Abstract: A rotor lock assembly for locking a rotor of a wind turbine. The rotor lock assembly has at least one relocatable rotor lock. The relocatable rotor lock has a housing, a bushing element, a pin shaft position within the bushing element, and a locking mechanism. The housing includes a mounting portion adapted for mounting to a bearing housing adjacent to a rotor lock plate of the rotor.

Abstract: An efficient high voltage power supply suitable for capacitor discharge applications is provided by eliminating the need for complex timing controls and the addition of parts required for capacitor discharge applications. The use of three steps in the inverter section, a charge, discharge and revert steps, generally eliminates the complex timing requirements typically associated with high voltage power supplies while still achieving high efficiency. The addition of a high voltage relay, resistor, and appropriately specified diodes in the rectifier section makes the power supply more applicable for use in capacitor discharge applications than existing commercial off-the-shelf high voltage power supplies.

Abstract: An efficient high voltage power supply suitable for capacitor discharge applications is provided by eliminating the need for complex timing controls and the addition of parts required for capacitor discharge applications. The use of three steps in the inverter section, a charge, discharge and revert steps, generally eliminates the complex timing requirements typically associated with high voltage power supplies while still achieving high efficiency. The addition of a high voltage relay, resistor, and appropriately specified diodes in the rectifier section makes the power supply more applicable for use in capacitor discharge applications than existing commercial off-the-shelf high voltage power supplies.

Abstract: A package for one or more solid state devices in a single module that allows for operation at high voltage, high current, or both high voltage and high current. Low thermal resistance between the solid state devices and an exterior of the package and matched coefficient of thermal expansion between the solid state devices and the materials used in packaging enables high power operation. The solid state devices are soldered between two layers of ceramic with metal traces that interconnect the devices and external contacts. This approach provides a simple method for assembling and encapsulating high power solid state devices.

Abstract: A novel pulsed, neutralized ion beam source is provided. The source uses pulsed inductive breakdown of neutral gas, and magnetic acceleration and control of the resulting plasma, to form a beam. The beam supplies ions for applications requiring excellent control of ion species, low remittance, high current density, and spatial uniformity.