Patents by Inventor Hsi-An Chen

Hsi-An Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11996470
    Abstract: A semiconductor device includes a semiconductor fin. The semiconductor device includes first spacers over the semiconductor fin. The semiconductor device includes second spacers over the semiconductor fin. The second spacers vertically extend farther from the semiconductor fin than the first spacers. The semiconductor device includes a metal gate over the semiconductor fin, the metal gate is sandwiched by the first spacers. The metal gate includes a glue layer that contains tantalum nitride.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: May 28, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Jian-Jou Lian, Tzu Ang Chiang, Ming-Hsi Yeh, Chun-Neng Lin, Po-Yuan Wang, Chieh-Wei Chen
  • Patent number: 11978801
    Abstract: A method of forming a semiconductor device includes surrounding a dummy gate disposed over a fin with a dielectric material; forming a gate trench in the dielectric material by removing the dummy gate and by removing upper portions of a first gate spacer disposed along sidewalls of the dummy gate, the gate trench comprising a lower trench between remaining lower portions of the first gate spacer and comprising an upper trench above the lower trench; forming a gate dielectric layer, a work function layer and a glue layer successively in the gate trench; removing the glue layer and the work function layer from the upper trench; filling the gate trench with a gate electrode material after the removing; and removing the gate electrode material from the upper trench, remaining portions of the gate electrode material forming a gate electrode.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: May 7, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jian-Jou Lian, Chun-Neng Lin, Chieh-Wei Chen, Tzu-Ang Chiang, Ming-Hsi Yeh
  • Publication number: 20240142961
    Abstract: A method of estimating greenhouse gas emission, performed by a processing device, includes: obtaining at least one time period of a number of working stations for a target manufacturing process of a product; obtaining a number of first power consumption data of the target manufacturing process, wherein the first power consumption data correspond to the working stations respectively; calculating a number of second power consumption data based on the at least one time period and the first power consumption data; searching for a number of target coefficients corresponding to the plurality of working stations respectively in coefficient database based on the target manufacturing process; and calculating greenhouse gas emission data of the target manufacturing process based on the second power consumption data and the target coefficients.
    Type: Application
    Filed: October 27, 2022
    Publication date: May 2, 2024
    Applicant: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Tsung-Hsi LIN, Yun Sheng LI, Yu Ling LEE, Hsiao Pin LIN, Chia Hou CHEN
  • Patent number: 11968869
    Abstract: An electronic device includes a flexible substrate and a conductive wire. The conductive wire is disposed on the flexible substrate and includes a metal portion and a plurality of openings disposed in the metal portion. The metal portion includes a plurality of extending portions and a plurality of joint portions, and each of the openings is surrounded by two of the plurality of extending portions and two of the plurality of joint portions. A ratio of a sum of widths of the plurality of extending portions to a sum of widths of the plurality of joint portions is in a range from 0.8 to 1.2.
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: April 23, 2024
    Assignee: InnoLux Corporation
    Inventors: Ya-Wen Lin, Chien-Chih Chen, Yen-Hsi Tu, Cheng-Wei Chang, Shu-Hui Yang
  • Publication number: 20240126861
    Abstract: A device unlocking method and an electronic device are provided. The method includes: detecting fingerprint information of a user by a first sensor of the electronic device; authenticating the fingerprint information and temporarily storing an authentication result of the fingerprint information; after authenticating the fingerprint information, detecting operation environment information related to the electronic device by a second sensor of the electronic device; and in response to the operation environment information meeting a default condition, unlocking the electronic device according to the authentication result.
    Type: Application
    Filed: May 9, 2023
    Publication date: April 18, 2024
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Chih-Hsien Yang, Hui-Fen Chen, I-Hsi Wu
  • Publication number: 20240124844
    Abstract: The present disclosure provides a method for preparing a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors, the composition prepared by the method, and use of the composition for treating arthritis. The composition of the present disclosure achieves the effect of treating arthritis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 18, 2024
    Inventors: Chia-Hsin Lee, Po-Cheng Lin, Yong-Cheng Kao, Ming-Hsi Chuang, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Patent number: 11961779
    Abstract: A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC).
    Inventors: Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng
  • Publication number: 20240115616
    Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 11, 2024
    Inventors: Po-Cheng Lin, Pi-Chun Huang, Zih-Han Hong, Ming-Hsi Chuang, Yi-Chun Lin, Chia-Hsin Lee, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Publication number: 20240105818
    Abstract: A semiconductor device includes a gate electrode over a channel region of a semiconductor fin, first spacers over the semiconductor fin, and second spacers over the semiconductor fin. A lower portion of the gate electrode is between the first spacers. An upper portion of the gate electrode is above the first spacers. The second spacers are adjacent the first spacers opposite the gate electrode. The upper portion of the gate electrode is between the second spacers.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 28, 2024
    Inventors: Jian-Jou Lian, Chun-Neng Lin, Ming-Hsi Yeh, Chieh-Wei Chen, Tzu-Ang Chiang
  • Publication number: 20240083828
    Abstract: The present application relates to a system and a method for producing vinyl chloride. The system comprise a preheat unit, a gas-liquid separating unit, a heat-recovery unit, a heating unit and a thermal pyrolysis unit, and therefore heat energy of the thermal pyrolysis product can be efficiently recovered. Energy cost of the system can be efficiently lowered with the heat-recovery unit and the heating unit, and further prolonging operating cycle of the system.
    Type: Application
    Filed: June 28, 2023
    Publication date: March 14, 2024
    Inventors: Wen-Hsi HUANG, Sheng-Yen KO, Shih-Hong CHEN, Chun-Yu LIN
  • Publication number: 20240089666
    Abstract: A double-sided loudspeaker includes a first speaker base and a second speaker base assembled with each other and provided with a ventilation hole; a first side magnetic plate injection molded at the first speaker base or the second speaker base; a second side magnetic plate injection molded at the first speaker base or the second speaker base; a magnetic member disposed between the first side magnetic plate and the second side magnetic plate and including a main magnetic plate, a first magnetic unit and a second magnetic unit; a first diaphragm disposed at the first speaker base; a first voice coil disposed at the first diaphragm and movably arranged at the first magnetic unit; a second diaphragm disposed at the second speaker base; and a second voice coil disposed at the second diaphragm and movably arranged at the second magnetic unit.
    Type: Application
    Filed: December 13, 2022
    Publication date: March 14, 2024
    Inventors: PING-YU LEE, DE-WU WANG, ZHI-LONG NIU, YU-HSI CHEN
  • Publication number: 20240090190
    Abstract: A semiconductor device includes: first and second active regions extending in a first direction and separated by a gap relative to a second direction substantially perpendicular to the first direction; and gate structures correspondingly over the first and second active regions, the gate structures extending in the second direction; and each of the gate structures extending at least unilaterally substantially beyond a first side of the corresponding first or second active region that is proximal to the gap or a second side of the corresponding first or second active region that is distal to the gap; and some but not all of the gate structures also extending bilaterally substantially beyond each of the first and second sides of the corresponding first or second active region.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 14, 2024
    Inventors: Yu-Jen CHEN, Wen-Hsi LEE, Ling-Sung WANG, I-Shan HUANG, Chan-yu HUNG
  • Patent number: 11921307
    Abstract: The present disclosure provides an optical element driving mechanism, which includes a movable part, a fixed assembly, and a driving assembly. The movable part is configured to be connected to an optical element. The movable part is movable relative to the fixed assembly. The driving assembly is configured to drive the movable part to move relative to the fixed assembly. The movable part includes a connecting assembly configured to position the optical element.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: March 5, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Hsi Wang, Chao-Chang Hu, Chih-Wei Weng, Kuen-Wang Tsai, Tzu-Ying Chen
  • Publication number: 20240069299
    Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Inventors: Chao-Chang HU, Kuen-Wang TSAI, Liang-Ting HO, Chao-Hsi WANG, Chih-Wei WENG, He-Ling CHANG, Che-Wei CHANG, Sheng-Zong CHEN, Ko-Lun CHAO, Min-Hsiu TSAI, Shu-Shan CHEN, Jungsuck RYOO, Mao-Kuo HSU, Guan-Yu SU
  • Publication number: 20240072021
    Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.
    Type: Application
    Filed: October 26, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai, Ming-Shih Yeh, Ta-Wei Liu
  • Publication number: 20240047118
    Abstract: A transformer includes a magnetic core assembly, a bobbin, two first windings, a second winding and at least one circuit board. The bobbin includes a bobbin main body, a bobbin channel and a winding portion. The winding portion is formed on an outer periphery surface of the bobbin main body. The two first windings are disposed around the winding portion. One of the two first windings is disposed between the other one of the two first windings and the outer periphery surface of the bobbin main body. The second winding is disposed around the winding portion and disposed between the two first windings. The at least one circuit board includes a circuit board hole. The circuit board hole and the bobbin channel are communicated with each other. The magnetic core assembly partially penetrates through the circuit board hole and the bobbin channel.
    Type: Application
    Filed: November 17, 2022
    Publication date: February 8, 2024
    Inventors: Po-Sheng Wang, Hsi-Kuo Chung, Chih-Ming Chen, Hsiang-Yi Tseng, Hsi-Chen Liu
  • Publication number: 20240024518
    Abstract: The present invention provides a contrast agent which is efficiently and specifically absorbed by tumor cells, suitable for use in single photon emission computed tomography for the diagnosis, efficacy assessment and tumor tracking of neuroblastoma, pheochromocytoma or congestive heart failure.
    Type: Application
    Filed: January 19, 2023
    Publication date: January 25, 2024
    Applicant: INSTITUTE OF NUCLEAR ENERGY RESEARCH, ATOMIC ENERGY COUNCIL, EXECUTIVE YUAN
    Inventors: Shiu-Wen LIU, Yi-Jhih CHEN, Wei-Hsi CHEN, Yu CHANG, Cheng-Fang HSU
  • Patent number: 11765919
    Abstract: An embodiment of the present disclosure provides a display panel having a non-rectangular display region. The display panel includes a substrate, a pixel definition layer, a first organic material layer, and a second organic material layer. The pixel definition layer is disposed on the substrate, and defines a first pixel area and a second pixel area on the substrate. The first organic material layer is disposed in the first pixel area and has a first light-emitting region. The second organic material layer is disposed in the second pixel area and has a second light-emitting region. The first organic material layer and the second organic material layer have the same material and the same vertical projection area on the substrate, and the vertical projection area of the first light-emitting region on the substrate is smaller than the vertical projection area of the second light-emitting region on the substrate.
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: September 19, 2023
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Shuo-Hsiu Hu, Hsi-An Chen, Hung-Hsiu Yen
  • Publication number: 20230229158
    Abstract: A method for specifying a cleaning area to a cleaning robot without an in-built map provides a hand-held mobile device capturing a two-dimensional code label arranged on a top of a cleaning robot parked on a charging base, and obtaining a positional relationship between the mobile device and the cleaning robot through the captured image. The cleaning robot is controlled to enter a cleaning mode under the guidance of the mobile device. With captured images, a user can specify an area within the environment for cleaning, and through a touch display screen can control the cleaning robot to go to the specified cleaning area for cleaning. The mobile device and the cleaning robot employing the method are also disclosed.
    Type: Application
    Filed: March 17, 2023
    Publication date: July 20, 2023
    Inventors: YEN-HSIN LIN, HSI-CHEN TSAI
  • Publication number: 20230185513
    Abstract: The embodiments of the disclosure provide a method for operating a mirrored content under a mirror mode and a computer readable storage medium. The method includes: enabling a touch capturing function on the smart device, wherein the touch capturing function intercepts a touch event inputted to the smart device; in response to determining that a raw touch event is intercepted by the smart device, translating the raw touch event to a first touch event and sending the first touch event to a host, wherein a display screen of the smart device is mirrored to a visual content shown by the host, and the first touch event triggers the host to report a second touch event happened in the visual content; disabling the touch capturing function and receiving the second touch event from the host; and performing a first operation in response to the second touch event and enabling the touch capturing function on the smart device.
    Type: Application
    Filed: September 13, 2022
    Publication date: June 15, 2023
    Applicant: HTC Corporation
    Inventors: Ming-Te Liu, Po-Hung Chen, Kuo-Jung Chen, Hsing-Ju Chou, Shih-Hsi Chen, Chiming Ling