diced to form individual die packages.

Abstract: A MEMS switch having spaced-apart RF conductors on a substrate with a bridge structure disposed above the substrate. In one embodiment the bridge structure has two flexible arms supported by two support members and in another embodiment the bridge structure has three flexible arms supported by three support members, the third support member being electrically integral with the second conductor. The bridge structure is drawn down to effect electrical contact between the first and second conductors by application of a control signal to a control electrode, having an opposed electrode on the undersurface of the bridge structure. A central stiffener portion of the bridge prevents any contact between the control and opposed electrodes.

Abstract: A MEMS switch having spaced-apart RF conductors on a substrate with a bridge structure disposed above the substrate. In one embodiment the bridge structure has two flexible arms supported by two support members and in another embodiment the bridge structure has three flexible arms supported by three support members, the third support member being electrically integral with the second conductor. The bridge structure is drawn down to effect electrical contact between the first and second conductors by application of a control signal to a control electrode, having an opposed electrode on the undersurface of the bridge structure. A central stiffener portion of the bridge prevents any contact between the control and opposed electrodes.