Abstract: A light emitting diode includes a casing, a frame in the casing, one or a plurality of light emitting chip, and a packaging polymer; the frame being provided 5 with a placement area to receive placement of the light emitting chip, and an electrode area separated from the placement area; a sectional fall being disposed at where appropriately on the placement area to increase contact area between the frame and the casing and improve the relative stability between the casing and the frame.

Abstract: An inspection machine capable of inspecting optical property and electrical property of a light emitting device is provided. The inspection machine includes a substrate table, a probe mechanism, a heating apparatus, a cooling apparatus, an image-sensing apparatus, a temperature-sensing apparatus and a moving mechanism. The probe mechanism is capable of moving toward the light emitting device to contact therewith. The heating apparatus is capable of heating the light emitting device within a first temperature range. The cooling apparatus is capable of cooling the light emitting device within a second temperature range. The image-sensing apparatus senses a light emitting image provided from the light emitting device. The temperature-sensing apparatus senses the present temperature of the light emitting device. The image-sensing apparatus is disposed on the moving mechanism. The moving mechanism is capable of moving the image-sensing apparatus.

Abstract: An inspection machine capable of inspecting optical property and electrical property of a light emitting device is provided. The inspection machine includes a substrate table, a probe mechanism, a heating apparatus, a cooling apparatus, an image-sensing apparatus, a temperature-sensing apparatus and a moving mechanism. The probe mechanism is capable of moving toward the light emitting device to contact therewith. The heating apparatus is capable of heating the light emitting device within a first temperature range. The cooling apparatus is capable of cooling the light emitting device within a second temperature range. The image-sensing apparatus senses a light emitting image provided from the light emitting device. The temperature-sensing apparatus senses the present temperature of the light emitting device. The image-sensing apparatus is disposed on the moving mechanism. The moving mechanism is capable of moving the image-sensing apparatus.

Abstract: An SMD diode holding structure includes a plastic housing and a plurality of metal holders. Two ends of the plastic housing from a function area and a notch. The metal holder has a base portion and a connecting pin portion. The top and bottom surfaces of the base portion are exposed to the function area and the notch. The top surface of one base portion in the function area is connected with an LED chip, and the bottom surface of another base portion in the notch is connected with the anti-ESD chip. The LED chip, the anti-ESD chip, and the base portion are connected with a conductive wire. The function area is covered with a first sealing compound, and the notch is covered with a second sealing compound. Light emitted from the LED chip is uniformly reflected in the function area, and the brightness is uniform.

Abstract: A light emitting diode includes a casing, a frame in the casing, one or a plurality of light emitting chip, and a packaging polymer; the frame being provided 5 with a placement area to receive placement of the light emitting chip, and an electrode area separated from the placement area; a sectional fall being disposed at where appropriately on the placement area to increase contact area between the frame and the casing and improve the relative stability between the casing and the frame.

Abstract: A light emitting diode includes a casing, a frame in the casing, one or a plurality of light emitting chip, and a packaging polymer; the frame being provided with a placement area to receive placement of the light emitting chip, and an electrode area separated from the placement area; a sectional fall being disposed at where appropriately on the placement area to increase contact area between the frame and the casing and improve the relative stability between the casing and the frame.

Abstract: A wavelength converting material including a wavelength converting activator and a scatter is provided. The wavelength converting activator is suitable for being activated by a light with a wavelength ?1, so as to emit a light with a wavelength ?2. The scatter is disposed on the wavelength converting activator. The scatter is suitable for scattering a first light and a second light irradiated to a surface thereof. As a result of that the scatters on the wavelength converting activators increases the gap of two wavelength converting activators adjacent to each other, the wavelength converting activators could be sufficiently activated for emitting a light with wavelength ?2 while the wavelength converting materials are irradiated by the light with ?1. Therefore, the brightness of a light emitting diode with the wavelength converting material is enhanced.

Abstract: An SMD diode holding structure includes a plastic and a plurality of metal holders. Two ends of the plastic from a function area and a notch. The metal holder has a base portion and a connecting pin portion. The top and bottom surfaces of the base portion are exposed to the function area and the notch. The top surface of one base portion in the function area is connected with an LED chip, and the bottom surface of another base portion in the notch is connected with the anti-ESD chip. The LED chip, the anti-ESD chip, and the base portion are connected with a conductive wire. The function area is covered with a first sealing compound, and the notch is covered with a second sealing compound. Light emitted from the LED chip is uniformly reflected in the function area, and the brightness is uniform.

Abstract: A high-powered diode holder and a package thereof are disclosed. The high-powered diode holder includes a base and a plurality of metal electrodes. The base is made of ceramic. In the interior part of one end of the base, there is a functional area that is indented inwards. In the functional area, there are a plurality of through-hole units and a plurality of conducting areas whose polarities are different. The second end of the base is connected with a heat-conducting base. The metal electrodes are individually connected with the base, and the metal electrodes are electrically connected with the corresponding conducting areas respectively. In the functional area, there are a plurality of LED chips that correspond to the through-hole units respectively. The LED chips and the conducting areas are connected with conducting-wires respectively, and a package resin element covers the functional areas of the base.

Abstract: An SMD diode holding structure includes a plastic housing and a plurality of metal holders. Two ends of the plastic housing from a function area and a notch. The metal holder has a base portion and a connecting pin portion. The top and bottom surfaces of the base portion are exposed to the function area and the notch. The top surface of one base portion in the function area is connected with an LED chip, and the bottom surface of another base portion in the notch is connected with the anti-ESD chip. The LED chip, the anti-ESD chip, and the base portion are connected with a conductive wire. The function area is covered with a first sealing compound, and the notch is covered with a second sealing compound. Light emitted from the LED chip is uniformly reflected in the function area, and the brightness is uniform.

Abstract: An LED package structure including a carrier, an LED chip, an encapsulant and a PL material is provided, wherein the LED chip is disposed on the carrier for emitting light. The encapsulant encapsulates the LED chip. The PL material is distributed in the encapsulant. The PL material is suitable for being excited by the light emitted from the LED chip and scattering the light. Moreover, the present invention provides a novel PL material with a molecular formula of WmMon(Y,Ce,Tb,Gd,Sc)3+t+u(Al,Ga,Tl,In,B)5+u+2v(O,S,Se)12+2t+3u+3v+3m+3n: Ce3+, Tb3+, wherein 0<t<5 and 0<m, n, u, v<15.

Abstract: An LED package structure including a carrier, an LED chip, an encapsulant and a PL material is provided, wherein the LED chip is disposed on the carrier for emitting light. The encapsulant encapsulates the LED chip. The PL material is distributed in the encapsulant. The PL material is suitable for being excited by the light emitted from the LED chip and scattering the light. Moreover, the present invention provides a novel PL material with a molecular formula of WmMon(Y,Ce,Tb,Gd,Sb)3+t+u(Al,Ga,Tl,In,B)5+u+2v(O,S,Se)12+2t+3u+3v+3m+3n:Ce3+,Tb3+, wherein 0<t<5 and 0<m, n, u, v<15.

Abstract: A light emitting diode includes a casing, a frame in the casing, one or a plurality of light emitting chip, and a packaging polymer; the frame being provided with a placement area to receive placement of the light emitting chip, and an electrode area separated from the placement area; a sectional fall being disposed at where appropriately on the placement area to increase contact area between the frame and the casing and improve the relative stability between the casing and the frame.

Abstract: A high-powered diode holder and a package thereof are disclosed. The high-powered diode holder includes a base and a plurality of metal electrodes. The base is made of ceramic. In the interior part of one end of the base, there is a functional area that is indented inwards. In the functional area, there are a plurality of through-hole units and a plurality of conducting areas whose polarities are different. The second end of the base is connected with a heat-conducting base. The metal electrodes are individually connected with the base, and the metal electrodes are electrically connected with the corresponding conducting areas respectively. In the functional area, there are a plurality of LED chips that correspond to the through-hole units respectively. The LED chips and the conducting areas are connected with conducting-wires respectively, and a package resin element covers the functional areas of the base.

Abstract: An SMD diode holding structure includes a plastic and a plurality of metal holders. Two ends of the plastic from a function area and a notch. The metal holder has a base portion and a connecting pin portion. The top and bottom surfaces of the base portion are exposed to the function area and the notch. The top surface of one base portion in the function area is connected with an LED chip, and the bottom surface of another base portion in the notch is connected with the anti-ESD chip. The LED chip, the anti-ESD chip, and the base portion are connected with a conductive wire. The function area is covered with a first sealing compound, and the notch is covered with a second sealing compound. Light emitted from the LED chip is uniformly reflected in the function area, and the brightness is uniform.

Abstract: A wavelength converting material including a wavelength converting activator and a scatter is provided. The wavelength converting activator is suitable for being activated by a light with a wavelength ?1, so as to emit a light with a wavelength ?2. The scatter is disposed on the wavelength converting activator. The scatter is suitable for scattering a first light and a second light irradiated to a surface thereof. As a result of that the scatters on the wavelength converting activators increases the gap of two wavelength converting activators adjacent to each other, the wavelength converting activators could be sufficiently activated for emitting a light with wavelength ?2 while the wavelength converting materials are irradiated by the light with ?1. Therefore, the brightness of a light emitting diode with the wavelength converting material is enhanced.

Abstract: A package allowing agile deployment of the location of each LED chip includes a heat slug to secure multiple LED chips, two lead frames, a conducting area extending along the edge of the heat slug, and a non-conductive material that connects the heat slug and the lead frame for those multiple LED chips to connect to the conducting area by means of a gold wire without being subject to the presence of the lead frame.

Abstract: A programmable photo power source includes a light emitting assembly containing at least two irradiation panels foldable to each other and each comprised of multiple surface-mounted LEDs; a base to secure the assembly; and a control panel to control operation time, hours and current of each surface-mounted LED to produce better irradiation results with preset wavelength programmable through the control panel.

Abstract: An LED package structure including a carrier, an LED chip, an encapsulant and a PL material is provided, wherein the LED chip is disposed on the carrier for emitting light. The encapsulant encapsulates the LED chip. The PL material is distributed in the encapsulant. The PL material is suitable for being excited by the light emitted from the LED chip and scattering the light. Moreover, the present invention provides a novel PL material with a molecular formula of WmMon(Y,Ce,Tb,Gd,Sc)3+t+u(Al,Ga,Tl,In,B)5+u+2v(O,S,Se)12+2t+3u+3v+3m+3n: Ce3+, Tb3+, wherein 0<t<5 and 0<m, n, u, v<15.