Patents by Inventor Hsi-Chi Lin

Hsi-Chi Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5967302
    Abstract: An improvement for dual inline package (DIP) switch includes a cover, a base and a plural number of actuators moveably housed in separated spaces formed between the cover and the base. Each actuator has a contact integrally formed thereunder by means of injection molding process. Each contact has two contact fingers extending at one side for making contact with two terminals located in the base to form an ON or OFF connection. The width and length of the actuator may be reduced up to 36% and 37% respectively vs. conventional DIP switch. The contact material may save up to 50% vs. a conventional DIP switch contact which extends to both sides of the switch. The foot of the actuator is integrally formed and therefore is more reliable and may function more smoothly.
    Type: Grant
    Filed: March 6, 1998
    Date of Patent: October 19, 1999
    Inventor: Hsi-Chi Lin