Abstract: A power chip package module and a manufacturing method thereof are provided. In the manufacturing method, a temporary carrier having an alignment pattern is provided, in which the temporary carrier includes a base and a peelable adhesive material disposed on the base. Thereafter, a circuit board having an accommodating space passing therethrough is disposed on the temporary carrier according to the alignment pattern. Furthermore, a chip is disposed in the accommodating space with an active surface thereof facing the temporary carrier according to the alignment pattern, in which the chip is fixed on the temporary carrier by the peelable adhesive material. The accommodating space is filled with a molding material to form an initial package structure. The initial package structure is separated from the temporary carrier, and then an electrically and thermally conductive layer is formed on a bottom surface of the chip and is in contact therewith.

Abstract: A power chip package module and a manufacturing method thereof are provided. In the manufacturing method, a temporary carrier having an alignment pattern is provided, in which the temporary carrier includes a base and a peelable adhesive material disposed on the base. Thereafter, a circuit board having an accommodating space passing therethrough is disposed on the temporary carrier according to the alignment pattern. Furthermore, a chip is disposed in the accommodating space with an active surface thereof facing the temporary carrier according to the alignment pattern, in which the chip is fixed on the temporary carrier by the peelable adhesive material. The accommodating space is filled with a molding material to form an initial package structure. The initial package structure is separated from the temporary carrier, and then an electrically and thermally conductive layer is formed on a bottom surface of the chip and is in contact therewith.

Abstract: Provided is an embedded substrate package structure, including, from top to bottom, a fourth dielectric layer, a second substrate, a chip with a fifth dielectric layer, a third dielectric layer, a second dielectric layer, a first substrate and a first dielectric layer; wherein the substrates are disposed respectively with wire layers and through holes, and each of dielectric layers is disposed with openings, conductive bumps or conductive pads, wire layers, through holes, and chip to collectively form electrical connection. The chip is electrically connected to the substrate in a flip-chip manner, and the back of the chip interfaces a dielectric layer. Compared to the prior art which chip bonding is in face-up mode, the packaging structure with the face-down chip of the present invention can simplify the manufacturing process by the flip-chip method.

Abstract: Provided is an embedded substrate package structure, including, from top to bottom, a fourth dielectric layer, a second substrate, a chip with a fifth dielectric layer, a third dielectric layer, a second dielectric layer, a first substrate and a first dielectric layer; wherein the substrates are disposed respectively with wire layers and through holes, and each of dielectric layers is disposed with openings, conductive bumps or conductive pads, wire layers, through holes, and chip to collectively form electrical connection. The chip is electrically connected to the substrate in a flip-chip manner, and the back of the chip interfaces a dielectric layer. Compared to the prior art which chip bonding is in face-up mode, the packaging structure with the face-down chip of the present invention can simplify the manufacturing process by the flip-chip method.

Abstract: Provided is a planar package structure and its manufacturing method. The planar package structure totally packages a die to make the die unexposed and to protect the die from impact or scratch. Further, at least one conductive pad of the die is electronically connected to an external electronic circuit through a plurality of wiring patterns and through holes filled with conductive materials. Then, the die may be connected to the external electronic circuit and may be protected from impact or scratch.

Abstract: The present invention provides a structure for integrating microfluidic devices and electrical biosensors, including: a substrate for carrying an electrical biosensor; a microfluidic channel layer for providing at least a fluid to flow; a cover member for the inflow and outflow of the at least a fluid, and an electrical biosensor, having a biosensing layer and mounted to the cover member in a flip-chip manner; wherein the fluid flows into an inlet, passes the electrical biosensor for sensing and flows out through a fluid outlet.

Abstract: The present invention provides a structure for integrating microfluidic devices and optical biosensors, including: a holder member for carrying and receiving an optical biosensor; microfluidic channel layer for providing at least a fluid to flow; and a cover member for the inflow and outflow of the at least a fluid, the at least a fluid flowing from an inlet, passing the optical biosensor by at least a fluid channel for sensing, and then flowing out through at least one fluid outlet. As such, the integrating structure of the present invention can detect the optical signal produced by the optical biosensor, transport fluid, and avoid leakage, and is applicable to the integration of various forms of optical biosensors and microfluidic devices.

Abstract: A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.

Abstract: A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.