Abstract: An embodiment is a structure including a first package including a first die, and a molding compound at least laterally encapsulating the first die, a second package bonded to the first package with a first set of conductive connectors, the second package comprising a second die, and an underfill between the first package and the second package and surrounding the first set of conductive connectors, the underfill having a first portion extending up along a sidewall of the second package, the first portion having a first sidewall, the first sidewall having a curved portion and a planar portion.

Abstract: A method includes forming a first polymer layer to cover a metal pad of a wafer, and patterning the first polymer layer to form a first opening. A first sidewall of the first polymer layer exposed to the first opening has a first tilt angle where the first sidewall is in contact with the metal pad. The method further includes forming a metal pillar in the first opening, sawing the wafer to generate a device die, encapsulating the device die in an encapsulating material, performing a planarization to reveal the metal pillar, forming a second polymer layer over the encapsulating material and the device die, and patterning the second polymer layer to form a second opening. The metal pillar is exposed through the second opening. A second sidewall of the second polymer layer exposed to the second opening has a second tilt angle greater than the first tilt angle.

Abstract: A semiconductor structure includes a die, a molding surrounding the die, a first dielectric layer disposed over the die and the molding, and a second dielectric layer disposed between the first dielectric layer and the die, and between the first dielectric layer and the molding. A material content ratio in the first dielectric layer is substantially greater than that in the second dielectric layer. In some embodiments, the material content ratio substantially inversely affects a mechanical strength of the first dielectric layer and the second dielectric layer.

Abstract: A keyboard with a numbers of keys disposed on the base is capable of showing the three-dimensional characters. Each key includes a shell and a three-dimensional character embedded in the shell. Combined with an illuminant module positioned between the base and keys for providing the light source, the three-dimensional characters can be shown clearly and distinguishably by utilizing the color contrast relation with light between the light-colored transparent three-dimensional characters and dark-colored or opaque shells.

Abstract: A method for manufacturing a keypad, where the key of the keypad has a key body and a three-dimensional character; the manufacturing method utilizes the female mold corresponding to the key and the male mold having three-dimensional character. The light-colored transparent material is made for key body with reserved space for three-dimensional character. The female mold having the key body is then combined with the another male mode. The dark-colored material is injected into the reserved space of the key body to form the three-dimensional character in the key body. Applying the color contrast between the textures of the key body and three-dimensional character, it enables to display the three-dimensional character shown in the key body.

Abstract: A keyboard with a numbers of keys disposed on the base is capable of showing the three-dimensional characters. Each key includes a shell and a three-dimensional character embedded in the shell. Combined with an illuminant module positioned between the base and keys for providing the light source, the three-dimensional characters can be shown clearly and distinguishably by utilizing the color contrast relation with light between the light-colored transparent three-dimensional characters and dark-colored or opaque shells.