Patents by Inventor Howard W. Stolz

Howard W. Stolz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6498722
    Abstract: An isolation mounting system attaches a computer component, such as a disk drive, to the structure of a computer system. In an embodiment, the isolation mounting system comprises a post bracket attached to the computer component, a plurality of isolators attached to posts extending from the post bracket, and a socket bracket attached to the isolators and to the structure of the computer system. An opening in the isolators fits over, onto, or around the posts of the post bracket. Outer surfaces of the isolators fit within receptacles of the socket bracket.
    Type: Grant
    Filed: October 22, 1999
    Date of Patent: December 24, 2002
    Assignee: Sun Microsystems, Inc.
    Inventors: Howard W. Stolz, Jay K. Osborn
  • Patent number: 6226184
    Abstract: A heat sink for a heat generating component of a computer system, such as a central processing unit (CPU), attaches to the computer system enclosure. The heat sink may be pressed against the component to establish thermal contact with the component. Because the heat sink attaches to the computer system enclosure and not the component, the component socket, or a circuit board; the heat sink may be unusually shaped and large, while still allowing easy access to the components mounted within the computer system enclosure. Removing the enclosure panel on which the sink is attached may allow easy access to the components within the computer enclosure. The heat sink may be particularly useful in computer systems that use only natural convection cooling.
    Type: Grant
    Filed: October 22, 1999
    Date of Patent: May 1, 2001
    Assignee: Sun Microsystems, Inc.
    Inventors: Howard W. Stolz, Jay K. Osborn, Daniel B. Hruska
  • Patent number: 6034870
    Abstract: A computer system including a highly efficient forced air cooling subsystem is disclosed. The computer system includes an enclosure having a first (e.g., front) panel, a processor mounted upon a motherboard located within the enclosure, and a fan located within the enclosure for providing a flow of air through the enclosure. The fan draws air into the enclosure through an opening (e.g., an intake vent) in the first panel and produces a pressurized stream of air. The fan may be oriented such that the pressurized stream of air is directed toward the processor. The computer system may also include a plenum adjacent to the first panel, wherein the intake vent allows ambient air surrounding the enclosure to enter the plenum. The fan may be mounted within an opening in a wall of the plenum. The enclosure may also include a second (e.g., rear) panel opposed to the first (e.g., front) panel and having three openings (e.g., exhaust vents) therein.
    Type: Grant
    Filed: January 27, 1999
    Date of Patent: March 7, 2000
    Assignee: Sun Microsystems, Inc.
    Inventors: Jay K. Osborn, Howard W. Stolz, Clifford B. Willis
  • Patent number: 5612852
    Abstract: A compact housing for a workstation-class computer is disclosed. The apparatus includes a structural heat sink with a horizontal base heat sink that includes an interchangeable power source housing and a hard disk drive receptacle. The horizontal base heat sink operates to conduct heat away from the functional elements positioned within the interchangeable power source housing and the hard disk drive receptacle. The structural heat sink also includes a vertical tower heat sink to support functional elements including a power converter. The vertical tower heat sink operates to conduct heat away from the functional elements. The vertical tower heat sink also includes support devices for receiving a detachable pivot display system. The structural heat sink is surrounded by a vented exterior skin that facilitates convective heat transfer from the structural heat sink.
    Type: Grant
    Filed: March 5, 1996
    Date of Patent: March 18, 1997
    Assignee: Sun Microsystems, Inc.
    Inventors: Craig M. Leverault, Michael F. McCormick, Jr., Robert J. Lajara, Alan W. Lam, Peter C. D. Ta, Howard W. Stolz, Jay K. Osborn, Michael S. Dann, Ronald Barnes
  • Patent number: D451920
    Type: Grant
    Filed: November 6, 2000
    Date of Patent: December 11, 2001
    Assignee: Sun Microsystems, Inc.
    Inventors: June Lee, Kuni Masuda, Howard W. Stolz, Craig M. Leverault, Michael S. Dann
  • Patent number: D468741
    Type: Grant
    Filed: September 13, 2001
    Date of Patent: January 14, 2003
    Assignee: Sun Microsystems, Inc.
    Inventors: June Lee, Kuni Masuda, Howard W. Stolz, Craig M. Leverault, Michael S. Dann
  • Patent number: D341582
    Type: Grant
    Filed: October 10, 1990
    Date of Patent: November 23, 1993
    Assignee: Sun Microsystems, Inc.
    Inventors: Howard W. Stolz, William K. Szaroletta
  • Patent number: D428885
    Type: Grant
    Filed: February 22, 1999
    Date of Patent: August 1, 2000
    Assignee: Sun Microsystems, Inc.
    Inventors: Kuni Masuda, Craig Leverault, Paul S. Montgomery, Herbert Pfeifer, Howard W. Stolz
  • Patent number: D432125
    Type: Grant
    Filed: February 22, 1999
    Date of Patent: October 17, 2000
    Assignee: Sun Microsystems, Inc.
    Inventors: Kuni Masuda, Craig Leverault, Paul S. Montgomery, Herbert Pfeifer, Howard W. Stolz