Patents by Inventor Howard M. Abramowitz

Howard M. Abramowitz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low profile semiconductor package
    Patent number: 4845545
    Abstract: A flat thin package for semiconductor die has rigid leads extending perpendicularly from its length which can be plugged into a printed circuit board socket. The package has a low profile above the surface of the printed circuit board.
    Type: Grant
    Filed: February 13, 1987
    Date of Patent: July 4, 1989
    Assignee: International Rectifier Corporation
    Inventors: Howard M. Abramowitz, Jerry R. Carpenter, Dennis Meddles
  • Power consolidation circuit using interrupted current techniques
    Patent number: 4742243
    Abstract: An electric circuit consolidates electric power from a number of power sources, having various voltage levels and connected to form a grid and delivers the power to a common load. This is accomplished by interposing switching elements in the connection or nodes between the terminals of the grid and the busbars that feed the load. These switches operate in a manner such that all the sources contribute to the output power. However, at any given time, only two nodes on the grid are connected to the load. Alternating current is derived from a direct current grid by using sets of switching elements to reverse polarity of the voltage supplied to the load.
    Type: Grant
    Filed: February 6, 1987
    Date of Patent: May 3, 1988
    Inventors: Zivan Zabar, Howard M. Abramowitz