Patents by Inventor Howard Lincoln HECK

Howard Lincoln HECK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package having inductive lateral interconnects
    Patent number: 10734333
    Abstract: Semiconductor packages including a lateral interconnect having an arc segment to increase self-inductance of a signal line is described. In an example, the lateral interconnect includes a circular segment extending around an interconnect pad. The circular segment may extend around a vertical axis of a vertical interconnect to introduce an inductive circuitry to compensate for an impedance mismatch of the vertical interconnect.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: August 4, 2020
    Assignee: Intel Corporation
    Inventors: Jackson Chung Peng Kong, Bok Eng Cheah, Khang Choong Yong, Howard Lincoln Heck
  • SEMICONDUCTOR PACKAGE HAVING INDUCTIVE LATERAL INTERCONNECTS
    Publication number: 20190131257
    Abstract: Semiconductor packages including a lateral interconnect having an arc segment to increase self-inductance of a signal line is described. In an example, the lateral interconnect includes a circular segment extending around an interconnect pad. The circular segment may extend around a vertical axis of a vertical interconnect to introduce an inductive circuitry to compensate for an impedance mismatch of the vertical interconnect.
    Type: Application
    Filed: June 15, 2016
    Publication date: May 2, 2019
    Inventors: Jackson Chung Peng KONG, Bok Eng CHEAH, Khang Choong YONG, Howard Lincoln HECK