Patents by Inventor Hsiang-Fen CHOU
Hsiang-Fen CHOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230272980Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.Type: ApplicationFiled: May 5, 2023Publication date: August 31, 2023Applicant: COOLER MASTER CO., LTD.Inventors: Chi-Chuan WANG, Chang-Yu HSIEH, Shan-Yin CHENG, Hsiang-Fen CHOU
-
Patent number: 11732981Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.Type: GrantFiled: June 7, 2022Date of Patent: August 22, 2023Assignee: COOLER MASTER CO., LTD.Inventors: Chia-Yu Lin, Chang-Yu Hsieh, Shan-Yin Cheng, Hsiang-Fen Chou
-
Patent number: 11686532Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.Type: GrantFiled: December 4, 2020Date of Patent: June 27, 2023Assignee: COOLER MASTER CO., LTD.Inventors: Chi-Chuan Wang, Chang-Yu Hsieh, Shan-Yin Cheng, Hsiang-Fen Chou
-
Publication number: 20220299277Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.Type: ApplicationFiled: June 7, 2022Publication date: September 22, 2022Applicant: COOLER MASTER CO., LTD.Inventors: Chia-Yu LIN, Chang-Yu HSIEH, Shan-Yin CHENG, Hsiang-Fen CHOU
-
Patent number: 11384999Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.Type: GrantFiled: March 17, 2020Date of Patent: July 12, 2022Assignee: COOLER MASTER CO., LTD.Inventors: Chia-Yu Lin, Chang-Yu Hsieh, Shan-Yin Cheng, Hsiang-Fen Chou
-
Publication number: 20210088288Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.Type: ApplicationFiled: December 4, 2020Publication date: March 25, 2021Applicant: COOLER MASTER CO., LTD.Inventors: Chi-Chuan WANG, Chang-Yu HSIEH, Shan-Yin CHENG, Hsiang-Fen CHOU
-
Patent number: 10907907Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.Type: GrantFiled: March 14, 2018Date of Patent: February 2, 2021Assignee: COOLER MASTER CO., LTD.Inventors: Chi-Chuan Wang, Chang-Yu Hsieh, Shan-Yin Cheng, Hsiang-Fen Chou
-
Publication number: 20200378698Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.Type: ApplicationFiled: March 17, 2020Publication date: December 3, 2020Applicant: COOLER MASTER CO., LTD.Inventors: Chia-Yu LIN, Chang-Yu HSIEH, Shan-Yin CHENG, Hsiang-Fen CHOU
-
Publication number: 20190195567Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.Type: ApplicationFiled: March 14, 2018Publication date: June 27, 2019Applicant: COOLER MASTER CO.,LTD.Inventors: Chi-Chuan WANG, Chang-Yu HSIEH, Shan-Yin CHENG, Hsiang-Fen CHOU