Patents by Inventor Hsiang-Chung HSU

Hsiang-Chung HSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11588010
    Abstract: A capacitor structure includes a first metal structure, a second metal structure, and a dielectric material. The second metal structure is disposed below the first metal structure. Each of the first metal structure and the second metal structure includes at least three conductive components. The conductive components have a fish-bone shape. The dielectric material is disposed in a plurality of isolators of the first metal structure, in a plurality of isolators of the second metal structure, and between the first metal structure and the second metal structure.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: February 21, 2023
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Hsiao-Tsung Yen, Hsiang-Chung Hsu, Han-Chang Kang, Ka-Un Chan
  • Publication number: 20210091173
    Abstract: A capacitor structure includes a first metal structure, a second metal structure, and a dielectric material. The second metal structure is disposed below the first metal structure. Each of the first metal structure and the second metal structure includes at least three conductive components. The conductive components have a fish-bone shape. The dielectric material is disposed in a plurality of isolators of the first metal structure, in a plurality of isolators of the second metal structure, and between the first metal structure and the second metal structure.
    Type: Application
    Filed: March 26, 2020
    Publication date: March 25, 2021
    Inventors: Hsiao-Tsung YEN, Hsiang-Chung HSU, Han-Chang KANG, Ka-Un CHAN